公开(公告)号：US08022518B2

公开(公告)日：2011-09-20

申请号：US12759008

申请日：2010-04-13

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 提供一种具有高散热性和安装连接可靠性的新型半导体器件。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US20100193934A1

公开(公告)日：2010-08-05

申请号：US12759008

申请日：2010-04-13

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/488 ,  H01L23/36

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 提供一种具有高散热性和安装连接可靠性的新型半导体器件。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US20050218494A1

公开(公告)日：2005-10-06

申请号：US11131367

申请日：2005-05-18

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/02

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 提供一种具有高散热性和安装连接可靠性的新型半导体器件。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US08698289B2

公开(公告)日：2014-04-15

申请号：US13216515

申请日：2011-08-24

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： The semiconductor device is high in both heat dissipating property and connection reliability in mounting. The semiconductor device includes a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 半导体器件的散热特性和安装的连接可靠性都很高。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US07728416B2

公开(公告)日：2010-06-01

申请号：US12155479

申请日：2008-06-05

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 提供一种具有高散热性和安装连接可靠性的新型半导体器件。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US20110309487A1

公开(公告)日：2011-12-22

申请号：US13216515

申请日：2011-08-24

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： The semiconductor device is high in both heat dissipating property and connection reliability in mounting. The semiconductor device includes a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 半导体器件的散热特性和安装的连接可靠性都很高。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US20090001559A1

公开(公告)日：2009-01-01

申请号：US12155479

申请日：2008-06-05

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/34

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 提供一种具有高散热性和安装连接可靠性的新型半导体器件。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。

公开(公告)号：US06992385B2

公开(公告)日：2006-01-31

申请号：US10755375

申请日：2004-01-13

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/48

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

公开(公告)号：US20100261316A1

公开(公告)日：2010-10-14

申请号：US12823424

申请日：2010-06-25

申请人： Toshiyuki Hata ,  Takeshi Otani ,  Ichio Shimizu

发明人： Toshiyuki Hata ,  Takeshi Otani ,  Ichio Shimizu

IPC分类号： H01L21/60

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device has a sealing body formed of an insulating resin and a semiconductor chip positioned within the sealing body. A gate electrode and a source electrode are on a first main surface of the semiconductor chip and a back electrode (drain electrode) is on a second main surface thereof. An upper surface of a portion of a drain electrode plate that projects in a gull wing shape is exposed from the sealing body and a lower surface thereof is connected to the back electrode through an adhesive. A gate electrode plate projects in a gull wing shape on an opposite end side of the sealing body and is connected to the gate electrode within the sealing body. A source electrode plate projects in a gull wing shape on the opposite end side of the sealing body and is connected to the source electrode within the sealing body.

摘要翻译： 半导体器件具有由绝缘树脂和位于密封体内的半导体芯片形成的密封体。 栅电极和源电极位于半导体芯片的第一主表面上，背电极（漏电极）在其第二主表面上。 漏极电极板的以鸥翼形突出的部分的上表面从密封体露出，并且其下表面通过粘合剂连接到背电极。 栅电极板在密封体的相对端侧突出为鸥翼形，并且与密封体内的栅电极连接。 源电极板在密封体的相对端侧突出为鸥翼形，并且在密封体内与源电极连接。

公开(公告)号：US20050218498A1

公开(公告)日：2005-10-06

申请号：US11041437

申请日：2005-01-25

申请人： Toshiyuki Hata ,  Takeshi Otani ,  Ichio Shimizu

发明人： Toshiyuki Hata ,  Takeshi Otani ,  Ichio Shimizu

IPC分类号： H01L23/29 ,  H01L23/495

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device superior in heat dissipating performance and permitting reduction of the packaging cost is provided. The semiconductor device comprises a sealing body formed of an insulating resin, a semiconductor chip positioned within the sealing body, the semiconductor chip having a gate electrode and a source electrode on a first main surface thereof and having a back electrode (drain electrode) on a second main surface thereof, a drain electrode plate projecting in a gull wing shape on one end side of the sealing body, an upper surface of a portion of the drain electrode plate which portion is positioned in the sealing body being exposed from the sealing body and a lower surface thereof being connected to the back electrode through an adhesive, a gate electrode plate projecting in a gull wing shape on an opposite end side of the sealing body and being connected to the gate electrode within the sealing body, a source electrode plate projecting in a gull wing shape on the opposite end side of the sealing body and being connected to the source electrode within the sealing body, a depression formed in the surface of the drain electrode plate within the sealing body and filled with the resin which forms the sealing body, and a projecting portion formed on the surface of the drain electrode plate within the sealing body and engaged with the sealing body. The drain electrode plate and the source electrode plate branch into plural branch pieces (leads) serving as gull wing-shaped surface mounting terminals.

摘要翻译： 提供了散热性能优异且能够降低包装成本的半导体装置。 半导体器件包括由绝缘树脂形成的密封体，位于密封体内的半导体芯片，半导体芯片在其第一主表面上具有栅电极和源极，并且在其上具有背电极（漏极） 第二主表面是在密封体的一端侧以鸥翼形突出的漏电极板，漏电极板的位于密封体中的部分的上表面露出密封体， 其下表面通过粘合剂连接到背电极，在密封体的相对端侧以鸥翼形突出并连接到密封体内的栅电极的栅电极板，突出 在密封体的相对端侧具有鸥翼形状，并且与密封体内的源电极连接，形成凹部 在密封体内的漏电极板的表面中填充有形成密封体的树脂，以及形成在密封体内的漏电极板的表面上并与密封体接合的突出部。 漏电极板和源电极板分支成用作鸥翅形表面安装端子的多个分支片（引线）。