-
公开(公告)号：US09147665B2
公开(公告)日：2015-09-29
申请号：US12887821
申请日：2010-09-22
申请人： Zhengyu Zhu , Yi Li , FangFang Yang
发明人： Zhengyu Zhu , Yi Li , FangFang Yang
IPC分类号： H01L23/495 , H01L23/00 , B81B7/00
CPC分类号： H01L24/32 , B81B7/0048 , H01L23/49513 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/29116 , H01L2224/29139 , H01L2224/29144 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/48247 , H01L2224/83051 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/0781 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described.
摘要翻译： 描述用于制造半导体器件的芯片附接方法和由这些方法产生的半导体器件。 所述方法包括使用包含接合线的边界特征来提供具有管芯附接焊盘的引线框架，以在管芯附接焊盘上限定周界，在周边内沉积导电材料（例如焊料），然后附接 通过使用导电材料将包含集成电路器件的裸片封装到管芯附接焊盘。 边界特征允许使用导电材料的增加的厚度，导致增加的结合线厚度并增加所得半导体封装的耐久性和性能。 描述其他实施例。
-
公开(公告)号：US07825501B2
公开(公告)日：2010-11-02
申请号：US11935915
申请日：2007-11-06
申请人： Zhengyu Zhu , Yi Li , FangFang Yang
发明人： Zhengyu Zhu , Yi Li , FangFang Yang
IPC分类号： H01L23/495
CPC分类号： H01L23/49513 , H01L24/29 , H01L24/32 , H01L2224/27013 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/83051 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/078 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using boundary features to define a perimeter on the die pad, depositing a conductive material (such as solder) within the perimeter, and then bonding a die containing an integrated circuit to the die pad by using the conductive material. The boundary features allow an increased thickness of conductive material to be used, resulting in an increased bond line thickness and increasing the durability and performance of the resulting semiconductor device.
摘要翻译： 描述用于制造半导体器件的芯片附接方法和由这些方法产生的半导体器件。 这些方法包括：使用边界特征来提供具有管芯附接垫的引线框架，以限定管芯焊盘上的周边，在周边内沉积导电材料（例如焊料），然后将包含集成电路的管芯结合到管芯焊盘 通过使用导电材料。 边界特征允许使用导电材料的厚度增加，导致粘合线厚度增加并且增加所得半导体器件的耐久性和性能。
-
公开(公告)号：US20110037153A1
公开(公告)日：2011-02-17
申请号：US12887821
申请日：2010-09-22
申请人： Zhengyu Zhu , Yi Li , FangFang Yang
发明人： Zhengyu Zhu , Yi Li , FangFang Yang
IPC分类号： H01L23/495 , H01L21/441
CPC分类号： H01L24/32 , B81B7/0048 , H01L23/49513 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29111 , H01L2224/29116 , H01L2224/29139 , H01L2224/29144 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/48247 , H01L2224/83051 , H01L2224/8385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/0781 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described.
摘要翻译： 描述用于制造半导体器件的芯片附接方法和由这些方法产生的半导体器件。 所述方法包括使用包含接合线的边界特征来提供具有管芯附接焊盘的引线框架，以在管芯附接焊盘上限定周界，在周边内沉积导电材料（例如焊料），然后附接 通过使用导电材料将包含集成电路器件的裸片封装到管芯附接焊盘。 边界特征允许使用导电材料的增加的厚度，导致增加的结合线厚度并增加所得半导体封装的耐久性和性能。 描述其他实施例。
-
公开(公告)号：US20090115039A1
公开(公告)日：2009-05-07
申请号：US11935915
申请日：2007-11-06
申请人： Zhengyu Zhu , Yi Li , FangFang Yang
发明人： Zhengyu Zhu , Yi Li , FangFang Yang
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49513 , H01L24/29 , H01L24/32 , H01L2224/27013 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/83051 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/078 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/0665 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using boundary features to define a perimeter on the die pad, depositing a conductive material (such as solder) within the perimeter, and then bonding a die containing an integrated circuit to the die pad by using the conductive material. The boundary features allow an increased thickness of conductive material to be used, resulting in an increased bond line thickness and increasing the durability and performance of the resulting semiconductor device.
摘要翻译： 描述用于制造半导体器件的芯片附接方法和由这些方法产生的半导体器件。 这些方法包括：使用边界特征来提供具有管芯附接垫的引线框架，以限定管芯焊盘上的周边，在周边内沉积导电材料（例如焊料），然后将包含集成电路的管芯结合到管芯焊盘 通过使用导电材料。 边界特征允许使用导电材料的厚度增加，导致粘合线厚度增加并且增加所得半导体器件的耐久性和性能。
-
-
-
搜索结果
4 条记录 (耗时 0.014 秒)
