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    Process for high copper removal rate with good planarization and surface finish
    2.
    发明申请
    Process for high copper removal rate with good planarization and surface finish 审中-公开
    具有良好的平坦化和表面光洁度的高铜去除率的工艺

    公开(公告)号：US20070235344A1

    公开(公告)日：2007-10-11

    申请号：US11399560

    申请日：2006-04-06

    申请人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： B23H5/08

    CPC分类号： B23H5/08 ,  C25F3/02 ,  H01L21/32125

    摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.

    摘要翻译： 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。

    Methods for electrochemical processing with pre-biased cells
    3.
    发明申请
    Methods for electrochemical processing with pre-biased cells 审中-公开
    使用预偏置电池进行电化学处理的方法

    公开(公告)号：US20070158207A1

    公开(公告)日：2007-07-12

    申请号：US11326647

    申请日：2006-01-06

    申请人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

    发明人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

    IPC分类号： B23H3/00

    CPC分类号： B23H5/08 ,  B24B53/017 ,  C25F1/00 ,  C25F3/02

    摘要： A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.

    摘要翻译： 提供了一种用于电化学处理衬底的方法。 在一个实施例中，该方法包括在具有多个处理单元的处理垫上执行调节程序，通过向经调节的处理垫施加电压来激励处理单元，将其上布置有至少一个导电层的基板放置在通电 并且在通电的处理单元中去除导电层的至少一部分。 在另一个实施例中，用于抛光衬底的方法包括将具有多个处理单元的未使用的导电焊盘放置在处理系统的压板上，在压板上的焊盘中断开， 在衬垫中，将具有至少其上设置有导电层的衬底放置在通电焊盘上，以及去除通电电池中的至少一部分导电层。

    Process and composition for electrochemical mechanical polishing
    4.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249394A1

    公开(公告)日：2006-11-09

    申请号：US11251630

    申请日：2005-10-14

    申请人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    发明人： Renhe Jia ,  You Wang ,  Zhihong Wang ,  Jie Diao ,  Daxin Mao ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

    IPC分类号： C09K13/00 ,  B23H9/00 ,  C25F3/00 ,  C09K13/06

    CPC分类号： C25F3/02 ,  B23H5/08 ,  C09K3/1463

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除 导电材料层。

    Method for electrochemically mechanically polishing a conductive material on a substrate
    5.
    发明申请
    Method for electrochemically mechanically polishing a conductive material on a substrate 失效
    在基板上进行电化学机械研磨导电材料的方法

    公开(公告)号：US20070161250A1

    公开(公告)日：2007-07-12

    申请号：US11328958

    申请日：2006-01-09

    申请人： You Wang ,  Zhihong Wang ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu

    发明人： You Wang ,  Zhihong Wang ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： H01L21/7684 ,  B23H5/08 ,  H01L21/32125

    摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.

    摘要翻译： 本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。 例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性 当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING
    7.
    发明申请
    ABRASIVE COMPOSITION FOR ELECTROCHEMICAL MECHANICAL POLISHING 审中-公开
    电化学机械抛光磨料组合物

    公开(公告)号：US20070254485A1

    公开(公告)日：2007-11-01

    申请号：US11735801

    申请日：2007-04-16

    申请人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    发明人： Daxin Mao ,  You Wang ,  Junzi Zhao ,  Stan D. Tsai ,  Renhe Jia ,  Jie Diao ,  Yongqi Hu ,  Lakshmanan Karuppiah

    IPC分类号： H01L21/461 ,  H01L21/302 ,  C09K13/00

    CPC分类号： H01L21/32125 ,  B23H5/08 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  C25F3/02 ,  H01L21/7684

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In certain embodiments, a composition for processing a substrate having a conductive material layer disposed thereon is provided wherein the composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, an amount of a pH adjusting agent sufficient to provide a pH between about 3 and about 10, anionic polymer abrasive particles, and a solvent. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在某些实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其中所述组合物包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，一定量的pH调节剂， 提供约3至约10个的阴离子聚合物研磨剂颗粒和溶剂之间的pH。 该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

    Process and composition for electrochemical mechanical polishing
    8.
    发明申请
    Process and composition for electrochemical mechanical polishing 审中-公开
    电化学机械抛光的工艺和组成

    公开(公告)号：US20060249395A1

    公开(公告)日：2006-11-09

    申请号：US11389867

    申请日：2006-03-27

    申请人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

    发明人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

    IPC分类号： C09K13/00 ,  B23H9/00 ,  B23H3/00

    CPC分类号： C09K3/1463 ,  B23H5/08

    摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

    摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂， 并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及 去除导电材料层。

    METHOD FOR STABILIZED POLISHING PROCESS
    10.
    发明申请
    METHOD FOR STABILIZED POLISHING PROCESS 审中-公开
    用于稳定抛光过程的方法

    公开(公告)号：US20070062815A1

    公开(公告)日：2007-03-22

    申请号：US11532258

    申请日：2006-09-15

    申请人： Renhe Jia ,  Jie Diao ,  Stan Tsai ,  You Wang ,  Laksh Karuppiah

    发明人： Renhe Jia ,  Jie Diao ,  Stan Tsai ,  You Wang ,  Laksh Karuppiah

    IPC分类号： C25C1/22

    CPC分类号： B23H5/08 ,  C25D5/18 ,  C25F3/00 ,  C25F3/02 ,  C25F7/00 ,  H01L21/32125

    摘要： A method for electrochemically processing a substrate is provided. In one embodiment, a method for electrochemically processing a substrate includes processing a substrate using a multi-step routine that includes a first processing period performed using a varying voltage to achieve a target removal current followed by a second processing period performed using a constant voltage.

    摘要翻译： 提供了一种用于电化学处理衬底的方法。 在一个实施例中，用于电化学处理衬底的方法包括使用包括使用变化电压执行的第一处理周期的多步骤例程来处理衬底，以实现目标去除电流，接着是使用恒定电压执行的第二处理周期。