Abstract:
The dynamic memory device of the present invention is formed on an integrated semiconductor substrate subjected to alpha radiation and comprises a switching transistor having a switching terminal, an input-output terminal and a memory terminal; a bit line couple to said input-output terminal for supplying a charge to said transistor; a word line coupled to said switching terminal for controlling the switching of said transistor; and, an R-C circuit coupled to the memory terminal and comprising a charge storage capacitor for storing the charge supplied from said bit line and for substantially preventing loss of the stored charge due to particle radiation.
Abstract:
A MOS type semiconductor device effectively supplying potential to a substrate region under the channel forming region of the MOS transistor on an insulating substrate. The potential is supplied to the one conductivity type substrate region under the channel forming region which is provided on an insulating substrate and has an extended portion extending in the channel length direction, through a substrate potential take-out region of one conductivity type connecting to the extended substrate. A gate electrode with an extended gate portion is formed on the substrate region through a gate insulating film, so as to cover the substrate region.
Abstract:
A nonvolatile semiconductor memory device having a gate insulating film with a memory function. An impurity layer having the same conductivity type as that of the substrate region is formed in that substrate region, underlying the gate insulating film having a memory function, in which a channel is formed. The impurity layer has an impurity profile in which a peak of an impurity concentration is in the region distanced by 500 .ANG. or less from the surface of the substrate region and the impurity concentration is 1.times.10.sup.18 cm.sup.-3 or less in the region at the depth of 500 .ANG. or more.
Abstract translation:一种具有具有记忆功能的栅极绝缘膜的非易失性半导体存储器件。 在其中形成沟道的具有记忆功能的栅极绝缘膜下方的衬底区域中形成具有与衬底区域相同的导电类型的杂质层。 杂质层具有杂质浓度在距离衬底区域的表面远离500或更小的区域中的杂质分布,并且在深度的区域中杂质浓度为1×10 18 cm -3或更小 500 ANGSTROM以上。
Abstract:
A silicon nitride layer and a memory gate electrode are successively formed over a portion of a principal surface of a semiconductor substrate between drain and source regions formed therein and adjacent to the drain region via a thin silicon dioxide layer. A portion of the substrate principal surface, to which the source region is contiguous, is covered by a thick silicon dioxide layer, and a selection gate electrode is buried in the thick silicon dioxide layer. This two-input gate transistor construction constitutes a memory cell.
Abstract:
Each end of a power wiring is connected to a first or a second power supply circuit, respectively. These two power supply circuits are activated alternately allowing for some time-overlap. As a result, current flowing in the wiring changes its flowing direction alternately to prevent the degradation of the wiring due to the electro-migration phenomena.
Abstract:
Disclosed is a semiconductor memory device which has a transfer transistor of a MOS structure on a surface of a semiconductor body, and a trenched capacitor having a groove which is formed so as to extend from a surface of the semiconductor body to a certain depth thereof and an electrode which is formed from a bottom portion of the groove to at least a level above an opening of the groove, the source region of the transfer transistor being connected to the electrode of the trenched capacitor and the drain region thereof being connected to a bit line.
Abstract:
A programmable circuit has a fuse element grounded at one end and melted or not melted according to the data to be programmed and a select circuit for selectively producing either of two signals according to "melted" or "not melted" states of the fuse element. The other end of the fuse element is connected through a switching element to the power source terminal, and through a latch circuit to the select circuit. By turning on the switching element at least one time, a level corresponding to a melted state of the fuse element is latched in the latch circuit.
Abstract:
A nonvolatile memory system includes a memory array. The unit memory cell includes a bistable circuit having a pair of bistable output points and at least one pair of variable threshold field effect elements connected to the bistable points. The memory system further includes, decoders for selecting at least one unit cell, a pair of data lines to be connected to the digit lines of the selected unit cell or cells, a first means for driving the decoders to select at least one unit cell, a second means, external to the memory cells, for causing the bistable points in the selected memory cell or cells to be set to a ground reference level through the digit lines, and a third means for causing a read control signal from a corresponding control signal generator to be supplied to the variable threshold field effect elements so as to transfer data stored in the threshold field effect elements to the bistable points. The second means allows the bistable points to be set to the reference potential and any non-volatile memory cell can be read at any desired time during the "ON" state of the power supply source. Since the second means is external to the memory cells, a conventional memory cell array can be used without modification, and no great chip area is required in arranging such cells. During a read or write transfer between the bistable points and non-volatile memory cell sections it is possible to select individual unit cells or all cells at once.
Abstract:
Disclosed is a memory having a p-type semiconductor substrate having a high impurity concentration a p-type semiconductor layer is formed on thereof; a groove which is formed so as to extend from a surface of the semiconductor layer to a position inside the semiconductor substrate; an impurity diffused region which is formed on portions of the semiconductor layer and the semiconductor substrate which define the groove; and an electrode which is formed from the groove to level at least above an opening of the groove through capacitor insulation film, the impurity diffused region, capacitor insulation film and electrode constituting trenched capacitor in which the electrode serves first capacitor electrode and the impurity diffused region serves as a second capacitor electrode.
Abstract:
A memory device having an operating function includes a memory cell array, a register, and a logical opeation circuit. The memory cell array has memory cells arranged in a matrix form of m rows .times.n columns. Data readout or write-in operation with respect to the memory cell array is effected in the unit of n bits of one row. The register has a bit width corresponding to one row of the memory cell array. Data of one row is read out from the memory cell array and is processed by the logical operation circuit together with data stored in the register. The result of operation is written into a desired row of the memory cell array. The memory cell array, register, and logical operation circuit are formed in the same integrated circuit, thus permitting processing such as picture element processing to be effected inside the integrated circuit, without the need to use an external data bus.