公开(公告)号：US20240352044A1

公开(公告)日：2024-10-24

申请号：US18757905

申请日：2024-06-28

申请人： ADEKA Corporation

发明人： Nana OKADA ,  Masako HATASE ,  Akihiro NISHIDA ,  Atsushi SAKURAI

IPC分类号： C07F5/00 ,  C23C16/40 ,  C23C16/455

CPC分类号： C07F5/003 ,  C23C16/405 ,  C23C16/45525

摘要： The present invention provides a metal alkoxide compound represented by the following general formula (1), a thin-film-forming raw material containing the same, and a thin film production method of forming a metal-containing thin film using the raw material:

公开(公告)号：US20240318304A1

公开(公告)日：2024-09-26

申请号：US18575951

申请日：2022-06-27

申请人： ADEKA CORPORATION

发明人： Chiaki MITSUI ,  Masako HATASE

IPC分类号： C23C16/18

CPC分类号： C23C16/18

摘要： A compound is represented by the following general formula (1), a thin-film forming raw material including the compound, a thin-film, and a method of producing a thin-film:






wherein R1 to R4 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R5 and R6 each independently represent an alkyl group having 1 to 5 carbon atoms, A represents an alkanediyl group having 1 to 5 carbon atoms, L represents a group represented by the general formula (L-1) or (L-2) described herein, and M represents a hafnium atom, a zirconium atom, or a titanium atom, provided that in a case of a compound in which R5 and R6 each represent a methyl group, A represents an alkanediyl group having 2 carbon atoms, and M represents a titanium atom, L represents a group represented by the general formula (L-2).

公开(公告)号：US20240317967A1

公开(公告)日：2024-09-26

申请号：US18262521

申请日：2022-01-25

申请人： ADEKA CORPORATION

发明人： Takeshi ENDO ,  Yasuyuki MORI ,  Ken-ichi TAMASO ,  Ryo OGAWA ,  Junji UEYAMA

IPC分类号： C08K5/3415 ,  C08G59/50

CPC分类号： C08K5/3415 ,  C08G59/5073

摘要： A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.

公开(公告)号：US20240308109A1

公开(公告)日：2024-09-19

申请号：US18571124

申请日：2022-06-15

申请人： ADEKA CORPORATION

发明人： Yuji MATSUMOTO ,  Naoto UEDA ,  Shogo MASAI

IPC分类号： B29B7/28 ,  B29B7/18 ,  B29B7/82 ,  B29B9/10 ,  B29K23/00 ,  C08K5/098 ,  C08K5/134 ,  C08K5/3437 ,  C08K5/524

CPC分类号： B29B7/286 ,  B29B7/18 ,  B29B7/82 ,  B29B9/10 ,  C08K5/098 ,  C08K5/134 ,  C08K5/3437 ,  C08K5/524 ,  B29K2023/12 ,  C08K2201/014

摘要： Provided are: a nucleating agent composition capable of imparting excellent mechanical properties to a molded article containing a polyolefin-based resin; a resin composition containing the nucleating agent composition; the molded article having excellent mechanical properties; and a method for manufacturing the resin composition. The nucleating agent composition is characterized by containing at least one type of a nucleating agent for a polyolefin-based resin, wherein a β crystal fraction ranges from 0.2% to 71% as calculated by the following method. Through the use of a sample sampled from the pellets of the resin composition containing the nucleating agent composition, differential scanning calorimetry is performed according to a predetermined program to find a DSC curve, Q=f(θ), with the horizontal axis being temperature θ(° C.) and the vertical axis being heat flow rate Q(mW), and a baseline, g(θ), thereby obtaining a baseline-corrected DSC curve, Q′=h(θ)=f(θ)−g(θ). Subsequently, according to a predetermined procedure, a line area St and a β crystal area Sβ are found, thereby calculating the β crystal fraction (%).





β
⁢

crystal
⁢

fraction

=


S
β

/

S
t

×
100
⁢

(
%
)

公开(公告)号：US20240294734A1

公开(公告)日：2024-09-05

申请号：US18563763

申请日：2022-04-28

申请人： ADEKA CORPORATION

发明人： Tatsuhito NAKAMURA

IPC分类号： C08K5/13 ,  B33Y70/00 ,  C08K5/12 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/524 ,  C08K5/527

CPC分类号： C08K5/13 ,  B33Y70/00 ,  C08K5/12 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/524 ,  C08K5/527 ,  C08K2201/012

摘要： A thermoplastic resin composition for FDM additive manufacturing containing 100 parts by mass of a thermoplastic resin, 0.01 to 5 parts by mass of a primary antioxidant, and 0.01 to 1.4 parts by mass of a secondary antioxidant. The thermoplastic resin is a condensation thermoplastic resin. The primary antioxidant is a phenol antioxidant having at least one structure represented by formula (1). The secondary antioxidant is at least one of a phosphorus antioxidant represented by formula (2), (3), or (4) given in the description and a thioether antioxidant represented by formula (5) or (6) given in the description.




In formula (1), R11 and R12 each independently represent hydrogen or methyl; and * indicates a bond.

公开(公告)号：US20240243010A1

公开(公告)日：2024-07-18

申请号：US18403204

申请日：2024-01-03

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： JIHYUN LEE ,  EUN HYEA KO ,  SOYOUNG LEE ,  THANH CUONG NGUYEN ,  HOON HAN ,  BYUNGKEUN HWANG ,  HIROYUKI UCHIUZOU ,  KIYOSHI MURATA ,  TOMOHARU YOSHINO ,  YOUNJOUNG CHO

IPC分类号： H01L21/768 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3213

CPC分类号： H01L21/76831 ,  H01L21/02183 ,  H01L21/02186 ,  H01L21/0228 ,  H01L21/02301 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/76844

摘要： An inhibitor for selectively depositing a thin film may include a compound represented by Formula 1 below:




where, R1 is an aldehyde group, an amino group, a carbonyl group, a ketone group, a nitrile group, an acyl halide group, a substituted or unsubstituted C2 to C20 alkenyl group, or a substituted or unsubstituted C2 to C20 alkynyl group, R2 is a halogen atom, a substituted or unsubstituted C1 to C10 alkylhalide group, a substituted or unsubstituted C4 to C10 tertiary alkyl group, or a substituted or unsubstituted C1 to C10 alkylthio group, and n is an integer from 1 to 5. The inhibitor is adsorbed to a surface of a first layer but not adsorbed to a surface of a second layer. The first layer may include a metal-based material, and the second layer is different from the first layer and may include an insulating material.

公开(公告)号：US20240060177A1

公开(公告)日：2024-02-22

申请号：US18039411

申请日：2021-11-30

申请人： ADEKA CORPORATION

发明人： Keisuke TAKEDA ,  Masaki ENZU

IPC分类号： C23C16/40 ,  C01G15/00 ,  C07F5/00 ,  C23C16/455

CPC分类号： C23C16/407 ,  C01G15/00 ,  C07F5/00 ,  C23C16/45525

摘要： Provided is an indium compound, which is represented by the following general formula (1):




where R1 and R2 each independently represent, for example, an unsubstituted alkyl group having 1 to 5 carbon atoms, R3 and R4 each independently represent, for example, a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, and A represents a group represented by the following general formula (L-1) or (L-2):




where R11, R12, R13, R14, R21 and R22 each independently represent, for example, a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, and represents a bonding position with C in the general formula (1).

公开(公告)号：US11905388B2

公开(公告)日：2024-02-20

申请号：US17632685

申请日：2020-08-11

申请人： ADEKA CORPORATION

发明人： Yusuke Nuida ,  Hitoshi Hosokawa ,  Hiroshi Morita

IPC分类号： C08K3/08 ,  C08G59/14 ,  C08G59/30 ,  C08G59/32 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  C08L101/00

CPC分类号： C08K3/08 ,  C08G59/1488

摘要： The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 μm, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

公开(公告)号：US20240030037A1

公开(公告)日：2024-01-25

申请号：US18023158

申请日：2021-08-23

申请人： ADEKA CORPORATION

发明人： Yutaro AOKI ,  Masayuki KIMURA ,  Atsushi YAMASHITA

IPC分类号： H01L21/311

CPC分类号： H01L21/31122

摘要： Provided is a method of etching a metal oxide film in a laminate including a substrate and the metal oxide film formed on a surface thereof by an atomic layer etching method, the method including: a first step of introducing, into a treatment atmosphere storing the laminate, at least one oxidizable compound selected from the group consisting of: an alcohol compound; an aldehyde compound; and an ester compound; and a second step of introducing an oxidizing gas into the treatment atmosphere after the first step.

公开(公告)号：US20240026224A1

公开(公告)日：2024-01-25

申请号：US18039802

申请日：2021-12-15

申请人： ADEKA CORPORATION

发明人： Kei ASAI ,  Michio NAKAMURA ,  Genta KOKURA

IPC分类号： C09K21/12 ,  C09K21/04 ,  C08K5/52 ,  C08K3/32

CPC分类号： C09K21/12 ,  C09K21/04 ,  C08K5/5205 ,  C08K3/32 ,  C08K2003/323

摘要： Provided are: a flame retardant agent composition which has excellent flame retardancy as well as an excellent balance of dust suppression and powder flowability; a flame-retardant resin composition containing the same; and a molded article thereof. The flame retardant agent composition contains at least one phosphate compound represented by Formula (1) or (2). When the loose bulk density of the flame retardant agent composition is defined as d (g/cm3), and the 10% cumulative particle size and the 50% cumulative particle size of the flame retardant agent composition in a volume-based particle size distribution are defined as D10 (μm) and D50 (μm), respectively, d, D10 (μm), and D50 (μm) satisfy 0.030≤d/(D50−D10)≤0.110.