利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

14 条记录 (耗时 0.031 秒)

    Apparatus and methods for handling a substrate
    6.
    发明授权
    Apparatus and methods for handling a substrate 有权

    公开(公告)号：US06227585B1

    公开(公告)日：2001-05-08

    申请号：US09206087

    申请日：1998-12-04

    申请人： Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

    发明人： Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

    IPC分类号： B25J1506

    摘要： Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

    System for electropolishing and electrochemical mechanical polishing
    7.
    发明授权
    System for electropolishing and electrochemical mechanical polishing 有权
    电抛光和电化学机械抛光系统

    公开(公告)号：US07427337B2

    公开(公告)日：2008-09-23

    申请号：US10822424

    申请日：2004-04-12

    申请人： Bulent M. Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard M. Frey

    发明人： Bulent M. Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard M. Frey

    IPC分类号： B23H3/00 ,  B23H3/02

    CPC分类号： B24B37/046 ,  B24B37/20 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/67075 ,  H01L21/6715

    摘要： An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

    摘要翻译： 公开了一种使用溶液对晶片上的导电层进行电解抛光的装置。 该装置包括浸入在靠近导电层配置的溶液中的电极组件，其具有延伸至晶片的至少周边的纵向尺寸，电极组件包括构造成接收电位差的细长接触电极，邻近细长的隔离器 接触电极和邻近隔离器的细长工艺电极，其被配置为接收电位差，电压源被配置为提供接触电极和处理电极之间的电位差以对晶片上的导电层进行电解抛光。

    Method for detecting the presence of a substrate in a carrier head
    10.
    发明授权
    Method for detecting the presence of a substrate in a carrier head 有权
    用于检测载体头中的基底的存在的方法

    公开(公告)号：US06244932B1

    公开(公告)日：2001-06-12

    申请号：US09369663

    申请日：1999-08-05

    申请人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen

    发明人： Boris Govzman ,  Steven M. Zuniga ,  Hung Chen

    IPC分类号： B24B4900

    CPC分类号： B24B37/30 ,  B24B37/0053

    摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

    摘要翻译： 用于化学机械抛光系统的载体头包括基底感测机构。 承载头包括基部和连接到基部以限定室的柔性构件。 柔性构件的下表面提供衬底接收表面。 衬底检测机构包括用于测量腔室中的压力并产生代表其的输出信号的传感器，以及被配置为响应于输出信号指示衬底是否附着到衬底接收表面的处理器。