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公开(公告)号：US20240347419A1
公开(公告)日：2024-10-17
申请号：US18133505
申请日：2023-04-11
发明人： Sheng-Huang Lin , Chii-Ming Leu
IPC分类号： H01L23/40
CPC分类号： H01L23/4006 , H01L2023/4043 , H01L2023/4087
摘要： A heat dissipation fastener structure includes a support body, a heat sink, a cover body and an operation unit assembly. The support body comprises a window formed on an upper side and support legs extended from a lower side to together define a reciprocating space in communication with the window. The heat sink is formed with perforations at four corners and disposed in the reciprocating space. Threaded locking members, around which elastic members are fitted, are correspondingly passed through the perforations to mount the heat sink above a heat source in a floating state. The cover body is disposed on the support body and comprises at least one vertical folded edge. The operation unit assembly is disposed on the heat sink to drive the cover body to shield the threaded locking members and make the heat sink get close to or away from the heat source.
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公开(公告)号：US12108569B2
公开(公告)日：2024-10-01
申请号：US16867567
申请日：2020-05-06
发明人： Ching-Hang Shen
CPC分类号： H05K7/20336 , F28F21/081 , F28F21/083 , F28F21/085
摘要： A heat dissipation connection structure of handheld device includes an outer frame main body and a two-phase flow heat exchange unit. The outer frame main body has a hollow receiving space at the center. The outer frame main body surrounds the hollow receiving space. The two-phase flow heat exchange unit is disposed in the hollow receiving space and connected with the outer frame main body by means of an injection molding structure member, whereby the outer frame main body and the two-phase flow heat exchange unit can be quickly and securely connected with each other.
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公开(公告)号：US20240175638A1
公开(公告)日：2024-05-30
申请号：US18196416
申请日：2023-05-11
发明人： Xi-Wen Xiong , Lei Yao , Xing-Xing Lyu
CPC分类号： F28D15/0233 , F28D15/046
摘要： A 3D vapor chamber includes a vapor chamber and at least one pipe body. The vapor chamber has an upper plate and a lower plate mated with each other. The upper plate is formed with at least one perforation. An open end of the pipe body is outward expanded to form a lip section in connection with the upper plate. A closed end of the pipe body passes through the perforation of the upper plate. The closed end and the open end together define a tubular chamber in communication with the open end and the vapor chamber. Multiple channels formed on an inner side of the tubular chamber and an inner side of the lip section are in contact and connect with a capillary structure of the inner side of the upper plate so as to increase back flowing speed of a working fluid and enhance heat dissipation performance.
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公开(公告)号：US20240162108A1
公开(公告)日：2024-05-16
申请号：US18196413
申请日：2023-05-11
发明人： Yuan-Yi Lin , Fu-Kuei Chang
IPC分类号： H01L23/367
CPC分类号： H01L23/3672
摘要： A knockdown heat sink structure includes a carrier body with a high-temperature section in contact with at least one heat source. A non-high-temperature section of the carrier body has a first radiating fin assembly, while a higher second radiating fin assembly is on the high-temperature section. The second radiating fin assembly has a first part higher than the height of the first radiating fin assembly, and a second part that outward spreads and extends from a top end of the first part and covers the first assembly without touching it, creating a spacing flow way. Therefore, the structure increases the heat dissipation area for the high-temperature section, allowing for faster heat dissipation.
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公开(公告)号：US20230422443A1
公开(公告)日：2023-12-28
申请号：US18172323
申请日：2023-02-22
发明人： Sheng-Huang Lin
IPC分类号： H05K7/20
CPC分类号： H05K7/20336
摘要： A vapor chamber structure includes a main body. The main body has multiple independent heat dissipation blocks. Each of the heat dissipation blocks has an internal independent airtight chamber. A capillary structure is disposed on an inner wall face of the airtight chamber. A working fluid is filled in the airtight chamber. Multiple connection bodies are disposed between the independent heat dissipation blocks to connect the independent heat dissipation blocks with each other. At least one heat insulation penetrating slot is formed between each two adjacent connection bodies to separate the heat dissipation blocks from each other so as to achieve heat insulation effect. By means of the heat insulation penetrating slots formed on the connection bodies, the respectively airtight chambers can independently conduct heat without transferring heat to each other.
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公开(公告)号：US20230422442A1
公开(公告)日：2023-12-28
申请号：US18138126
申请日：2023-04-24
发明人： Qian-Cheng Lin
IPC分类号： H05K7/20
CPC分类号： H05K7/20336
摘要： A support structure of heat dissipation unit is applicable in a heat dissipation unit. Two sides of the heat dissipation unit are respectively formed with a condensation side and an evaporation side. Two ends of the support structure respectively abut against and connect with the condensation side and the evaporation side. The support structure includes a base section and a thorny section. The base section has a contact face and a support face. The thorny section is composed of multiple thorny columns arranged on the support face of the base section in an array. The thorny columns are arranged at intervals, whereby a passage is defined between each two adjacent thorny columns. The support structure with the thorny section serves to speed vapor-liquid circulation in the heat dissipation unit and increase flowing speed of the working fluid so as to greatly enhance heat dissipation performance.
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公开(公告)号：US11832380B2
公开(公告)日：2023-11-28
申请号：US17465787
申请日：2021-09-02
发明人： Sung-Wei Sun , Ming-Che Lee
CPC分类号： H05K1/0209 , H05K1/117 , H05K7/20172 , H05K2201/10189
摘要： A fan structure automatically mountable on a system circuit board includes a fan. The fan includes a fan frame main body. A connector connection section is disposed on the fan frame main body for connecting with a fan end connector, whereby the fan end connector can be assembled with the fan frame main body. Accordingly, when the fan is mounted on the system circuit board, the fan end connector can be directly pressed down by means of an automated device to plug into the circuit board end connector. Therefore, the manufacturing process can be automated.
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公开(公告)号：US11817372B2
公开(公告)日：2023-11-14
申请号：US16849968
申请日：2020-04-15
发明人： Sheng-Huang Lin
IPC分类号： H01L23/427 , F28D15/04 , F28D15/02 , F28D5/02
CPC分类号： H01L23/427 , F28D15/0275 , F28D15/04
摘要： A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.
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公开(公告)号：US20230353004A1
公开(公告)日：2023-11-02
申请号：US18058739
申请日：2022-11-24
申请人： Jing-Ping Huang , Feng Liu
发明人： Jing-Ping Huang , Feng Liu
摘要： A fan structure includes a fan frame having a base and a shaft barren vertically upward extended from the base; a motor stator enclosure having a top provided with a shaft hole and an open bottom correspondingly covering and connecting to a top of the base, such that the motor stator enclosure, the shaft barrel and the base together define a potting space among them; a potting opening selectively provided on the base or the motor stator enclosure to communicate with the potting space; a motor stator externally fitted around the shaft barrel and located in the potting space; and a potting compound filled in the potting space to cover the motor stator. With the above arrangements, the fan structure overcomes the problem in conventional inconvenient fan potting process to largely reduce production costs, production time, bad yield rate, and reworking.
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公开(公告)号：US20230243603A1
公开(公告)日：2023-08-03
申请号：US18064293
申请日：2022-12-12
发明人： Sheng-Huang Lin , Yuan-Yi Lin
CPC分类号： F28F3/027 , F28D15/0275 , F28D21/00 , F28D2021/0029
摘要： A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.
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