公开(公告)号：US20050006142A1

公开(公告)日：2005-01-13

申请号：US10888140

申请日：2004-07-09

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

公开(公告)号：US20050045369A1

公开(公告)日：2005-03-03

申请号：US10926879

申请日：2004-08-26

申请人： Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/31 ,  H01L23/433 ,  H01L25/16 ,  H05K1/18 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  H05K1/00 ,  B23P19/00

CPC分类号： H05K1/187 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2223/6622 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/8592 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

摘要： A circuit component built-in module includes the following: an electrical insulating substrate made of a first mixture including a filler and a thermosetting resin; a wiring pattern formed on at least a principal surface of the electrical insulating substrate; circuit components that are arranged inside the electrical insulating substrate and connected electrically to the wiring pattern; and vias for electrically connecting the wiring patterns. At least one of the circuit components is mounted using wires. Part or all of the wires is sealed with a second mixture including a filler and a resin. This circuit component built-in module can eliminate a wire failure or short circuit while using a low cost mounting technique such as wire bonding.

摘要翻译： 电路部件内置模块包括：由包括填料和热固性树脂的第一混合物制成的电绝缘基板; 形成在所述电绝缘基板的至少主面上的布线图案; 电路部件布置在电绝缘基板内并与布线图案电连接; 以及用于电连接布线图案的通孔。 使用电线安装至少一个电路部件。 部分或全部电线用包括填料和树脂的第二混合物密封。 该电路部件内置模块可以在使用诸如引线接合的低成本安装技术的同时消除线路故障或短路。

公开(公告)号：US20050002608A1

公开(公告)日：2005-01-06

申请号：US10879067

申请日：2004-06-30

申请人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

发明人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

IPC分类号： G02B6/12 ,  G02B6/02 ,  G02B6/43 ,  H01L23/52 ,  H01L27/00 ,  H01L31/0352 ,  H01L33/20 ,  H01L33/24 ,  G02B6/26

CPC分类号： H01L31/035281 ,  G02B6/43 ,  H01L33/20 ,  H01L33/24 ,  H01L2224/16225 ,  H01L2924/1017 ,  Y02E10/50

摘要： A mount assembly with an excellent handling property which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly is provided. The mount assembly 100 is obtained by connecting a photo-electro conversion device 10a, spherical semiconductor devices 12a and 12b and an electro-photo conversion device 10b through electrical-connection portions 14 so that a light received by the photo-electro conversion device 10a is amplified by the spherical semiconductor devices 12a and 12b and then emitted from the electro-photo conversion device 10b.

摘要翻译： 具有良好处理性能的安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且在光传输线与安装组件之间的连接部分不需要高度精确的垂直度， 提供。 通过电连接部14将光电转换装置10a，球形半导体装置12a，12b与电光转换装置10b连接，由光电转换装置10a接收的光为 由球形半导体器件12a和12b放大，然后从电光转换器件10b发射。

公开(公告)号：US07341890B2

公开(公告)日：2008-03-11

申请号：US11478415

申请日：2006-06-28

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/02 ,  H01L23/12

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

公开(公告)号：US07136543B2

公开(公告)日：2006-11-14

申请号：US10879067

申请日：2004-06-30

申请人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

发明人： Tousaku Nishiyama ,  Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi ,  Seiji Karashima

IPC分类号： G02B6/12 ,  H01L3/00

CPC分类号： H01L31/035281 ,  G02B6/43 ,  H01L33/20 ,  H01L33/24 ,  H01L2224/16225 ,  H01L2924/1017 ,  Y02E10/50

摘要： A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly (100) is obtained by connecting a photo-electro conversion device (10a), spherical semiconductor devices (12a) and (12b) and an electro-photo conversion device (10b) through electrical-connection portions (14) so that a light received by the photo-electro conversion device (10a) is amplified by the spherical semiconductor devices (12a) and (12b) and then emitted from the electro-photo conversion device (10b).

摘要翻译： 一种安装组件，其放大来自光传输线的光信号，并将光信号传输到另一光传输线，并且不需要在光传输线和安装组件之间的连接部分处的高度精确的垂直度。 通过电连接部分（100a）连接光电转换装置（10a），球形半导体装置（12a）和（12b）和电转换装置（10b） 14），使得由光电转换装置（10a）接收的光被球形半导体器件（12a）和（12b）放大，然后从电光转换装置（10b）发射。

公开(公告)号：US20070069393A1

公开(公告)日：2007-03-29

申请号：US10565378

申请日：2004-07-22

申请人： Toshiyuki Asahi ,  Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Seiichi Nakatani ,  Yasuhiro Sugaya

发明人： Toshiyuki Asahi ,  Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Seiichi Nakatani ,  Yasuhiro Sugaya

IPC分类号： H01L23/48

CPC分类号： H01L23/5389 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2924/1017 ,  H05K1/185 ,  H05K1/187

摘要： A double-sided or multilayer wiring board having high-density wiring is obtained by embedding a spherical semiconductor element in an electrically insulating substrate which composes the wiring board, and a thin electronic device can be provided using such a wiring board. Furthermore, a flexible double-sided or multilayer wiring board which is capable of being housed in a limited space while keeping a desired form can be provided by embedding the spherical semiconductor element, and a thin electronic device can be provided using a variety of such wiring boards by imparting different types of flexibility to desired parts of such a wiring board as required.

摘要翻译： 通过将球状半导体元件嵌入构成布线板的电绝缘基板中，可以获得具有高密度布线的双面或多层布线板，并且可以使用这种布线板设置薄的电子设备。 此外，可以通过嵌入球形半导体元件来提供能够容纳在有限空间中同时保持所需形式的柔性双面或多层布线板，并且可以使用各种这样的布线来提供薄的电子设备 通过根据需要向这种布线板的期望部件赋予不同类型的柔性。

公开(公告)号：US07180169B2

公开(公告)日：2007-02-20

申请号：US10926879

申请日：2004-08-26

申请人： Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/48

CPC分类号： H05K1/187 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2223/6622 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/8592 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0187 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754

摘要： A circuit component built-in module includes the following: an electrical insulating substrate made of a first mixture including a filler and a thermosetting resin; a wiring pattern formed on at least a principal surface of the electrical insulating substrate; circuit components that are arranged inside the electrical insulating substrate and connected electrically to the wiring pattern; and vias for electrically connecting the wiring patterns. At least one of the circuit components is mounted using wires. Part or all of the wires is sealed with a second mixture including a filler and a resin. This circuit component built-in module can eliminate a wire failure or short circuit while using a low cost mounting technique such as wire bonding.

摘要翻译： 电路部件内置模块包括：由包括填料和热固性树脂的第一混合物制成的电绝缘基板; 形成在所述电绝缘基板的至少主面上的布线图案; 电路部件布置在电绝缘基板内并与布线图案电连接; 以及用于电连接布线图案的通孔。 使用电线安装至少一个电路部件。 部分或全部电线用包括填料和树脂的第二混合物密封。 该电路部件内置模块可以在使用诸如引线接合的低成本安装技术的同时消除导线故障或短路。

公开(公告)号：US20060244119A1

公开(公告)日：2006-11-02

申请号：US11478415

申请日：2006-06-28

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/02

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子电连接到第二布线图案。

公开(公告)号：US07091593B2

公开(公告)日：2006-08-15

申请号：US10888140

申请日：2004-07-09

申请人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

发明人： Yukihiro Ishimaru ,  Tousaku Nishiyama ,  Yasuhiro Sugaya ,  Toshiyuki Asahi

IPC分类号： H01L23/12 ,  H01L23/02

CPC分类号： H05K1/187 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

摘要翻译： 根据本发明的具有内置电子部件的电路板包括绝缘层，设置在绝缘层的第一主表面上的第一布线图案，设置在与第一主体不同的第二主表面上的第二布线图案 绝缘层的表面，以及设置在绝缘层的内部的诸如半导体芯片等的电子部件。 电子部件包括形成在第一表面上的第一外部连接端子和形成在与第一表面不同的第二表面上的第二外部连接端子。 第一外部连接端子与第一布线图案电连接，第二外部连接端子与第二布线图案电连接。

公开(公告)号：US20070242440A1

公开(公告)日：2007-10-18

申请号：US11578039

申请日：2006-02-01

申请人： Yasuhiro Sugaya ,  Yoshiyuki Yamamoto ,  Toshiyuki Asahi ,  Katsumasa Miki ,  Yoshiyuki Saitou ,  Takeshi Nakayama

发明人： Yasuhiro Sugaya ,  Yoshiyuki Yamamoto ,  Toshiyuki Asahi ,  Katsumasa Miki ,  Yoshiyuki Saitou ,  Takeshi Nakayama

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K1/186 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/10015 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer sequentially formed on one surface or both surfaces of a foil-like metal substrate, and a conductive substance passing through the circuit board across a thickness thereof. The solid electrolytic capacitor is disposed to be held between the plurality of circuit boards. The conductor layer is connected to a grounding electrode formed on the grounding layer, the foil-like metal substrate being connected to a power electrode formed on the power layer.

摘要翻译： 多层基板包括多个电路板，包括具有接地层和功率层的多个布线层，具有绝缘氧化物膜层的固体电解电容器，电解质层和依次形成在一个表面上的导体层 箔状金属基板的表面和穿过电路板的导电物质穿过其厚度。 固体电解电容器设置成保持在多个电路板之间。 导体层与形成在接地层上的接地电极连接，箔状金属基板与形成在电源层上的电力电极连接。