公开(公告)号：US07770500B2

公开(公告)日：2010-08-10

申请号：US10598878

申请日：2005-03-14

申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Ohnari ,  Kazuhiro Yoshimoto

发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Ohnari ,  Kazuhiro Yoshimoto

IPC分类号： B26D3/08 ,  B26D5/04 ,  B26F3/00

CPC分类号： B28D1/047 ,  B27B5/063 ,  B28D5/024 ,  B65G49/064 ,  B65G49/065 ,  B65G49/067 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/027 ,  C03B33/03 ,  C03B2225/02 ,  Y10T83/0333 ,  Y10T83/0356 ,  Y10T83/4617 ,  Y10T83/6606 ,  Y10T225/12 ,  Y10T225/321 ,  Y10T225/336 ,  Y10T225/357

摘要： A substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate is disclosed. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50.

摘要翻译： 公开了一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。 一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板 以及由夹持装置50夹紧的母基板的底面。

公开(公告)号：US20070281444A1

公开(公告)日：2007-12-06

申请号：US10598878

申请日：2005-03-14

申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Ohnari ,  Kazuhiro Yoshimoto

发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Ohnari ,  Kazuhiro Yoshimoto

IPC分类号： H01L21/78 ,  B26F3/00

CPC分类号： B28D1/047 ,  B27B5/063 ,  B28D5/024 ,  B65G49/064 ,  B65G49/065 ,  B65G49/067 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/027 ,  C03B33/03 ,  C03B2225/02 ,  Y10T83/0333 ,  Y10T83/0356 ,  Y10T83/4617 ,  Y10T83/6606 ,  Y10T225/12 ,  Y10T225/321 ,  Y10T225/336 ,  Y10T225/357

摘要： The objective of the present invention is to provide a substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting system. The clamp devices can hold at least one part of a side edge of the mother substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and reciprocate along one side of the mounting base 10 in a hollow rectangular parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50. When the clamp devices 50 holding the mother substrate are moved, a substrate supporting device supports the mother substrate without rubbing against the mother substrate.

摘要翻译： 本发明的目的是提供一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。 夹持装置50附接到基板切割系统。 夹持装置可以将母体基板的侧边缘的至少一部分保持在安装基座10中，该中心长方体平行六面体并沿着安装基座10的一侧在中空的长方体内往复运动。 一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板 以及由夹持装置50夹紧的母基板的底面。 当保持母基板的夹持装置50移动时，基板支撑装置不会摩擦母体基板而支撑母基板。

公开(公告)号：US07426883B2

公开(公告)日：2008-09-23

申请号：US10535871

申请日：2003-09-24

申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

IPC分类号： B28D5/04 ,  B26D3/08

CPC分类号： B65G49/064 ,  B28D1/226 ,  B28D5/0082 ,  B65G49/061 ,  B65G49/067 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/027 ,  C03B33/03 ,  C03B33/09 ,  Y10T83/0304 ,  Y10T83/0341 ,  Y10T83/0378 ,  Y10T83/4617 ,  Y10T83/6606 ,  Y10T225/321

摘要： A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).

摘要翻译： 夹持装置（50）安装在具有中空长方体形状的支架（10）上，使得在支架（10）中运送的母板的侧边缘部分的至少一个位置被夹紧。 在划线装置引导体（30）上设置有用于切割母基板的一对基板切割装置，其由夹紧装置（50）从其上表面和下表面夹紧。 划线装置引导体30可沿中空长方体的一侧往复运动。 一对基板切断装置安装成能够沿着与划线装置引导体（30）的移动方向垂直的方向移动。 由夹持装置夹持的母体衬底由衬底支撑装置（20）支撑。

公开(公告)号：US20060137504A1

公开(公告)日：2006-06-29

申请号：US10535871

申请日：2003-09-24

申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

IPC分类号： B28D5/00 ,  C03B33/03 ,  C03B33/023

CPC分类号： B65G49/064 ,  B28D1/226 ,  B28D5/0082 ,  B65G49/061 ,  B65G49/067 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/027 ,  C03B33/03 ,  C03B33/09 ,  Y10T83/0304 ,  Y10T83/0341 ,  Y10T83/0378 ,  Y10T83/4617 ,  Y10T83/6606 ,  Y10T225/321

摘要： A clamping device (50) is installed on a stand (10) with a hollow rectangular parallelepiped shape such that at least one place at a side edge portion of a mother board transported in the stand (10) is clamped. A pair of substrate-cutting devices for cutting the mother substrate, clamped by the clamping device (50), from its upper face and lower face is provided on a scribing device guide body (30). The scribing device guide body (30) is reciprocally movable along one side of the hollow rectangular parallelepiped. The pair of substrate-cutting devices is installed so as to be movable along the direction perpendicular to the movement direction of the scribing device guide body (30). The mother substrate clamped by the clamping device is supported by a substrate-supporting device (20).

摘要翻译： 夹持装置（50）安装在具有中空长方体形状的支架（10）上，使得在支架（10）中运送的母板的侧边缘部分的至少一个位置被夹紧。 在划线装置引导体（30）上设置有用于切割母基板的一对基板切割装置，其由夹紧装置（50）从其上表面和下表面夹紧。 划线装置引导体30可沿中空长方体的一侧往复运动。 一对基板切断装置安装成能够沿着与划线装置引导体（30）的移动方向垂直的方向移动。 由夹持装置夹持的母体衬底由衬底支撑装置（20）支撑。

公开(公告)号：US20070214925A1

公开(公告)日：2007-09-20

申请号：US10595201

申请日：2004-09-24

申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

IPC分类号： B26D7/06 ,  B26D5/08 ,  B26D9/00

CPC分类号： C03B33/027 ,  B28D1/226 ,  B28D5/0011 ,  B28D5/0094 ,  B28D7/046 ,  B65G49/061 ,  B65G49/065 ,  B65G49/067 ,  B65G49/068 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/03 ,  C03B33/033 ,  C03B2225/02 ,  Y10T83/647 ,  Y10T83/6667 ,  Y10T83/819 ,  Y10T83/8742

摘要： The objective of the present invention is to make an entire system compact and provide a substrate cutting system capable of efficiently cutting a variety of substrates. A substrate cutting system according to the present invention includes: pair of scribing line forming means arranged facing each other; pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction; a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction; and a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.

摘要翻译： 本发明的目的是使整个系统紧凑并且提供能够有效地切割各种基板的基板切割系统。 根据本发明的基板切割系统包括：相对布置的一对划线生成装置; 一对划线装置，用于支撑一对划线成形线装置，使得一对划线形成线装置中的一个在X轴方向上在基板的第一表面上移动，并且一对划线形成装置中的另一个在一个 X轴方向上的基板的第二表面; 划线装置引导体，用于支撑所述一对划线装置，使得所述一对划线装置沿Y轴方向移动; 以及用于将基板支撑在X-Y平面中的基板支撑装置，使得一对划线形成线装置划刻基板的第一表面和基板的第二表面。

公开(公告)号：US07432114B2

公开(公告)日：2008-10-07

申请号：US11515994

申请日：2006-09-06

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Yoshiaki Shinjo ,  Masataka Mizukoshi

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Yoshiaki Shinjo ,  Masataka Mizukoshi

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/90 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68322 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2223/54426 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05578 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/10165 ,  H01L2224/1147 ,  H01L2224/13028 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75743 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83856 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： To provide a low-cost, efficient semiconductor device manufacturing method for connecting electrodes of a pair of bases (e.g., a pair of a semiconductor chip and a circuit board, or a pair of semiconductor chips) together in a short time. The method of the present invention includes: forming magnetic bumps 34 on at least one of first and second bases 10A and 40 to be bonded together at their corresponding electrodes (e.g., electrodes 15 and electrodes 41); aligning the electrodes 15 of the first base 10A to positions corresponding to the electrodes 41 of the second base 40 for connection, by means of magnetic forces of the magnetic bumps 34 formed over the first base 10A; and connecting the electrodes 15 of the first base 10A to the electrodes 41 of the second base 40, wherein the alignment is made for a plurality of the first bases 10A at a time.

摘要翻译： 为了提供一种用于在短时间内将一对基极（例如，一对半导体芯片和电路板或一对半导体芯片）的电极连接在一起的低成本，高效的半导体器件制造方法。 本发明的方法包括：在第一和第二基底10A和40中的至少一个上形成磁性凸块34，以在其相应的电极（例如电极15和电极41）处接合在一起; 通过形成在第一基座10A上的磁性凸块34的磁力将第一基座10A的电极15对准到与第二基座40的电极41相对应的连接位置; 并且将第一基座10A的电极15连接到第二基座40的电极41，其中一次对多个第一基座10A进行对准。

公开(公告)号：US20070196954A1

公开(公告)日：2007-08-23

申请号：US11437606

申请日：2006-05-22

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Yoshiaki Shinjo

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Yoshiaki Shinjo

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L23/3128 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A manufacturing method of a semiconductor device, includes i) a step of providing a transparent member above a main surface of a semiconductor substrate where a plurality of semiconductor elements is formed; ii) a first dividing step of dividing the transparent member corresponding to a designated area of the semiconductor element; iii) a second dividing step of dividing the transparent member corresponding to an external configuration of the semiconductor element; and iv) a dividing step of dividing the semiconductor substrate into the semiconductor elements corresponding to a dividing position of the transparent member.

摘要翻译： 半导体器件的制造方法包括：i）在形成有多个半导体元件的半导体衬底的主表面上方设置透明构件的步骤; ii）分割对应于半导体元件的指定区域的透明构件的第一分割步骤; iii）分隔与半导体元件的外部结构相对应的透明构件的第二分割步骤; 以及iv）分割步骤，将半导体衬底分成对应于透明构件的分割位置的半导体元件。

公开(公告)号：US20050221589A1

公开(公告)日：2005-10-06

申请号：US11075758

申请日：2005-03-10

申请人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

发明人： Kazuo Teshirogi ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Mitsuhisa Watanabe ,  Yoshiaki Shinjo ,  Eiji Yoshida ,  Noboru Hayasaka

IPC分类号： H01L21/68 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  B24B37/042 ,  B32B37/003 ,  B32B37/1018 ,  B32B38/0012 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L21/304 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  Y10T29/5313 ,  Y10T29/53191 ,  Y10T428/1452 ,  H01L2924/3512 ,  H01L2924/00

摘要： The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

公开(公告)号：US08795619B2

公开(公告)日：2014-08-05

申请号：US12599057

申请日：2008-05-08

申请人： Tadashi Suzuki ,  Satoru Kato ,  Naoki Takahashi ,  Takaaki Kanazawa ,  Masanori Yamato ,  Kazuhiro Yoshimoto ,  Michihiko Takeuchi ,  Yuuji Matsuhisa

发明人： Tadashi Suzuki ,  Satoru Kato ,  Naoki Takahashi ,  Takaaki Kanazawa ,  Masanori Yamato ,  Kazuhiro Yoshimoto ,  Michihiko Takeuchi ,  Yuuji Matsuhisa

IPC分类号： B01D50/00 ,  B01D53/34 ,  B01D53/04 ,  B01D53/56 ,  C01B17/16 ,  C01B31/20 ,  B01J27/00 ,  B01J27/185 ,  B01J21/00 ,  B01J21/04 ,  B01J25/00 ,  B01J23/00 ,  B01J23/02 ,  B01J23/04 ,  B01J23/08 ,  B01J23/40 ,  B01J23/42 ,  B01J23/44 ,  B01J23/56 ,  B01J23/58 ,  B01J20/00

CPC分类号： B01D53/9445 ,  B01D2255/20707 ,  B01D2255/20738 ,  B01D2255/20769 ,  B01D2255/20776 ,  B01D2255/9207 ,  B01D2257/304 ,  B01D2257/404 ,  B01D2257/502 ,  B01D2257/702 ,  B01J21/04 ,  B01J23/40 ,  B01J23/42 ,  B01J23/58 ,  B01J23/63 ,  B01J23/6525 ,  B01J23/6527 ,  B01J23/8906 ,  B01J35/002 ,  B01J35/04 ,  B01J35/1009 ,  B01J35/1014 ,  B01J35/1019 ,  B01J37/0205 ,  B01J37/0207 ,  B01J37/0242 ,  B01J37/08 ,  B01J37/28 ,  F01N2570/24 ,  Y02T10/22

摘要： A catalyst for purification of exhaust gas, in which a noble metal is supported on a metal oxide support, has a basic site content of 1 mmol/L-cat or less, as determined on the basis of an amount of CO2 desorbed per liter of the catalyst as measured by a CO2 temperature-programmed desorption method.

摘要翻译： 用于净化贵金属负载在金属氧化物载体上的废气的催化剂的碱性位置含量为1mmol / L-cat以下，其基于每升脱附的二氧化碳的量 催化剂通过CO 2温度程序解吸法测量。

公开(公告)号：US20110048615A1

公开(公告)日：2011-03-03

申请号：US12874659

申请日：2010-09-02

申请人： Hironori Fukaya ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Kazuo Teshirogi ,  Kazuyuki Uragou ,  Mika Sakamoto ,  Masaya Tazawa

发明人： Hironori Fukaya ,  Yuzo Shimobeppu ,  Kazuhiro Yoshimoto ,  Kazuo Teshirogi ,  Kazuyuki Uragou ,  Mika Sakamoto ,  Masaya Tazawa

IPC分类号： B32B38/10 ,  B32B38/00 ,  B32B3/30

CPC分类号： H01L21/6836 ,  H01L21/304 ,  H01L2221/6834 ,  Y10T428/24521 ,  Y10T428/2848

摘要： A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.

摘要翻译： 一种半导体器件的制造方法，其特征在于，将设置在基材膜上的中间层和设置在中间层上的粘合剂层的表面保护带的粘合层粘合到半导体基板的一个面上， 固化中间层，同时将平板压在表面保护带的基材膜上; 研磨半导体衬底的另一个表面; 固化粘合层; 并且将表面保护带与半导体衬底分离。