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    Electronic circuit device
    1.
    发明授权
    Electronic circuit device 失效
    电子电路装置

    公开(公告)号：US5483217A

    公开(公告)日：1996-01-09

    申请号：US91718

    申请日：1993-07-15

    申请人： Takashi Nagasaka ,  Mitsuhiro Saitou ,  Takahisa Koyasu ,  Hiroyuki Ban ,  Yuji Otani ,  Kengo Oka ,  Kyoko Nagaoka

    发明人： Takashi Nagasaka ,  Mitsuhiro Saitou ,  Takahisa Koyasu ,  Hiroyuki Ban ,  Yuji Otani ,  Kengo Oka ,  Kyoko Nagaoka

    IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16 ,  H05K3/28 ,  H01C1/02

    CPC分类号： H05K3/284 ,  H05K1/167 ,  H05K1/0271 ,  H05K1/095 ,  H05K1/141 ,  H05K2201/0317 ,  H05K2201/09236 ,  H05K2201/10386 ,  H05K2201/10545

    摘要： An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.

    摘要翻译： 电子电路装置减少由于应力引起的电阻电阻变化引起的电路输出中的色散。 在电路板上选择电阻器位置，使得由第一电阻器组的电阻变化引起的电路输出的变化等于由第二电阻器组造成的电阻变化引起的变化，这些变化是相反的 方向相互抵消。 或者，连接多个电阻器以形成复合电阻器，使得由具有降低的电阻的电阻器引起的复合电阻器的电阻的影响由于由具有增加的电阻的电阻器引起的复合电阻器的电阻的影响而被抵消。

    Method of producing thick multi-layer substrates
    3.
    发明授权
    Method of producing thick multi-layer substrates 失效
    生产厚多层基板的方法

    公开(公告)号：US5593722A

    公开(公告)日：1997-01-14

    申请号：US599112

    申请日：1996-02-09

    申请人： Yuji Otani ,  Takashi Nagasaka ,  Mitsuhiro Saitou

    发明人： Yuji Otani ,  Takashi Nagasaka ,  Mitsuhiro Saitou

    IPC分类号： H01C17/242 ,  H01C17/30 ,  H01L21/70 ,  H05K1/09 ,  H05K1/16 ,  H05K3/46 ,  B05D5/12

    CPC分类号： H05K1/167 ,  H01C17/242 ,  H01C17/30 ,  H01L21/705 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/092 ,  H05K2201/0195 ,  H05K2203/171 ,  H05K3/4664

    摘要： A method is provided for easily producing thick multi-layer substrates maintaining highly accurate resistances with little variation. A thick-film resistor 6 on a ceramic substrate 1 is fired at a temperature higher than the temperature of firing a glass insulating layer 2 that is formed thereon in contact therewith. This makes it possible to decrease the change in the resistance in a subsequent high-temperature step of firing the glass insulating layers 2 to 4. Moreover, after the glass insulating layer 2 is formed on the thick-film resistor 6 on the ceramic substrate 1, laser trimming is effected through a window or the glass insulating layer 2 and, thereafter, the glass insulating layers 3 and 4 are formed. This makes it possible to decrease the change in the resistance of the thick-film resistor 6 after laser trimming and to reduce the laser output.

    摘要翻译： 提供了一种容易地生产具有很小变化的保持高精度电阻的厚多层基板的方法。 陶瓷基板1上的厚膜电阻6在比与其形成的玻璃绝缘层2的烧成温度高的温度下烧成。 这使得可以减少烧结玻璃绝缘层2至4的后续高温步骤中的电阻变化。此外，在玻璃绝缘层2形成在陶瓷基板1上的厚膜电阻器6上之后 通过窗口或玻璃绝缘层2进行激光修整，然后形成玻璃绝缘层3和4。 这使得可以减少激光微调后厚膜电阻6的电阻变化并减少激光输出。

    Reference voltage generating circuit having reduced current consumption with varying loads
    8.
    发明授权
    Reference voltage generating circuit having reduced current consumption with varying loads 失效
    参考电压发生电路具有随着负载变化而具有降低的电流消耗

    公开(公告)号：US5719522A

    公开(公告)日：1998-02-17

    申请号：US814935

    申请日：1997-03-12

    申请人： Mitsuhiro Saitou ,  Hajime Ito ,  Kiyoshi Yamamoto ,  Hiroyuki Ban

    发明人： Mitsuhiro Saitou ,  Hajime Ito ,  Kiyoshi Yamamoto ,  Hiroyuki Ban

    IPC分类号： G05F3/30 ,  G05F3/22 ,  G06F1/26 ,  G11C5/14 ,  G05F1/10

    CPC分类号： G05F3/222 ,  G11C5/147

    摘要： A variable load current supply unit supplies a current to be consumed by a constant voltage output unit to a power source terminal thereof, and supplies a current to be consumed by a load circuit thereto through a reference voltage output terminal. The constant voltage output unit maintains a potential of the power source terminal thereof, i.e., a potential of the reference voltage output terminal, at a fixed potential. A base potential control unit negatively feeds back changes in the potential on the reference voltage output terminal to a base of an emitter follower transistor in the variable load current supply unit. In this way, when the current consumed by the load current is reduced and the potential on the reference voltage output terminal thereby slightly increases the current supplied by the variable load current supply unit decreases.

    摘要翻译： 可变负载电流供给单元将恒定电压输出单元消耗的电流供给到其电源端子，并通过基准电压输出端子向负载电路供给要消耗的电流。 恒定电压输出单元将电源端子的电位即基准电压输出端子的电位维持在固定电位。 基极电位控制单元将可变负载电流供给单元中的基准电压输出端子上的电位的变化负反馈到射极跟随器晶体管的基极。 以这种方式，当负载电流消耗的电流减小并且参考电压输出端子上的电位稍微增加时，可变负载电流供应单元提供的电流减小。

    ELECTRONIC CONTROL UNIT
    9.
    发明申请
    ELECTRONIC CONTROL UNIT 审中-公开
    电子控制单元

    公开(公告)号：US20120326292A1

    公开(公告)日：2012-12-27

    申请号：US13524149

    申请日：2012-06-15

    申请人： Yutaka OHASHI ,  Mitsuhiro Saitou ,  Yuta Uozaki

    发明人： Yutaka OHASHI ,  Mitsuhiro Saitou ,  Yuta Uozaki

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3677 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An electronic control unit includes a substrate, a semiconductor module, a heat storage body, an insulator, and a heat sink. The substrate includes a wiring and a land. The semiconductor module includes a semiconductor chip working as a switching element, a terminal electrically coupled with the semiconductor chip and the wiring, a molded resin sealing the semiconductor chip and the terminal, and a heat radiation plate having a surface exposed from the molded resin and transferring heat generated at the semiconductor chip. The heat storage body has a heat capacity required to store the heat generated at the semiconductor chip. The heat storage body is coupled with the heat radiation plate. The insulator is in contact with the heat storage body or the semiconductor module. The heat sink is in contact with the insulator.

    摘要翻译： 电子控制单元包括基板，半导体模块，蓄热体，绝缘体和散热器。 基板包括布线和焊盘。 半导体模块包括用作开关元件的半导体芯片，与半导体芯片和布线电耦合的端子，密封半导体芯片和端子的模制树脂和具有从模制树脂露出的表面的散热板，以及 传递在半导体芯片处产生的热量。 蓄热体具有存储半导体芯片产生的热量所需的热容量。 蓄热体与散热板连接。 绝缘体与蓄热体或半导体模块接触。 散热器与绝缘体接触。