公开(公告)号：US20060276111A1

公开(公告)日：2006-12-07

申请号：US11142918

申请日：2005-06-02

申请人： Yuan Tian ,  Alpay Yilmaz ,  Gerald Alonzo ,  Martin Wohlert ,  Yongqi Hu ,  Stan Tsai ,  Robert Ewald ,  Shou-Sung Chang

发明人： Yuan Tian ,  Alpay Yilmaz ,  Gerald Alonzo ,  Martin Wohlert ,  Yongqi Hu ,  Stan Tsai ,  Robert Ewald ,  Shou-Sung Chang

IPC分类号： B24B1/00 ,  B24B33/00

CPC分类号： B24B53/017 ,  B24B53/12

摘要： Embodiments of a conditioning element for conditioning a processing pad are provided herein. In one embodiment, a conditioning element for conditioning a processing pad includes a body having a face. A plurality of diamond particles are disposed on the face and define a conditioning surface. The diamond particles are of a type selected from the group consisting of very blocky (4D), blocky (3D), and irregular (2D), and have a shape ratio less than or equal to 1.2. In one embodiment, the diamond particles have an average size of between about 85 and about 115 μm. In one embodiment, the size of the diamond particles may have a standard of deviation that is less than about 5 μm. In one embodiment, the diamond particles may have a spacing of greater than 400 μm.

摘要翻译： 本文提供了用于调节加工垫的调节元件的实施例。 在一个实施例中，用于调节处理垫的调节元件包括具有面的主体。 多个金刚石颗粒设置在面上并限定调理表面。 金刚石颗粒是选自非常块状（4D），块状（3D）和不规则（2D）的类型，并且具有小于或等于1.2的形状比。 在一个实施方案中，金刚石颗粒的平均尺寸为约85至约115μm。 在一个实施方案中，金刚石颗粒的尺寸可以具有小于约5μm的偏差标准。 在一个实施例中，金刚石颗粒可以具有大于400μm的间隔。

公开(公告)号：US20080014845A1

公开(公告)日：2008-01-17

申请号：US11775533

申请日：2007-07-10

申请人： Alpay Yilmaz ,  Omer Ozgun ,  Gerald Alonzo ,  Lakshmanan Karuppiah ,  Shou-Sung Chang ,  Antoine P. Manens ,  Clinton Sakata

发明人： Alpay Yilmaz ,  Omer Ozgun ,  Gerald Alonzo ,  Lakshmanan Karuppiah ,  Shou-Sung Chang ,  Antoine P. Manens ,  Clinton Sakata

IPC分类号： B24B21/18

CPC分类号： B24B53/017

摘要： A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.

摘要翻译： 描述了用于调理导电抛光材料的方法和装置。 在一个实施例中，垫修整器包括适于联接到调节头组件的背板，所述背板包括具有第一侧和相对的第二侧的刚性盘，所述第二侧具有与所述背衬的中心线垂直的取向 板和环形构件，其具有粘附到背板的第二侧的基部，其中环形构件限定相对于第二侧的平面径向倾斜的第二侧相对的调节表面。

公开(公告)号：US20070235344A1

公开(公告)日：2007-10-11

申请号：US11399560

申请日：2006-04-06

申请人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

发明人： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

IPC分类号： B23H5/08

CPC分类号： B23H5/08 ,  C25F3/02 ,  H01L21/32125

摘要： A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.

摘要翻译： 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。

公开(公告)号：US20070151867A1

公开(公告)日：2007-07-05

申请号：US11431231

申请日：2006-05-10

申请人： Yongqi Hu ,  Stan Tsai ,  Gerald Alonzo ,  Lakshmanan Karuppiah

发明人： Yongqi Hu ,  Stan Tsai ,  Gerald Alonzo ,  Lakshmanan Karuppiah

IPC分类号： B23H9/14 ,  C25F3/00 ,  B23H3/00

CPC分类号： C25F7/00 ,  B23H5/08 ,  B24B37/20 ,  Y10T29/49155 ,  Y10T29/49156

摘要： An apparatus and a method with fluid flow assist elements for electrochemical mechanical processing is provided in this invention. In one embodiment, the apparatus includes a first conductive layer having an upper surface adapted to contact a substrate, a second conductive layer disposed below the first conductive layer, an isolation layer disposed between the conductive layers, and a plurality of apertures, each having a first end formed through the first conductive layer and a second end formed through the second conductive layer, wherein the second ends of at least two apertures are laterally coupled by a channel.

摘要翻译： 本发明提供了一种具有用于电化学机械加工的流体流动辅助元件的装置和方法。 在一个实施例中，该装置包括具有适于接触基板的上表面的第一导电层，设置在第一导电层下方的第二导电层，设置在导电层之间的隔离层和多个孔，每个孔具有 通过第一导电层形成的第一端和通过第二导电层形成的第二端，其中至少两个孔的第二端由通道横向耦合。

公开(公告)号：US20070153453A1

公开(公告)日：2007-07-05

申请号：US11327527

申请日：2006-01-05

申请人： You Wang ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Gerald Alonzo

发明人： You Wang ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Gerald Alonzo

IPC分类号： H05K5/00 ,  H05K3/10

CPC分类号： C25F7/00 ,  B23H5/08 ,  B24B37/20 ,  Y10T29/49155 ,  Y10T29/49156

摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a plurality of discrete members and a plurality of apertures. Each of the plurality of discrete members include a first conductive layer and a second conductive layer, with an isolation layer therebetween, and a recess for byproduct accumulation. The second conductive layer comprises a plurality of reaction surfaces that are orthogonal to the upper and lower surfaces of the pad assembly.

摘要翻译： 提供了用于处理基板的垫组件的实施例。 垫组件包括多个分立构件和多个孔。 多个离散构件中的每一个包括第一导电层和第二导电层，其间具有隔离层，以及用于副产物积累的凹部。 第二导电层包括与焊盘组件的上表面和下表面正交的多个反应表面。

公开(公告)号：US07314808B2

公开(公告)日：2008-01-01

申请号：US11271242

申请日：2005-11-10

申请人： Alpay Yilmaz ,  Gerald Alonzo

发明人： Alpay Yilmaz ,  Gerald Alonzo

IPC分类号： H01L21/76

CPC分类号： H01L21/67276 ,  H01L21/67778

摘要： Methods for transferring substrates in a system with a factory interface robot between at least one FOUP, a buffer coupled to a parasitic device and an inbound and outbound transfer station coupled to a processing tool are provided. In one embodiment, a method for transferring substrates includes transferring a first substrate on an end effector of a robot from a FOUP to a buffer station serving a parasitic device, moving the substrate from the buffer station into the parasitic device, picking up a second substrate on the end effector, compensating for a residence time of the first substrate in the parasitic device, transferring the second substrate to parasitic device from the end effector to the buffer station serving the parasitic device, and picking up the first substrate from the buffer station.

摘要翻译： 提供了在至少一个FOUP，耦合到寄生装置的缓冲器和耦合到处理工具的入站和出站传送站之间的工厂接口机器人的系统中传送衬底的方法。 在一个实施例中，用于传送衬底的方法包括将机器人的末端执行器上的第一衬底从FOUP传送到服务于寄生器件的缓冲站，将衬底从缓冲站移动到寄生器件中，拾取第二衬底 在末端执行器上补偿第一衬底在寄生器件中的停留时间，将第二衬底从端部执行器传送到寄生器件到用于寄生器件的缓冲器，并从缓冲器拾取第一衬底。

公开(公告)号：US20060183408A1

公开(公告)日：2006-08-17

申请号：US11271242

申请日：2005-11-10

申请人： Alpay Yilmaz ,  Gerald Alonzo

发明人： Alpay Yilmaz ,  Gerald Alonzo

IPC分类号： B24B1/00

CPC分类号： H01L21/67276 ,  H01L21/67778

摘要： Methods for transferring substrates in a system with a factory interface robot between at least one FOUP, a buffer coupled to a parasitic device and an inbound and outbound transfer station coupled to a processing tool are provided. In one embodiment, a method for transferring substrates includes transferring a first substrate on an end effector of a robot from a FOUP to a buffer station serving a parasitic device, moving the substrate from the buffer station into the parasitic device, picking up a second substrate on the end effector, compensating for a residence time of the first substrate in the parasitic device, transferring the second substrate to parasitic device from the end effector to the buffer station serving the parasitic device, and picking up the first substrate from the buffer station.

摘要翻译： 提供了在至少一个FOUP，耦合到寄生装置的缓冲器和耦合到处理工具的入站和出站传送站之间的工厂接口机器人的系统中传送衬底的方法。 在一个实施例中，用于传送衬底的方法包括将机器人的末端执行器上的第一衬底从FOUP传送到服务于寄生器件的缓冲站，将衬底从缓冲站移动到寄生器件中，拾取第二衬底 在末端执行器上补偿第一衬底在寄生器件中的停留时间，将第二衬底从端部执行器传送到寄生器件到用于寄生器件的缓冲器，并从缓冲器拾取第一衬底。

公开(公告)号：US20070158207A1

公开(公告)日：2007-07-12

申请号：US11326647

申请日：2006-01-06

申请人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

发明人： Jie Diao ,  Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Stan Tsai ,  Lakshmanan Karuppiah

IPC分类号： B23H3/00

CPC分类号： B23H5/08 ,  B24B53/017 ,  C25F1/00 ,  C25F3/02

摘要： A method for electrochemically processing a substrate is provided. In one embodiment, the method includes performing a conditioning procedure on a processing pad having a plurality of process cells, energizing the process cells by applying a voltage to the conditioned processing pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized process cells. In another embodiment, a method for polishing a substrate includes placing an unused conductive pad having a plurality of process cells on a platen of a processing system, breaking in the pad on the platen, energizing the process cells by applying a voltage to the broken-in pad, placing a substrate having at least a conductive layer disposed thereon on the energized pad, and removing at least a portion of the conductive layer in the energized cells.

摘要翻译： 提供了一种用于电化学处理衬底的方法。 在一个实施例中，该方法包括在具有多个处理单元的处理垫上执行调节程序，通过向经调节的处理垫施加电压来激励处理单元，将其上布置有至少一个导电层的基板放置在通电 并且在通电的处理单元中去除导电层的至少一部分。 在另一个实施例中，用于抛光衬底的方法包括将具有多个处理单元的未使用的导电焊盘放置在处理系统的压板上，在压板上的焊盘中断开， 在衬垫中，将具有至少其上设置有导电层的衬底放置在通电焊盘上，以及去除通电电池中的至少一部分导电层。

公开(公告)号：US20070099545A1

公开(公告)日：2007-05-03

申请号：US11556114

申请日：2006-11-02

申请人： Rashid Mavliev ,  Simon Yavelberg ,  Gerald Alonzo

发明人： Rashid Mavliev ,  Simon Yavelberg ,  Gerald Alonzo

IPC分类号： B24B49/00

CPC分类号： B24B49/00 ,  B24B37/34

摘要： Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated or moved so that any portion of the polishing pad can be tested.

摘要翻译： 描述了用于原位表征抛光垫表面的工具和方法。 表征工具与抛光工具集成在一起，从而可以原位监测抛光垫。 表征工具和抛光垫可以旋转或移动，以便可以对抛光垫的任何部分进行测试。