公开(公告)号：US20120003065A1

公开(公告)日：2012-01-05

申请号：US13167990

申请日：2011-06-24

申请人： Yu Hirono ,  Fumiyasu Suzuki ,  Yuichi Machida

发明人： Yu Hirono ,  Fumiyasu Suzuki ,  Yuichi Machida

IPC分类号： B65H5/08 ,  B65H5/12

CPC分类号： G01N21/13 ,  G01N2021/135 ,  G02B21/26 ,  G02B21/34

摘要： A conveying device including: a storage unit storing two or more sheets of slide glasses to be subjected to a predetermined treatment; a stage holding only one sheet of slide glass to be subjected to the treatment; a supply arm by which one sheet of slide glass to be subjected to the treatment is picked up from the storage unit and supplied onto the stage; a discharge arm by which the slide glass mounted on the stage is picked up and discharged in the storage unit; a moving unit operable to move the supply arm and the discharge arm in an integral manner so as to bring the supply arm or the discharge arm into proximity to each of the storage unit and the stage; and a control unit operable to control the supply arm, the discharge arm and the moving unit.

摘要翻译： 一种输送装置，包括：存储单元，存储要进行预定处理的两张或更多张幻灯片; 仅容纳一张待处理的载玻片的台阶; 供给臂，通过该供给臂从所述存储单元拾取待处理的一张载玻片并供给到所述台上; 安装在台架上的载玻片通过该排出臂拾取并放出到存储单元中; 移动单元，其可操作以一体地移动所述供给臂和所述排出臂，以使所述供应臂或所述排出臂接近所述存储单元和所述台中的每一个; 以及控制单元，其可操作以控制供应臂，排出臂和移动单元。

公开(公告)号：US5324554A

公开(公告)日：1994-06-28

申请号：US928035

申请日：1992-08-11

申请人： Junichi Tamura ,  Yuichi Machida ,  Chikara Amano

发明人： Junichi Tamura ,  Yuichi Machida ,  Chikara Amano

IPC分类号： B65H75/10 ,  G03C3/00

CPC分类号： B65H75/10 ,  Y10T428/24992 ,  Y10T428/31982

摘要： A core for photographic light-sensitive material use made of wooden source material which can be recycled or decomposed in natural environment is disclosed. The core center is made of paper covered with a buffer layer made of 100% wooden pulp having a density of not more than 0.1 g/cm.sup.3. The buffer layer is covered with a reinforcing sheet made of paper with a tensile strength of 0.3 kg/15 mm width or more.

摘要翻译： 公开了一种用于在自然环境中回收或分解的木源材料制成的照相感光材料的核心。 核心中心由纸覆盖有由100％木浆制成的缓冲层，密度不超过0.1g / cm 3。 缓冲层用拉伸强度为0.3kg / 15mm以上的纸张加强片覆盖。

公开(公告)号：US09047000B2

公开(公告)日：2015-06-02

申请号：US13276891

申请日：2011-10-19

申请人： Masao Kondo ,  Kunihito Sawai ,  Yuichi Machida

发明人： Masao Kondo ,  Kunihito Sawai ,  Yuichi Machida

IPC分类号： G09G5/00 ,  G06F3/0488 ,  G06F3/0485 ,  G06T3/20

CPC分类号： G06F3/0488 ,  G06F3/0485 ,  G06T3/20

摘要： An image processing apparatus includes a position movement input unit configured to receive a position movement instruction from a user, a pointer movement unit configured to set a position of a pointer that moves in accordance with the instruction, and a screen movement unit configured to scroll a screen based on a relative position of the pointer with respect to a reference point of a predefined area around the pointer, the screen movement unit configured to move the predefined area to keep the pointer inside the predefined area when the pointer is at a border of the predefined area and moves towards an outside of the predefined area.

摘要翻译： 图像处理装置包括：位置移动输入单元，被配置为从用户接收位置移动指令;指针移动单元，被配置为设置根据该指示移动的指针的位置;以及屏幕移动单元， 基于所述指针相对于所述指示器周围的预定区域的参考点的相对位置的屏幕，所述屏幕移动单元被配置为当所述指针位于所述指针的边界处时移动所述预定区域以将所述指针保持在所述预定区域内 预定区域并且朝向预定区域的外部移动。

公开(公告)号：US20120002277A1

公开(公告)日：2012-01-05

申请号：US13167027

申请日：2011-06-23

申请人： Yuichi Machida ,  Fumiyasu Suzuki ,  Yu Hirono

发明人： Yuichi Machida ,  Fumiyasu Suzuki ,  Yu Hirono

IPC分类号： G02B21/26 ,  B65G47/90 ,  B65D85/48

CPC分类号： G02B21/26

摘要： A slide glass storage device including: a supply tray which has a supply holding space determined by a longer edge upper limit allowed for a longer edge of a slide glass and a shorter edge upper limit allowed for a shorter edge of the slide glass and on which a slide glass to be supplied to a treatment unit operable to perform a predetermined treatment is mounted; a discharge tray which has a discharge holding space determined by a longer edge longer than the longer edge upper limit and a shorter edge longer than the shorter edge upper limit and on which a slide glass having been subjected to the treatment in the treatment unit and being to be discharged is mounted; and a support unit supporting the supply tray and the discharge tray.

摘要翻译： 一种载玻片存储装置，包括：供给托盘，其具有通过允许滑动玻璃的较长边缘允许的较长边缘上限和允许所述载玻片的较短边缘的较短边缘上限确定的供给保持空间， 安装供给到可操作以执行预定处理的处理单元的载玻片; 排出托盘，其具有由比长边上限长的长边确定的排出保持空间和比上述边缘上限长的短边，并且在处理单元中经过了处理的载玻片， 被安装; 以及支撑单元，其支撑供给托盘和排出托盘。

公开(公告)号：US08017440B2

公开(公告)日：2011-09-13

申请号：US12898820

申请日：2010-10-06

申请人： Yuichi Machida

发明人： Yuichi Machida

IPC分类号： H01L21/00

CPC分类号： H01L24/33 ,  H01L21/4842 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05556 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2224/838 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.

摘要翻译： 提高了半导体器件的可靠性。 将第一引线框架，第一半导体芯片，第二引线框架和第二半导体芯片依次堆叠在组装夹具上，并且进行焊料回流处理以进行组装。 此后，该组件被夹在第一和第二模具之间以形成封装树脂部分。 第二模具的上表面设置有台阶。 在模制步骤中，第二引线框架在高于第一引线框架的位置处被夹持在第一和第二管芯之间; 并且第三引线框架在较高位置处夹在第一和第二管芯之间。 组装夹具在与第二模具的上表面相对应的位置处设置有与第二模具的上表中的步骤相同位置的步骤。

公开(公告)号：US07732919B2

公开(公告)日：2010-06-08

申请号：US12362354

申请日：2009-01-29

申请人： Ichio Shimizu ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

发明人： Ichio Shimizu ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

IPC分类号： H01L23/34

CPC分类号： H05K7/04 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/28 ,  H01L24/29 ,  H01L24/36 ,  H01L24/39 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/202 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).

摘要翻译： 改善了无源部件的耦合可靠性，以提高半导体器件的可靠性。 第一通孔形成在第一板状引线的第一电极部分中，第二通孔形成在第二板状引线的第二电极部分中。 结果，在第一板状引线的第一电极部分，无源部件的一个外部端子可以被连接到第一通孔的两侧的第一电极部分，同时跨过第一通孔。 此外，在第二板状引线的第二电极部分，无源部件的另一个外部端子可以在跨过第二通孔而被布置在第二通孔的两侧上的第二电极部件上。 因此，在无源部件的纵向和宽度方向的中心部分处，被动部件被密封部件包围。 结果，可以减少施加到诸如焊料的接合材料的热应力，从而提高半导体器件（半导体封装）的可靠性。

公开(公告)号：US08902501B2

公开(公告)日：2014-12-02

申请号：US13159588

申请日：2011-06-14

申请人： Fumiyasu Suzuki ,  Yu Hirono ,  Yuichi Machida

发明人： Fumiyasu Suzuki ,  Yu Hirono ,  Yuichi Machida

IPC分类号： G02B21/26 ,  G02B21/34 ,  G02B21/24

CPC分类号： G02B21/34 ,  G02B21/24 ,  G02B21/26

摘要： Disclosed herein is a stage system, including: a stage on which to mount a slide glass; a projection block projected more than the thickness of the slide glass to the side of that surface of the stage on which to dispose the slide glass; and a pressing block which is provided on that surface of the stage on which to dispose the slide glass, is thicker than the slide glass, and presses toward the projection block the slide glass disposed between itself and the projection block.

摘要翻译： 本文公开了一种舞台系统，包括：安装载玻片的舞台; 投影块比投影载玻片的台面的该表面侧的投影量大于载玻片的厚度; 并且设置在其上设置载玻片的台的表面上的按压块比载玻片厚，并且朝向突出块压入设置在其自身与突出块之间的载玻片。

公开(公告)号：US08813942B2

公开(公告)日：2014-08-26

申请号：US13167027

申请日：2011-06-23

申请人： Yuichi Machida ,  Fumiyasu Suzuki ,  Yu Hirono

发明人： Yuichi Machida ,  Fumiyasu Suzuki ,  Yu Hirono

IPC分类号： G02B21/26 ,  B65G47/90 ,  B65D85/48

CPC分类号： G02B21/26

摘要： A slide glass storage device including: a supply tray which has a supply holding space determined by a longer edge upper limit allowed for a longer edge of a slide glass and a shorter edge upper limit allowed for a shorter edge of the slide glass and on which a slide glass to be supplied to a treatment unit operable to perform a predetermined treatment is mounted; a discharge tray which has a discharge holding space determined by a longer edge longer than the longer edge upper limit and a shorter edge longer than the shorter edge upper limit and on which a slide glass having been subjected to the treatment in the treatment unit and being to be discharged is mounted; and a support unit supporting the supply tray and the discharge tray.

摘要翻译： 一种载玻片存储装置，包括：供给托盘，其具有通过允许滑动玻璃的较长边缘允许的较长边缘上限和允许所述载玻片的较短边缘的较短边缘上限确定的供给保持空间， 安装供给到可操作以执行预定处理的处理单元的载玻片; 排出托盘，其具有由比长边上限长的长边确定的排出保持空间和比上述边缘上限长的短边，并且在处理单元中经过了处理的载玻片， 被安装; 以及支撑单元，其支撑供给托盘和排出托盘。

公开(公告)号：US08714709B2

公开(公告)日：2014-05-06

申请号：US13806277

申请日：2011-06-10

申请人： Yuichi Machida ,  Nobuko Yanata

发明人： Atsuro Yanata ,  Yuichi Machida

IPC分类号： B41J2/14

CPC分类号： B41J2/14201 ,  B41J2/045 ,  B41J2/14233 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/18

摘要： An inkjet head (3) comprises a wiring board (80) which. has, two-dimensionally arranged thereon, sets of nozzles (11) , pressure chambers (41) , and actuators (60) and which also has lines of wiring (87, 91) through-vias (85) , and ink flow paths (88); and connection sections (110, 111) which connect the lines of wiring to a drive section, the connection sections (110, 111) being disposed outside the arrangement region (R) in which the sets of the nozzles, the pressure chambers, and the actuators are arranged two-dimensionally. The nozzles are arranged in N rows (N is an integer greater than or equal to 2) , with each of the N rows comprising M nozzles (M is an integer greater than or equal to 2) which are arranged rectilinearly. The through-vias which correspond. to the nozzles of arbitrary n nozzle rows of the N nozzle rows (1≦n

摘要翻译： 喷墨头（3）包括布线板（80）。 具有二维布置在其上的喷嘴组（11），压力室（41）和致动器（60），并且还具有布线（87,91）通孔（85）和油墨流动通道 88）; 以及连接线路连接到驱动部分的连接部分（110,111），所述连接部分（110,111）设置在所述布置区域（R）的外侧，在所述布置区域（R）中，所述喷嘴，压力室和 致动器二维布置。 这些喷嘴排列成N行（N是大于或等于2的整数），N列包括M个喷嘴（M是大于或等于2的整数），其直线排列。 通孔对应。 在排列区域中设置有N个喷嘴列（1＆amp; nlE; n

公开(公告)号：US08569111B2

公开(公告)日：2013-10-29

申请号：US13220763

申请日：2011-08-30

申请人： Yuichi Machida

发明人： Yuichi Machida

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L23/02

CPC分类号： H01L24/33 ,  H01L21/4842 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/05 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05556 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2224/838 ,  H01L2225/06562 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out to fabricate their assembly. Thereafter, this assembly is sandwiched between first and second molding dies to form an encapsulation resin portion. The upper surface of the second die is provided with steps. At a molding step, the second lead frame is clamped between the first and second dies at a position higher than the first lead frame; and a third lead frame is clamped between the first and second dies at a higher position. The assembly jig is provided with steps at the same positions as those of the steps in the upper surface of the second die in positions corresponding to those of the same.

摘要翻译： 提高了半导体器件的可靠性。 将第一引线框架，第一半导体芯片，第二引线框架和第二半导体芯片依次堆叠在组装夹具上，并且进行焊料回流处理以进行组装。 此后，该组件被夹在第一和第二模具之间以形成封装树脂部分。 第二模具的上表面设置有台阶。 在模制步骤中，第二引线框架在高于第一引线框架的位置处被夹持在第一和第二管芯之间; 并且第三引线框架在较高位置处夹在第一和第二管芯之间。 组装夹具在与第二模具的上表面相对应的位置处设置有与第二模具的上表中的步骤相同位置的步骤。