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公开(公告)号：US20140120264A1
公开(公告)日：2014-05-01
申请号：US14128109
申请日：2012-06-07
IPC分类号： B05C11/10
CPC分类号： B05C11/1039 , C23C18/1619 , C23C18/1632 , C23C18/165 , C23C18/168 , C23C18/1682 , C23C18/1683 , C23C18/32
摘要： A plating apparatus 20 has a substrate holding/rotating device 110 configured to hold and rotate a substrate 2 and a plating liquid supplying device 30 configured to supply a plating liquid 35 onto the substrate 2. The plating liquid supplying device 30 has a supply tank 31 configured to store therein the plating liquid 35 to be supplied onto the substrate 2, a discharge nozzle 32 configured to discharge the plating liquid 35 onto the substrate 2 and a plating liquid supplying line 33 through which the plating liquid 35 within the supply tank 31 is supplied into the discharge nozzle 32. Further, an ammonia gas storage unit 170 is connected to the supply tank 31, and a concentration of an ammonia component within the plating liquid 35 stored in the supply tank 31 can be maintained within a preset target range.
摘要翻译： 电镀装置20具有：基板保持旋转装置110，被配置为保持和旋转基板2;以及电镀液供给装置30，其被配置为将电镀液体35供给到基板2上。电镀液供给装置30具有供给槽31 被配置为在其中存储供给到基板2上的镀液35，将镀液33排出到基板2上的排出喷嘴32和供给槽31内的镀液35通过该电镀液供给路33 供给到排出喷嘴32.此外，氨气体收容部170与供给罐31连接，能够将储存在供给槽31内的镀液35内的氨成分浓度维持在预先设定的目标范围内。
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公开(公告)号：US09777379B2
公开(公告)日：2017-10-03
申请号：US14129698
申请日：2012-06-04
CPC分类号： C23C18/163 , C23C18/1619 , C23C18/1632 , C23C18/1655 , C23C18/1669 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/18 , C23C18/50 , H05K3/187 , H05K2203/0165 , H05K2203/072 , H05K2203/075
摘要： A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
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公开(公告)号：US09505019B2
公开(公告)日：2016-11-29
申请号：US14129623
申请日：2012-06-04
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1619 , C23C18/1669 , C23C18/1676 , C23C18/168
摘要： A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.
摘要翻译： 通过将电镀液体供给到基板上进行电镀处理的电镀装置包括：基板保持旋转装置，其构造成保持和旋转基板; 排出装置，被配置为将所述电镀液体朝向所述基板排出; 电镀液供给装置，其配置为将电镀液体供给到排出装置; 以及控制器，其被配置为控制所述排出装置和所述电镀液供给装置。 此外，排出装置包括具有排出口的第一喷嘴和具有排出口的第二喷嘴，其被配置为比第一喷嘴的排出口更靠近基板的中心部。 此外，电镀液供给装置被配置为将供给到第一喷嘴的电镀液的温度设定为高于供给到第二喷嘴的电镀液的温度。
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公开(公告)号：US20150232994A1
公开(公告)日：2015-08-20
申请号：US14129698
申请日：2012-06-04
CPC分类号： C23C18/163 , C23C18/1619 , C23C18/1632 , C23C18/1655 , C23C18/1669 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/18 , C23C18/50 , H05K3/187 , H05K2203/0165 , H05K2203/072 , H05K2203/075
摘要： A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
摘要翻译： 电镀装置可以均匀地对基板的整个表面进行电镀处理。 电镀装置20包括被配置为保持和旋转衬底2的衬底保持/旋转装置110; 排出装置21，被配置为将电镀液体朝向保持在基板保持旋转装置110上的基板2排出; 以及配置为控制基板保持/旋转装置110和排出装置21的控制器160.此外，排出装置21包括：第一喷嘴40，其具有沿基板2的径向配置的多个排出口41，或具有 沿基板2的径向延伸的排出口42; 以及第二喷嘴45，其具有被配置为比第一喷嘴40的排出口更靠近基板2的中心部分的排出口46。
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公开(公告)号：US20140134345A1
公开(公告)日：2014-05-15
申请号：US14129623
申请日：2012-06-04
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1619 , C23C18/1669 , C23C18/1676 , C23C18/168
摘要： A plating apparatus of performing a plating process by supplying a plating liquid onto a substrate includes a substrate holding/rotating device configured to hold and rotate the substrate; a discharging device configured to discharge the plating liquid toward the substrate; a plating liquid supplying device configured to supply the plating liquid to the discharging device; and a controller configured to control the discharging device and the plating liquid supplying device. Further, the discharging device includes a first nozzle having a discharge opening, and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle. Furthermore, the plating liquid supplying device is configured to set a temperature of the plating liquid supplied to the first nozzle to be higher than a temperature of the plating liquid supplied to the second nozzle.
摘要翻译： 通过将电镀液体供给到基板上进行电镀处理的电镀装置包括：基板保持旋转装置，其构造成保持和旋转基板; 排出装置，被配置为将所述电镀液体朝向所述基板排出; 电镀液供给装置，其配置为将电镀液体供给到排出装置; 以及控制器，其被配置为控制所述排出装置和所述电镀液供给装置。 此外，排出装置包括具有排出口的第一喷嘴和具有排出口的第二喷嘴，其被配置为比第一喷嘴的排出口更靠近基板的中心部分。 此外，电镀液供给装置被配置为将供给到第一喷嘴的电镀液的温度设定为高于供给到第二喷嘴的电镀液的温度。
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公开(公告)号：US08937014B2
公开(公告)日：2015-01-20
申请号：US13879175
申请日：2011-08-31
申请人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
发明人： Takashi Tanaka , Yusuke Saito , Mitsuaki Iwashita
IPC分类号： H01L21/44 , H01L21/67 , C23C18/16 , H01L21/288
CPC分类号： H01L21/6723 , C23C18/1619 , C23C18/1653 , C23C18/1675 , C23C18/1676 , C23C18/168 , C23C18/50 , H01L21/288
摘要： A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.
摘要翻译： 在多个基板上连续进行电镀处理的液体处理装置包括：容纳电镀液的温度控制容器; 温度控制器，用于控制温度控制容器中的电镀液的温度; 保持单元，用于将预定位置一个接一个地保持; 具有供给孔的喷嘴，所述温度控制容器中的所述温度控制电镀液通过所述供给孔排出到所述基板的处理面; 推压单元，用于将温度控制容器中的温度控制电镀液朝向喷嘴的供给孔推动; 以及供应控制单元，用于控制当推动单元推动电镀液体时的定时。 温度控制器基于由推动单元推动电镀液的时机，控制温度控制容器中的电镀液的温度。
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公开(公告)号：US20100075027A1
公开(公告)日：2010-03-25
申请号：US12405597
申请日：2009-03-17
IPC分类号： B05D3/12
CPC分类号： H01L21/288 , C23C18/1628 , C23C18/1669 , H01L21/6715 , H01L21/76849
摘要： A cap metal forming method capable of obtaining a uniform film thickness on the entire surface of a substrate is provided. The method for forming a cap metal on a copper wiring formed on a processing target surface of a substrate includes: holding the substrate so as to be rotatable; rotating the substrate in a processing target surface direction of the substrate; locating an end portion of an agitation member so as to face the processing target surface of a periphery portion of the substrate with a preset gap maintained therebetween; supplying a plating processing solution onto the processing target surface; and stopping the supply of the plating processing solution and moving the agitation member such that the end portion of the agitation member is separated away from the processing target surface of the substrate.
摘要翻译： 提供能够在基板的整个表面上获得均匀的膜厚度的盖金属成形方法。 在形成在基板的加工对象面上的铜布线上形成盖金属的方法包括：保持基板以可旋转; 在所述基板的处理对象面方向上旋转所述基板; 将搅拌构件的端部定位成面对保持在其间的预设间隙的基板的周边部分的处理目标表面; 将电镀处理液供给到所述加工对象面上; 停止电镀处理液的供给，使搅拌部件移动，使搅拌部件的端部与基板的加工对象面分离。
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8.发明授权公开(公告)号：US09731322B2
公开(公告)日：2017-08-15
申请号：US13881431
申请日：2011-08-24
CPC分类号： B05D7/50 , B05B12/04 , B05B12/14 , B05D1/02 , C23C18/1632 , C23C18/1651 , C23C18/31 , C23C18/54 , C25D17/001
摘要： A plating apparatus 1 can perform plating processes by supplying plating liquids onto a surface of a substrate 2. The plating apparatus 1 includes a substrate rotating holder configured to hold and rotate the substrate 2; plating liquid supply units 29 and 30 configured to supply different kinds of plating liquids onto the surface of the substrate 2; a plating liquid drain unit 31 configured to drain out the plating liquids dispersed from the substrate 2 depending on the kinds of the plating liquids; and a controller 32 configured to control the substrate rotating holder 25, the plating liquid supply units 29 and 30, the plating liquid drain unit 31. While the substrate 2 is held and rotated, the plating processes are performed on the surface of the substrate 2 in sequence by supplying the different kinds of the plating liquids onto the surface of the substrate 2.
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公开(公告)号：US08206785B2
公开(公告)日：2012-06-26
申请号：US12405597
申请日：2009-03-17
CPC分类号： H01L21/288 , C23C18/1628 , C23C18/1669 , H01L21/6715 , H01L21/76849
摘要： A cap metal forming method capable of obtaining a uniform film thickness on the entire surface of a substrate is provided. The method for forming a cap metal on a copper wiring formed on a processing target surface of a substrate includes: holding the substrate so as to be rotatable; rotating the substrate in a processing target surface direction of the substrate; locating an end portion of an agitation member so as to face the processing target surface of a periphery portion of the substrate with a preset gap maintained therebetween; supplying a plating processing solution onto the processing target surface; and stopping the supply of the plating processing solution and moving the agitation member such that the end portion of the agitation member is separated away from the processing target surface of the substrate.
摘要翻译： 提供能够在基板的整个表面上获得均匀的膜厚度的盖金属成形方法。 在形成在基板的加工对象面上的铜布线上形成盖金属的方法包括：保持基板以可旋转; 在所述基板的处理对象面方向上旋转所述基板; 将搅拌构件的端部定位成面对保持在其间的预设间隙的基板的周边部分的处理目标表面; 将电镀处理液供给到所述加工对象面上; 停止电镀处理液的供给，使搅拌部件移动，使搅拌部件的端部与基板的加工对象面分离。
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公开(公告)号：US09421569B2
公开(公告)日：2016-08-23
申请号：US13981124
申请日：2012-01-13
IPC分类号： B05C5/00 , B05C9/14 , H01L21/3205 , B05B7/16 , C23C18/16 , H01L21/288 , B05D1/02 , C25D17/00 , H01L21/67 , G03F7/16
CPC分类号： B05C5/001 , B05D1/02 , C23C18/1614 , C23C18/1619 , C23C18/1676 , C23C18/168 , C25D17/001 , G03F7/162 , H01L21/288 , H01L21/67017
摘要： A plating apparatus includes a substrate holding/rotating device that holds/rotates a substrate; and a plating liquid supplying device that supplies a plating liquid onto the substrate. The plating liquid supplying device includes a supply tank that stores the plating liquid; a discharge nozzle that discharges the plating liquid onto the substrate; and a plating liquid supplying line through which the plating liquid of the supply tank is supplied into the discharge nozzle. Further, a first heating device is provided at either one of the supply tank and the plating liquid supplying line of the plating liquid supplying device, and heats the plating liquid to a first temperature. Furthermore, a second heating device is provided at the plating liquid supplying line between the first heating device and the discharge nozzle, and heats the plating liquid to a second temperature equal to or higher than the first temperature.
摘要翻译： 电镀装置包括：保持/旋转基板的基板保持/旋转装置; 以及将电镀液体供给到基板上的电镀液供给装置。 电镀液供给装置包括：储存电镀液的供给槽; 排出喷嘴，其将所述电镀液体排出到所述基板上; 以及电镀液体供给管路，供给槽的镀液通过该供给线供给到排出喷嘴。 此外，第一加热装置设置在电镀液供给装置的供给罐和电镀液供给管线中的任一个处，并将电镀液加热至第一温度。 此外，在第一加热装置和排出喷嘴之间的电镀液供给管线处设置第二加热装置，并将镀液加热到等于或高于第一温度的第二温度。
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