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    THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS
    1.
    发明申请
    THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS 审中-公开
    具有高电导率热转移温度的热增强冷板

    公开(公告)号：US20130168068A1

    公开(公告)日：2013-07-04

    申请号：US13339514

    申请日：2011-12-29

    申请人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

    发明人： Zhen Huang ,  Vinod Kamath ,  Howard V. Mahaney, JR. ,  Chunjian Ni ,  Mark E. Steinke ,  Jamil A. Wakil

    IPC分类号： F28F3/12

    CPC分类号： F28F7/02 ,  F28D15/0233 ,  F28F3/12 ,  F28F2013/001 ,  H01L23/36 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.

    摘要翻译： 冷板包括具有用于热接合发热装置的基座的冷板主体，延伸穿过冷板主体以用于液体冷却剂通过的多个内部通道，在基部和多个内部之间的第一区域 通道，以及多个内部通道之间的第二区域和与多个内部通道大致相对的基座的顶部。 冷板体由第一导热材料制成。 冷板还包括至少一个导热构件，其围绕多个通道从多个通道下方的第一区域延伸到多个通道上方的第二区域。 至少一个导热构件具有比第一导热材料更大的热导率，以将热量从第一区域移动到第二区域。

    Packaging for multi-processor shared-memory system
    6.
    发明授权
    Packaging for multi-processor shared-memory system 失效

    公开(公告)号：US06541847B1

    公开(公告)日：2003-04-01

    申请号：US10066999

    申请日：2002-02-04

    申请人： Harm P. Hofstee ,  Eric A. Johnson ,  Randall J. Stutzman ,  Jamil A. Wakil

    发明人： Harm P. Hofstee ,  Eric A. Johnson ,  Randall J. Stutzman ,  Jamil A. Wakil

    IPC分类号： H01L2302

    CPC分类号： H01L25/18 ,  H01L23/3735 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/09701

    摘要： An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.

    Method and system for measuring temperature and power distribution of a device
    8.
    发明授权
    Method and system for measuring temperature and power distribution of a device 失效
    测量设备温度和功率分布的方法和系统

    公开(公告)号：US07167806B2

    公开(公告)日：2007-01-23

    申请号：US10919692

    申请日：2004-08-17

    申请人： Hendrik F. Hamann ,  James A. Lacey ,  Martin P. O'Boyle ,  Robert J. von Gutfeld ,  Jamil A. Wakil ,  Alan J. Weger

    发明人： Hendrik F. Hamann ,  James A. Lacey ,  Martin P. O'Boyle ,  Robert J. von Gutfeld ,  Jamil A. Wakil ,  Alan J. Weger

    IPC分类号： G06F15/00

    CPC分类号： H01L22/34 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.

    摘要翻译： 本发明提供了完全操作的电子设备的实时温度和功率映射。 该方法利用红外（IR）温度成像，而IR透明冷却剂直接通过电子设备流经专门设计的单元。 为了确定芯片功率分布，在相同的冷却条件下测量芯片上给定功率和尺寸（通过扫描聚焦激光束实现）的每个热源的各个温度场。 然后，测量的芯片温度分布被表示为这些单个热源的温度场的叠加，并且用一组线性方程计算相应的功率分布。