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    SUBSTRATE DICING SYSTEM, SUBSTRATE MANUFACTURING APPARATUS, AND SUBSTRATE DICING METHOD
    1.
    发明申请
    SUBSTRATE DICING SYSTEM, SUBSTRATE MANUFACTURING APPARATUS, AND SUBSTRATE DICING METHOD 审中-公开
    基板定位系统，基板制造装置和基板定位方法

    公开(公告)号：US20070214925A1

    公开(公告)日：2007-09-20

    申请号：US10595201

    申请日：2004-09-24

    申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

    发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Onari ,  Kazuhiro Yoshimoto

    IPC分类号： B26D7/06 ,  B26D5/08 ,  B26D9/00

    CPC分类号： C03B33/027 ,  B28D1/226 ,  B28D5/0011 ,  B28D5/0094 ,  B28D7/046 ,  B65G49/061 ,  B65G49/065 ,  B65G49/067 ,  B65G49/068 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/03 ,  C03B33/033 ,  C03B2225/02 ,  Y10T83/647 ,  Y10T83/6667 ,  Y10T83/819 ,  Y10T83/8742

    摘要： The objective of the present invention is to make an entire system compact and provide a substrate cutting system capable of efficiently cutting a variety of substrates. A substrate cutting system according to the present invention includes: pair of scribing line forming means arranged facing each other; pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction; a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction; and a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.

    摘要翻译： 本发明的目的是使整个系统紧凑并且提供能够有效地切割各种基板的基板切割系统。 根据本发明的基板切割系统包括：相对布置的一对划线生成装置; 一对划线装置，用于支撑一对划线成形线装置，使得一对划线形成线装置中的一个在X轴方向上在基板的第一表面上移动，并且一对划线形成装置中的另一个在一个 X轴方向上的基板的第二表面; 划线装置引导体，用于支撑所述一对划线装置，使得所述一对划线装置沿Y轴方向移动; 以及用于将基板支撑在X-Y平面中的基板支撑装置，使得一对划线形成线装置划刻基板的第一表面和基板的第二表面。

    Method for Removing Deposit from Substrate and Method for Drying Substrate, as Well as Apparatus for Removing Deposit from Substrate and Apparatus for Drying Substrate Using These Methods
    2.
    发明申请
    Method for Removing Deposit from Substrate and Method for Drying Substrate, as Well as Apparatus for Removing Deposit from Substrate and Apparatus for Drying Substrate Using These Methods 失效
    从基板去除沉积物的方法和用于干燥基材的方法以及用于从基板去除沉积物的装置和使用这些方法干燥基材的装置

    公开(公告)号：US20070281094A1

    公开(公告)日：2007-12-06

    申请号：US10583348

    申请日：2004-12-16

    申请人： Yoshitaka Nishio ,  Yukio Oshima

    发明人： Yoshitaka Nishio ,  Yukio Oshima

    IPC分类号： H01L21/304 ,  B08B5/02 ,  F26B13/14 ,  F26B5/00

    CPC分类号： F26B21/004 ,  B08B5/023 ,  B08B5/04 ,  B08B5/043 ,  F26B5/14

    摘要： In a method for removing deposit that has attached to a main surface of a substrate from the main surface of the substrate using air knife units where a slit portion is formed so that a fluid can be discharged in band form, a fluid introduction path having an approximately uniform form in the direction perpendicular to the direction in which a number of air knife units move relative to the substrate is formed between the air knife units and the main surface of the substrate while the air knife units move relative to the substrate, a fluid is discharged toward the fluid introduction path from a slit that is formed in the rear portion of the above described air knife units, and then, passes through the fluid introduction path so as to be led to a wall surface that is formed so as to face the front portion of the air knife units or the fluid which has the appearance of a wall surface, and furthermore, deposit on the substrate that has attached to the substrate is led away from the main surface of the substrate, together with said fluid, via a fluid lead-out path of which the cross sectional area of the low path is greater than that of the fluid introduction path, and which is formed between the air knife units and the wall surface.

    摘要翻译： 在使用形成有狭缝部的空气刀单元从基板的主面剥离附着于基板的主面的沉积物的方法中，使得能够以带状排出流体的流体导入路径具有 在空气刀单元与基板的主表面之间，在垂直于多个气刀单元相对于基板移动的方向的方向上形成大致均匀的形状，同时气刀单元相对于基板移动，流体 从形成在上述气刀单元的后部的狭缝向流体导入路径排出，然后通过流体导入路径被引导到形成为面对的壁面 气刀单元的前部或具有壁面外观的流体，此外，沉积在附着于基板的基板上，从主要的壳体 衬底的所述表面与所述流体一起经由流体引出路径，低通道的横截面积大于流体引入路径的横截面积，并且其形成在气刀单元和壁表面之间 。

    Method for removing deposit from substrate and method for drying substrate, as well as apparatus for removing deposit from substrate and apparatus for drying substrate using these methods
    4.
    发明授权
    Method for removing deposit from substrate and method for drying substrate, as well as apparatus for removing deposit from substrate and apparatus for drying substrate using these methods 失效
    用于从基材除去沉积物的方法和用于干燥基材的方法，以及用于使用这些方法从基材和用于干燥基材的设备除去沉积物的设备

    公开(公告)号：US07931755B2

    公开(公告)日：2011-04-26

    申请号：US10583348

    申请日：2004-12-16

    申请人： Yoshitaka Nishio ,  Yukio Oshima

    发明人： Yoshitaka Nishio ,  Yukio Oshima

    IPC分类号： B08B5/00 ,  B08B5/02

    CPC分类号： F26B21/004 ,  B08B5/023 ,  B08B5/04 ,  B08B5/043 ,  F26B5/14

    摘要： In a method for removing deposit that has attached to a main surface of a substrate from the main surface of the substrate using air knife units where a slit portion is formed so that a fluid can be discharged in band form, a fluid introduction path having an approximately uniform form in the direction perpendicular to the direction in which a number of air knife units move relative to the substrate is formed between the air knife units and the main surface of the substrate while the air knife units move relative to the substrate, a fluid is discharged toward the fluid introduction path from a slit that is formed in the rear portion of the above described air knife units, and then, passes through the fluid introduction path so as to be led to a wall surface that is formed so as to face the front portion of the air knife units or the fluid which has the appearance of a wall surface, and furthermore, deposit on the substrate that has attached to the substrate is led away from the main surface of the substrate, together with said fluid, via a fluid lead-out path of which the cross sectional area of the low path is greater than that of the fluid introduction path, and which is formed between the air knife units and the wall surface.

    摘要翻译： 在使用形成有狭缝部的空气刀单元从基板的主面剥离附着于基板的主面的沉积物的方法中，使得能够以带状排出流体的流体导入路径具有 在空气刀单元与基板的主表面之间，在垂直于多个气刀单元相对于基板移动的方向的方向上形成大致均匀的形状，同时气刀单元相对于基板移动，流体 从形成在上述气刀单元的后部的狭缝向流体导入路径排出，然后通过流体导入路径被引导到形成为面对的壁面 气刀单元的前部或具有壁面外观的流体，此外，沉积在附着于基板的基板上，从主要的壳体 衬底的所述表面与所述流体一起经由流体引出路径，低通道的横截面积大于流体引入路径的横截面积，并且其形成在气刀单元和壁表面之间 。

    Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method
    7.
    发明申请
    Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method 失效
    基板分割系统，基板制造设备，基板划线方法和基板划分方法

    公开(公告)号：US20070281444A1

    公开(公告)日：2007-12-06

    申请号：US10598878

    申请日：2005-03-14

    申请人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Ohnari ,  Kazuhiro Yoshimoto

    发明人： Yoshitaka Nishio ,  Yasutomo Okajima ,  Yukio Oshima ,  Hiroyuki Ohnari ,  Kazuhiro Yoshimoto

    IPC分类号： H01L21/78 ,  B26F3/00

    CPC分类号： B28D1/047 ,  B27B5/063 ,  B28D5/024 ,  B65G49/064 ,  B65G49/065 ,  B65G49/067 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/027 ,  C03B33/03 ,  C03B2225/02 ,  Y10T83/0333 ,  Y10T83/0356 ,  Y10T83/4617 ,  Y10T83/6606 ,  Y10T225/12 ,  Y10T225/321 ,  Y10T225/336 ,  Y10T225/357

    摘要： The objective of the present invention is to provide a substrate cutting system which requires a small footprint area so as to be compact, and also which is capable of efficiently cutting a substrate. Clamp devices 50 are attached to the substrate cutting system. The clamp devices can hold at least one part of a side edge of the mother substrate to be carried-in a mounting base 10 in a hollow rectangular parallelepiped and reciprocate along one side of the mounting base 10 in a hollow rectangular parallelepiped. A pair of substrate cutting devices are provided in a cutting device guide body 30 so as to be movable along a direction perpendicular to the moving direction of the clamp devices 50, the pair of substrate cutting devices cutting the mother substrate from each of the top surface and the bottom surface of the mother substrate which is clamped by the clamp devices 50. When the clamp devices 50 holding the mother substrate are moved, a substrate supporting device supports the mother substrate without rubbing against the mother substrate.

    摘要翻译： 本发明的目的是提供一种基板切割系统，其需要小的占地面积以致紧凑，并且还能够有效地切割基板。 夹持装置50附接到基板切割系统。 夹持装置可以将母体基板的侧边缘的至少一部分保持在安装基座10中，该中心长方体平行六面体并沿着安装基座10的一侧在中空的长方体内往复运动。 一对基板切割装置设置在切割装置引导体30中，以便能够沿着与夹紧装置50的移动方向垂直的方向移动，该对基板切割装置从每个上表面切割母基板 以及由夹持装置50夹紧的母基板的底面。 当保持母基板的夹持装置50移动时，基板支撑装置不会摩擦母体基板而支撑母基板。