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    Humidifier
    5.
    发明授权
    Humidifier 有权

    公开(公告)号：US10307559B2

    公开(公告)日：2019-06-04

    申请号：US13980196

    申请日：2012-01-24

    申请人： Roger Mervyn Lloyd Foote ,  Ronald James Huby ,  Andrew Roderick Bath

    发明人： Roger Mervyn Lloyd Foote ,  Ronald James Huby ,  Andrew Roderick Bath

    IPC分类号： A61M16/16 ,  A61M16/10 ,  H05B3/42 ,  A61L9/00 ,  A61M16/08 ,  A61M16/14 ,  A61M16/00

    摘要： A humidifier includes a heating element including a porous structure of electrically resistive and thermally conductive material configured to substantially vaporise liquid that is passed through the porous structure. The porous structure has a liquid inlet and a vapour outlet. The humidifier further includes an outer housing surrounding at least a portion of the porous structure for containing the liquid and vapour within the porous structure. The porous structure includes a first electrical connector and a second electrical connector, the first and second connectors being configured for receiving electrical power and applying a voltage across the porous structure to generate heat.

    Method of bonding selected integrated circuit to adhesive substrate
    8.
    发明授权
    Method of bonding selected integrated circuit to adhesive substrate 失效
    将选定的集成电路粘合到粘合剂基底上的方法

    公开(公告)号：US08030175B2

    公开(公告)日：2011-10-04

    申请号：US12711256

    申请日：2010-02-24

    申请人： Roger Mervyn Lloyd Foote ,  Kia Silverbrook

    发明人： Roger Mervyn Lloyd Foote ,  Kia Silverbrook

    IPC分类号： H01L21/30 ,  H01L21/46

    CPC分类号： H01L21/6835 ,  B41J2/155 ,  B41J2/1607 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1646 ,  H01L21/6836 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2924/19041 ,  H01L2924/3025

    摘要： A method of bonding an integrated circuit to an adhesive substrate. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method includes the steps of: (a) selecting one of the integrated circuits for bonding to the adhesive substrate; (b) positioning the adhesive substrate at a backside of the selected integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the selected integrated circuit; and (d) applying a bonding force from the bonding tool through the film frame tape and the selected integrated circuit onto the adhesive substrate, so as to bond the backside of the selected integrated circuit to the substrate.

    摘要翻译： 将集成电路接合到粘合剂基板的方法。 集成电路是多个集成电路之一，每个集成电路具有可分离地附接到由晶片胶片框架支撑的胶片框架带的相应的前端。 该方法包括以下步骤：（a）选择用于粘合到粘合剂基底的集成电路之一; （b）将粘合剂基底定位在所选择的集成电路的背面; （c）将胶合工具定位在胶卷框带的区域上，该区域与选定的集成电路对准; 以及（d）将来自粘合工具的粘合力通过胶片框架带和所选择的集成电路施加到粘合剂基底上，以将所选择的集成电路的背面粘合到基底上。