公开(公告)号：US20130168068A1

公开(公告)日：2013-07-04

申请号：US13339514

申请日：2011-12-29

申请人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

发明人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

IPC分类号： F28F3/12

CPC分类号： F28F7/02 ,  F28D15/0233 ,  F28F3/12 ,  F28F2013/001 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.

摘要翻译： 冷板包括具有用于热接合发热装置的基座的冷板主体，延伸穿过冷板主体以用于液体冷却剂通过的多个内部通道，在基部和多个内部之间的第一区域 通道，以及多个内部通道之间的第二区域和与多个内部通道大致相对的基座的顶部。 冷板体由第一导热材料制成。 冷板还包括至少一个导热构件，其围绕多个通道从多个通道下方的第一区域延伸到多个通道上方的第二区域。 至少一个导热构件具有比第一导热材料更大的热导率，以将热量从第一区域移动到第二区域。

公开(公告)号：US20130135812A1

公开(公告)日：2013-05-30

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  F28F9/02

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。

公开(公告)号：US20130120926A1

公开(公告)日：2013-05-16

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： G06F1/20 ,  F28F7/00

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US08638559B2

公开(公告)日：2014-01-28

申请号：US13293174

申请日：2011-11-10

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  G06F1/185 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H05K7/20772 ,  H05K7/20809 ,  H01L2924/00

摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。

公开(公告)号：US08587943B2

公开(公告)日：2013-11-19

申请号：US13305092

申请日：2011-11-28

申请人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Richard M. Barina ,  Vinod Kamath ,  Chunjian Ni ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。

公开(公告)号：US20120048529A1

公开(公告)日：2012-03-01

申请号：US12872107

申请日：2010-08-31

申请人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

发明人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

IPC分类号： F28D15/00 ,  F28F27/00

CPC分类号： H05K7/2039 ,  F28F13/16 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

摘要翻译： 用于冷却发热装置的系统包括形成电动力（EHD）空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中，使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势，以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。

公开(公告)号：US08807204B2

公开(公告)日：2014-08-19

申请号：US12872107

申请日：2010-08-31

申请人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

发明人： Michael S. June ,  Chunjian Ni ,  Dana S. Royer ,  Mark E. Steinke

IPC分类号： F25B29/00 ,  F28F7/00 ,  F28D15/00 ,  F28F1/36

CPC分类号： H05K7/2039 ,  F28F13/16 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

摘要： A system for cooling a heat generating device comprises a heat sink and a plurality of ion emitter elements that form an electrohydrodynamic (EHD) air flow device. The heat sink has a base disposed in thermal communication with a heat generating device, such as a processor. A plurality of heat sink fins is coupled to electrical ground to form ion collectors. Ion emitter elements are disposed in a non-planar pattern along first ends of the plurality of fins so that each ion emitter element is equidistant from the first end of a nearest fin. A power supply applies an electrical potential between the plurality of ion emitter elements and the plurality of fins to induce a flow of ions that cause airflow across the heat sink. It is preferable to have at least three ion emitter elements that are equidistant from each fin of the heat sink.

摘要翻译： 用于冷却发热装置的系统包括形成电动力（EHD）空气流动装置的散热器和多个离子发射器元件。 散热器具有与诸如处理器之类的发热装置热连通的基座。 多个散热鳍片耦合到电接地以形成离子收集器。 离子发射器元件沿着多个翅片的第一端设置在非平面图案中，使得每个离子发射器元件与最近翅片的第一端等距。 电源在多个离子发射器元件和多个翅片之间施加电势，以引起使散热器流过散热器的离子流。 优选具有与散热片的每个翅片等距的至少三个离子发射器元件。

公开(公告)号：US20130126145A1

公开(公告)日：2013-05-23

申请号：US13302729

申请日：2011-11-22

申请人： Troy W. Glover ,  Chunjian Ni ,  Whitcomb R. Scott, III ,  Mark E. Steinke

发明人： Troy W. Glover ,  Chunjian Ni ,  Whitcomb R. Scott, III ,  Mark E. Steinke

IPC分类号： F28F7/00

CPC分类号： H01L23/36 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.

摘要翻译： 散热器包括第一导热底座，其具有第一面以热接合发热电子部件，第二导热基座具有在第一面和第二面上的多个翅片以接合第一基座。 第二基座上的翅片可相对于散热器耦合到的发热电子部件的两个取向中的任一个定位。 翅片选择性地放置在最佳地利用可用于散热器的空气流动方向的方向上。 散热片的可取向散热片在电路板上布置发热电子部件或将电路板布置在计算机机箱内时具有灵活性。

公开(公告)号：US09875951B2

公开(公告)日：2018-01-23

申请号：US13302729

申请日：2011-11-22

申请人： Troy W. Glover ,  Chunjian Ni ,  Whitcomb R. Scott, III ,  Mark E. Steinke

发明人： Troy W. Glover ,  Chunjian Ni ,  Whitcomb R. Scott, III ,  Mark E. Steinke

IPC分类号： F28F7/02 ,  H01L23/36 ,  H01L23/40 ,  H01L23/467

CPC分类号： H01L23/36 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.

公开(公告)号：US08444754B2

公开(公告)日：2013-05-21

申请号：US12855737

申请日：2010-08-13

申请人： Michael S. June ,  Chunjian Ni ,  Mark E. Steinke

发明人： Michael S. June ,  Chunjian Ni ,  Mark E. Steinke

IPC分类号： B03C3/36 ,  B03C3/41 ,  B03C3/49

CPC分类号： F04D27/00 ,  B03C3/366 ,  B03C3/368 ,  B03C3/49 ,  B03C2201/04

摘要： An air moving apparatus includes an axial fan and an electrostatic device. The axial fan has a rotatable shaft defining a central axis of the axial fan, a plurality of blades secured to the shaft, and an air inlet opening. The electrostatic device is disposed immediately upstream of the air inlet opening of the axial fan, and includes a collector and an emitter. In one embodiment, the electrostatic device includes a cylindrical collector coupled to ground and has a central axis aligned with the central axis of the axial fan. The electrostatic device further includes a plurality of emitter wires coupled to a terminal of a direct current source and extending lengthwise within the cylindrical collector. During operation of the axial fan, the application of an electrical potential between an emitter and a collector causes ionic air movement radially outwardly away from a central axis of the axial fan.

摘要翻译： 空气移动装置包括轴流风扇和静电装置。 轴流风扇具有限定轴流风扇的中心轴线的可旋转轴，固定在轴上的多个叶片和空气入口。 静电装置设置在轴流风扇的空气入口的紧挨上游，并且包括收集器和发射器。 在一个实施例中，静电装置包括耦合到地面并具有与轴流风扇的中心轴线对准的中心轴线的圆柱形收集器。 静电装置还包括耦合到直流源的端子并且在圆柱形收集器内纵向延伸的多个发射极线。 在轴流风扇的运行期间，在发射器和集电器之间施加电势使离子空气径向向外远离轴流风扇的中心轴。