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公开(公告)号：US08536890B2
公开(公告)日：2013-09-17
申请号：US12865201
申请日：2009-02-05
IPC分类号： G01R31/20
CPC分类号： G01R31/303 , G01R31/2889 , G01R31/3025
摘要： A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer.
摘要翻译： 半导体检查装置包括用于向其中形成有一个或多个对象芯片的半导体晶片发送信号或电源的探针卡，并且构成为使得第一半导体晶片面向探针卡的第一面，并且使得第二半导体 晶片面对第一面的相对侧的探针卡的第二面。 探针卡包括一个或多个检查芯片，其可以执行与第一半导体晶片中的第一对象芯片和第二半导体晶片中的第二对象芯片的非接触传输。
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2.发明授权Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection method 失效半导体检查装置，半导体晶片定位方法以及半导体晶片检查方法公开(公告)号：US08570056B2
公开(公告)日：2013-10-29
申请号：US12866223
申请日：2009-02-26
CPC分类号： G01R31/2891
摘要： A semiconductor inspection apparatus comprising: a plurality of wafer stages, provided independently for each of a plurality of laminated semiconductor wafers, that directly or indirectly secure the corresponding semiconductor wafers and that possess a mechanism for positioning the corresponding semiconductor wafers; and a probe card, arranged outside or in between the plurality of laminated semiconductor wafers so as to face the semiconductor wafers, that transmits a signal or power to the plurality of semiconductor wafers.
摘要翻译： 一种半导体检查装置，包括：对于多个层叠半导体晶片中的每一个独立设置的多个晶片台，其直接或间接固定相应的半导体晶片，并且具有用于定位相应的半导体晶片的机构; 以及探针卡，其布置在多个层叠半导体晶片之间或之间，以面对半导体晶片，其向多个半导体晶片发送信号或电力。
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公开(公告)号：US20100321054A1
公开(公告)日：2010-12-23
申请号：US12865201
申请日：2009-02-05
CPC分类号： G01R31/303 , G01R31/2889 , G01R31/3025
摘要： A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer.
摘要翻译： 半导体检查装置包括用于向其中形成有一个或多个对象芯片的半导体晶片发送信号或电源的探针卡，并且构成为使得第一半导体晶片面向探针卡的第一面，并且使得第二半导体 晶片面对第一面的相对侧的探针卡的第二面。 探针卡包括一个或多个检查芯片，其可以执行与第一半导体晶片中的第一对象芯片和第二半导体晶片中的第二对象芯片的非接触传输。
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公开(公告)号：US08399960B2
公开(公告)日：2013-03-19
申请号：US12920381
申请日：2009-02-20
IPC分类号： H01L27/08
CPC分类号： H01L27/0688 , H01L23/48 , H01L23/5227 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/05553 , H01L2224/48091 , H01L2224/49113 , H01L2225/06527 , H01L2924/00014 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of semiconductor chips are juxtaposed, each having an electromagnetic induction coil disposed thereon. A signal is transmitted by way of electromagnetic induction between the electromagnetic induction coils disposed on a pair of adjacent semiconductor chips.
摘要翻译： 多个半导体芯片并置，每个具有布置在其上的电磁感应线圈。 在布置在一对相邻半导体芯片上的电磁感应线圈之间通过电磁感应传输信号。
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公开(公告)号：US20110006443A1
公开(公告)日：2011-01-13
申请号：US12920452
申请日：2009-02-19
IPC分类号： H01L23/48
CPC分类号： H01L23/645 , H01L23/5227 , H01L23/585 , H01L25/0655 , H01L25/0657 , H01L27/08 , H01L2224/16145 , H01L2225/06527 , H01L2225/06596
摘要： Disclosed is a semiconductor device composed of a plurality of semiconductor integrated circuits and a plurality of coils. During the production process of the semiconductor device, the plurality of coils are so arranged that the coil surfaces are generally perpendicular to the front surface of a chip of the semiconductor integrated circuits wherein metal films are laminated. A signal is transmitted between a pair of adjacent coils among the plurality of coils.
摘要翻译： 公开了由多个半导体集成电路和多个线圈组成的半导体器件。 在半导体器件的生产过程中，多个线圈被布置成使得线圈表面大致垂直于半导体集成电路的芯片的前表面，其中金属膜被层压。 信号在多个线圈中的一对相邻线圈之间传输。
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公开(公告)号：US20110260747A1
公开(公告)日：2011-10-27
申请号：US13139609
申请日：2009-12-22
CPC分类号： G01R31/2884 , G01R31/3012
摘要： A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
摘要翻译： 半导体器件（1）包括其上形成有多个半导体芯片形成区域（1A）的半导体晶片（11），设置在所述半导体芯片形成区域（1A）的每一个内的电路部分（12） 半导体晶片（11），设置在每个半导体芯片形成区域（1A）内并连接到电路部分（12））的控制电路部分（14），其控制供应到电路部分（12）的电力， 连接到多个控制电路部分（14）的电源线（18）和连接到多个控制电路部分（14）的参考电力线（17）。 在每个控制电路部分（14）中，基于来自参考电力线（17）的参考电压来控制从电源线（18）供应的电力的电压。
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公开(公告)号：US08513970B2
公开(公告)日：2013-08-20
申请号：US13139609
申请日：2009-12-22
IPC分类号： G01R31/02
CPC分类号： G01R31/2884 , G01R31/3012
摘要： A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
摘要翻译： 半导体器件（1）包括其上形成有多个半导体芯片形成区域（1A）的半导体晶片（11），设置在所述半导体芯片形成区域（1A）的每一个内的电路部分（12） 半导体晶片（11），设置在每个半导体芯片形成区域（1A）内并连接到电路部分（12））的控制电路部分（14），其控制供应到电路部分（12）的电力， 连接到多个控制电路部分（14）的电源线（18）和连接到多个控制电路部分（14）的参考电力线（17）。 在每个控制电路部分（14）中，基于来自参考电力线（17）的参考电压来控制从电源线（18）供应的电力的电压。
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公开(公告)号：US20110012228A1
公开(公告)日：2011-01-20
申请号：US12920381
申请日：2009-02-20
IPC分类号： H01L29/86
CPC分类号： H01L27/0688 , H01L23/48 , H01L23/5227 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/05553 , H01L2224/48091 , H01L2224/49113 , H01L2225/06527 , H01L2924/00014 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of semiconductor chips are juxtaposed, each having an electromagnetic induction coil disposed thereon. A signal is transmitted by way of electromagnetic induction between the electromagnetic induction coils disposed on a pair of adjacent semiconductor chips.
摘要翻译： 多个半导体芯片并置，每个具有布置在其上的电磁感应线圈。 在布置在一对相邻半导体芯片上的电磁感应线圈之间通过电磁感应传输信号。
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9.发明授权公开(公告)号：US08441277B2
公开(公告)日：2013-05-14
申请号：US12810877
申请日：2008-12-16
申请人： Koichiro Noguchi , Yoshio Kameda , Koichi Nose , Masayuki Mizuno , Toshinobu Ono
发明人： Koichiro Noguchi , Yoshio Kameda , Koichi Nose , Masayuki Mizuno , Toshinobu Ono
IPC分类号： G01R31/26
CPC分类号： G01R31/31908
摘要： A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (1a-1c) include: flip-flops (11) each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops (11) selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unit 12 that holds a set value and that provides the set value to first input terminal SI.
摘要翻译： 提供了能够实现高速延迟测试的半导体测试装置，半导体器件和测试方法。 半导体测试装置（1a-1c）包括：各自配置有第一输入端子SI的触发器（11），第二输入端子D，接受指示第一模式或第二模式的模式信号的模式端子SE，时钟端子CK 接收时钟信号和输出端子Q，当模式信号指示第一模式时，触发器（11）选择第一输入端子SI，当模式信号指示第二模式时选择第二输入端子D，并且保持信息为 由与输入端Q同步地基于模式信号选择的输入端接收，并从输出端Q输出; 并且保持单元12保持设定值，并将设定值提供给第一输入端子SI。
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10.发明申请公开(公告)号：US20100283497A1
公开(公告)日：2010-11-11
申请号：US12810877
申请日：2008-12-16
申请人： Koichiro Noguchi , Yoshio Kameda , Koichi Nose , Masayuki Mizuno , Toshinobu Ono
发明人： Koichiro Noguchi , Yoshio Kameda , Koichi Nose , Masayuki Mizuno , Toshinobu Ono
IPC分类号： G01R31/26
CPC分类号： G01R31/31908
摘要： A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (1a-1c) include: flip-flops (11) each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops (11) selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unit 12 that holds a set value and that provides the set value to first input terminal SI.
摘要翻译： 提供了能够实现高速延迟测试的半导体测试装置，半导体器件和测试方法。 半导体测试装置（1a-1c）包括：各自配置有第一输入端子SI的触发器（11），第二输入端子D，接受指示第一模式或第二模式的模式信号的模式端子SE，时钟端子CK 接收时钟信号和输出端子Q，当模式信号指示第一模式时，触发器（11）选择第一输入端子SI，当模式信号指示第二模式时选择第二输入端子D，并且保持信息为 由与输入端Q同步地基于模式信号选择的输入端接收，并从输出端Q输出; 并且保持单元12保持设定值，并将设定值提供给第一输入端子SI。
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