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9 条记录 (耗时 0.025 秒)

    Method of eliminating surface stress of silicon wafer
    1.
    发明授权
    Method of eliminating surface stress of silicon wafer 失效
    消除硅晶片表面应力的方法

    公开(公告)号：US07524235B2

    公开(公告)日：2009-04-28

    申请号：US11753222

    申请日：2007-05-24

    申请人： Yuling Liu ,  Jianxin Zhang ,  Weiwei Li ,  Yanyan Huang ,  Yongchao Bian ,  Na Liu

    发明人： Yuling Liu ,  Jianxin Zhang ,  Weiwei Li ,  Yanyan Huang ,  Yongchao Bian ,  Na Liu

    IPC分类号： B24B1/00

    CPC分类号： B28D5/022 ,  H01L21/3043

    摘要： This invention provides a method for eliminating the surface stress of a silicon wafer comprising forming one or more anti-stress groove(s) on the surface of the silicon wafer. These anti-stress grooves can reduce or eliminate the surface stress of silicon wafer effectively to avoid the formation of slip lines and dislocation arrangements, which may induce the p-n junction to conduct or the leakage current to increase. The process is highly efficient and low in cost. It is simple to manage and does not require additional equipment beyond that already used for processing of silicon wafers.

    摘要翻译： 本发明提供了一种消除硅晶片的表面应力的方法，包括在硅晶片的表面上形成一个或多个抗应力槽。 这些抗应力槽可以有效地减少或消除硅晶片的表面应力，以避免形成滑移线和位错布置，这可能导致p-n结导通或漏电流增加。 该过程高效，成本低。 管理简单，不需要超出已经用于硅晶片处理的附加设备。

    Method for removing contaminants from silicon wafer surface
    2.
    发明授权
    Method for removing contaminants from silicon wafer surface 失效
    从硅晶片表面去除污染物的方法

    公开(公告)号：US07578890B2

    公开(公告)日：2009-08-25

    申请号：US11753219

    申请日：2007-05-24

    申请人： Yuling Liu ,  Xinhuan Niu ,  Shengli Wang ,  Juan Wang ,  Weiwei Li ,  Zhenguo Ma

    发明人： Yuling Liu ,  Xinhuan Niu ,  Shengli Wang ,  Juan Wang ,  Weiwei Li ,  Zhenguo Ma

    IPC分类号： B08B3/00 ,  B08B3/12 ,  C25F1/00 ,  C25F3/30

    CPC分类号： H01L21/02052 ,  C11D1/72 ,  C11D3/30 ,  C11D11/0047 ,  C11D11/007

    摘要： Taught is a method of removal surface contaminants, including organic contaminants, metal ions and solid particles, from silicon wafer surface comprising the following steps: (a) submerging the silicon wafer surface in an aqueous cleaning agent solution through which current is passed using a boron-doped diamond film as an electrode; (b) submerging the silicon wafer surface in an aqueous cleaning agent solution; subjecting the silicon wafer to ultrasound waves; and, optionally, heating the solution; (c) submerging the silicon wafer surface in water through which current is passed using a boron-doped diamond film as an electrode; (d) submerging the silicon wafer surface in water with ultrasound and heating; (e) repeating step (d); and (f) spraying the silicon surface with water. The results obtained using the method according to this invention are far superior to those obtained with conventional methods. The technology is simple, convenient to operate, and environmentally friendly.

    摘要翻译： 教授是从硅晶片表面去除表面污染物（包括有机污染物，金属离子和固体颗粒）的方法，包括以下步骤：（a）将硅晶片表面浸入通过其中流过电流的水性清洁剂溶液中 掺杂金刚石膜作为电极; （b）将硅晶片表面浸没在水性清洁剂溶液中; 对硅晶片进行超声波; 和任选地加热溶液; （c）使用掺杂硼的金刚石膜作为电极将硅晶片表面浸入通过电流的水中; （d）用超声波和加热将硅晶片表面浸入水中; （e）重复步骤（d）; 和（f）用水喷涂硅表面。 使用根据本发明的方法获得的结果远远优于用常规方法获得的结果。 技术简单，操作方便，环保。

    Method of polishing copper wiring surfaces in ultra large scale integrated circuits
    4.
    发明授权
    Method of polishing copper wiring surfaces in ultra large scale integrated circuits 有权
    在超大规模集成电路中抛光铜布线表面的方法

    公开(公告)号：US08921229B2

    公开(公告)日：2014-12-30

    申请号：US13592326

    申请日：2012-08-22

    申请人： Yuling Liu ,  Xiaoyan Liu ,  Jun Tian

    发明人： Yuling Liu ,  Xiaoyan Liu ,  Jun Tian

    IPC分类号： H01L21/461 ,  C09K3/14 ,  C09G1/02 ,  H01L21/321

    CPC分类号： H01L21/3212 ,  C09G1/02 ,  C09K3/1463

    摘要： A method of polishing copper wiring surfaces of in ultra large scale integrated circuit, the method including: a) preparing a polishing solution including between 35 and 80 w. % of a nano SiO2 abrasive, between 12 and 60 w. % of deionized water, between 1 and 3 w. % of an oxidant, between 1 and 4 w. % of an active agent, and between 0.5 and 1.5 w. % of a chelating agent; and b) polishing using the polishing solution under following conditions: between 2 and 5 kPa pressure; between 20 and 50° C.; between 120 and 250 mL/min slurry flow rate; and at between 30 and 60 rpm/min rotational speed.

    摘要翻译： 一种在超大规模集成电路中抛光铜布线表面的方法，该方法包括：a）制备包含35至80w的抛光溶液。 ％的纳米SiO2磨料，在12和60瓦之间。 去离子水的百分比在1和3 w之间。 氧化剂的百分比在1至4w之间。 活性剂的百分比，以及0.5至1.5w之间。 ％的螯合剂; 和b）在以下条件下使用抛光溶液进行抛光：压力在2和5kPa之间; 在20和50°C之间。 浆料流速在120-250mL / min之间; 并以30rpm和60rpm / min的转速旋转。

    Use of the effective fraction of alkaloids from mulberry twig in preparing hypoglycemic agents
    5.
    发明授权
    Use of the effective fraction of alkaloids from mulberry twig in preparing hypoglycemic agents 有权
    使用桑叶生物碱的有效部分制备降血糖药

    公开(公告)号：US09066960B2

    公开(公告)日：2015-06-30

    申请号：US12674532

    申请日：2007-08-22

    申请人： Yuling Liu ,  Zhufang Shen ,  Zhen Chen ,  Renyun Wang ,  Xuejun Xia ,  Yueteng Chen ,  Quan Liu ,  Sujuan Sun ,  Mingzhi Xie

    发明人： Yuling Liu ,  Zhufang Shen ,  Zhen Chen ,  Renyun Wang ,  Xuejun Xia ,  Yueteng Chen ,  Quan Liu ,  Sujuan Sun ,  Mingzhi Xie

    IPC分类号： A61K36/605

    CPC分类号： A61K36/605

    摘要： The present invention relates to an effective fraction of alkaloids and the effective fraction is prepared from mulberry twig and its active ingredients are a composition of alkaloids. Determined by HPLC, the percentage of the total alkaloids are 50% or more by weight in the effective fraction and the percentage of the compound 1-deoxynojirimycin is 30% or more by weight in the total alkaloids. The effective fraction of the invention is prepared as the following steps: the mulberry twig is extracted by solvents, and the extract is precipitated by alcohol precipitation or flocculation to remove the impurities, and then concentrated, purified by resin chromatography. The present invention also relates to a pharmaceutical composition containing the said effective fraction of alkaloids and to the use of the effective fraction of alkaloids according to claim 1-4 in preparing hypoglycemic agents.

    摘要翻译： 本发明涉及生物碱的有效部分，有效成分由桑树枝制成，其活性成分是生物碱的组成。 通过HPLC测定，有效部分中总生物碱的百分比为50重量％，化合物1-脱氧野尻霉素的百分比在总生物碱中为30重量％以上。 按照以下步骤制备本发明的有效部分：通过溶剂提取桑树枝，通过醇沉淀或絮凝沉淀提取物以除去杂质，然后浓缩，通过树脂色谱法纯化。 本发明还涉及包含所述生物碱的有效部分的药物组合物，以及根据权利要求1-4的生物碱的有效部分在制备降血糖剂中的用途。

    THE USE OF THE EFFECTIVE FRACTION OF ALKALOIDS FROM MULBERRY TWIG IN PREPARING HYPOGLYCEMIC AGENTS
    8.
    发明申请
    THE USE OF THE EFFECTIVE FRACTION OF ALKALOIDS FROM MULBERRY TWIG IN PREPARING HYPOGLYCEMIC AGENTS 有权
    在制备高效液相色谱法中使用来自多溴二苯醚的碱性物质的有效分馏

    公开(公告)号：US20110130352A1

    公开(公告)日：2011-06-02

    申请号：US12674532

    申请日：2007-08-22

    申请人： Yuling Liu ,  Zhufang Shen ,  Zhen Chen ,  Renyun Wang ,  Xuejun Xia ,  Yueteng Chen ,  Quan Liu ,  Sujuan Sun ,  Mingzhi Xie

    发明人： Yuling Liu ,  Zhufang Shen ,  Zhen Chen ,  Renyun Wang ,  Xuejun Xia ,  Yueteng Chen ,  Quan Liu ,  Sujuan Sun ,  Mingzhi Xie

    IPC分类号： A61K31/7056 ,  A61K31/445 ,  A61K31/40 ,  A61P3/10

    CPC分类号： A61K36/605

    摘要： The present invention relates to an effective fraction of alkaloids and the effective fraction is prepared from mulberry twig and its active ingredients are a composition of alkaloids. Determined by HPLC, the percentage of the total alkaloids are 50% or more by weight in the effective fraction and the percentage of the compound 1-deoxynojirimycin is 30% or more by weight in the total alkaloids. The effective fraction of the invention is prepared as the following steps: the mulberry twig is extracted by solvents, and the extract is precipitated by alcohol precipitation or flocculation to remove the impurities, and then concentrated, purified by resin chromatography. The present invention also relates to a pharmaceutical composition containing the said effective fraction of alkaloids and to the use of the effective fraction of alkaloids according to claim 1-4 in preparing hypoglycemic agents.

    摘要翻译： 本发明涉及生物碱的有效部分，有效成分由桑树枝制成，其活性成分是生物碱的组成。 通过HPLC测定，有效部分中总生物碱的百分比为50重量％，化合物1-脱氧野尻霉素的百分比在总生物碱中为30重量％以上。 按照以下步骤制备本发明的有效部分：通过溶剂提取桑树枝，通过醇沉淀或絮凝沉淀提取物以除去杂质，然后浓缩，通过树脂色谱法纯化。 本发明还涉及包含所述生物碱的有效部分的药物组合物，以及根据权利要求1-4的生物碱的有效部分在制备降血糖剂中的用途。

    Slurry for chemical-mechanical planarization of sapphire and method for manufacturing the same
    9.
    发明授权
    Slurry for chemical-mechanical planarization of sapphire and method for manufacturing the same 有权
    用于蓝宝石化学机械平面化的浆料及其制造方法

    公开(公告)号：US07883557B2

    公开(公告)日：2011-02-08

    申请号：US11753224

    申请日：2007-05-24

    申请人： Yuling Liu ,  Bomei Tan ,  Jianwei Zhou ,  Xinhuan Niu ,  Shengli Wang ,  Jingye Kang ,  Wei Zhang

    发明人： Yuling Liu ,  Bomei Tan ,  Jianwei Zhou ,  Xinhuan Niu ,  Shengli Wang ,  Jingye Kang ,  Wei Zhang

    IPC分类号： B24D3/02 ,  C09C1/68 ,  C09K3/14

    CPC分类号： C09K3/1463 ,  C09G1/02

    摘要： Taught herein is an aqueous chemical-mechanical polishing slurry, a method for manufacturing the same, and a method for using the same in the preparation of high precision finishing of a sapphire surface. The slurry comprises a chelating agent having 13 chelate rings, a strong propensity for complexation with aluminum ions and for forming a water-soluble chelate product. The removal rate can reach 10-16 μm/h, and the roughness can be reduced to 0.1 nm. The slurry components and their weight percentages are as follows: silica sol from about 1 wt. % to about 90 wt. %, alkali modifier from about 0.25 wt. % to about 5 wt. %, ether-alcohol activator from 0.5 wt. % to about 10 wt. %, chelating agent from about 1.25 wt. % to about 15 wt. %, and deionized water. Using such a slurry, high precision finishing of a sapphire surface can be achieved under relevant polishing conditions, which can satisfy the finishing requirements for industrial sapphire substrate. The slurry has the advantages of low cost, low roughness, and high removal rates, and it does not pollute the environment or damage the etching equipment.

    摘要翻译： 本发明是一种水性化学机械抛光浆料，其制造方法，以及用于制备蓝宝石表面的高精度精加工的方法。 浆料包含具有13个螯合环的螯合剂，与铝离子络合的强烈倾向并形成水溶性螯合物。 去除率可以达到10-16μm/ h，粗糙度可以降低到0.1nm。 浆料组分及其重量百分比如下：硅溶胶约1重量％ ％至约90wt。 ％，碱改性剂约0.25wt。 ％至约5wt。 ％，乙醚 - 醇活化剂0.5重量％ ％至约10wt。 ％，螯合剂约1.25wt。 ％至约15wt。 ％和去离子水。 使用这样的浆料，可以在相关的抛光条件下实现蓝宝石表面的高精度精加工，这可以满足工业蓝宝石衬底的精加工要求。 该浆料具有成本低，粗糙度低，去除率高的优点，不会污染环境或损坏蚀刻设备。