Wiring board embedded with spherical semiconductor element
    1.
    发明申请
    Wiring board embedded with spherical semiconductor element 审中-公开
    嵌入球形半导体元件的接线板

    公开(公告)号:US20070069393A1

    公开(公告)日:2007-03-29

    申请号:US10565378

    申请日:2004-07-22

    IPC分类号: H01L23/48

    摘要: A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.

    摘要翻译: 通过将球状半导体元件嵌入构成布线板的电绝缘基板中,可以获得具有高密度布线的双面或多层布线板,并且可以使用这种布线板设置薄的电子设备。 此外,可以通过嵌入球形半导体元件来提供能够容纳在有限空间中同时保持所需形式的柔性双面或多层布线板,并且可以使用各种这样的布线来提供薄的电子设备 通过根据需要向这种布线板的期望部件赋予不同类型的柔性。

    Mount assembly, optical transmission line and photoelectric circuit board
    3.
    发明授权
    Mount assembly, optical transmission line and photoelectric circuit board 有权
    安装组件,光传输线和光电路板

    公开(公告)号:US07136543B2

    公开(公告)日:2006-11-14

    申请号:US10879067

    申请日:2004-06-30

    IPC分类号: G02B6/12 H01L3/00

    摘要: A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).

    摘要翻译: 一种安装组件,其放大来自光传输线的光信号,并将光信号传输到另一光传输线,并且不需要在光传输线和安装组件之间的连接部分处的高度精确的垂直度。 通过电连接部分(100a)连接光电转换装置(10a),球形半导体装置(12a)和(12b)和电转换装置(10b) 14),使得由光电转换装置(10a)接收的光被球形半导体器件(12a)和(12b)放大,然后从电光转换装置(10b)发射。