BIPV-APPLICABLE HIGH-POWER SHINGLED PHOTOVOLTAIC MODULE AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20250040260A1

    公开(公告)日:2025-01-30

    申请号:US18715734

    申请日:2022-11-22

    Abstract: Disclosed are a BIPV-applicable high-power shingled photovoltaic module and a manufacturing method therefor, the module comprising: a solar panel having a shingled array structure; a first sealant stacked on the solar panel so as to protect the solar panel; a second sealant stacked under the solar panel in order to protect the solar panel; a front cover through which the sunlight passes, and which is stacked on the first sealant so as to protect the first sealant; and a first back sheet stacked under the second sealant in order to protect the solar panel from the outside environment, and thus aesthetic impression and reflectance reduction of a high-power shingled photovoltaic module are increased so that use as an external design element of a building is possible.

    CARRIER-SELECTIVE CONTACT JUNCTION SILICON SOLAR CELL AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20230307569A1

    公开(公告)日:2023-09-28

    申请号:US18327071

    申请日:2023-06-01

    Abstract: A method of manufacturing a carrier-selective contact junction silicon solar cell includes: preparing a conductive silicon substrate; forming a first passivation layer and a second passivation layer on and under the conductive silicon substrate, respectively; forming an electron-selective contact layer under the second passivation layer; forming a hole-selective contact layer on the first passivation layer; forming an upper transparent electrode on the hole-selective contact layer; forming an upper metal electrode on the upper transparent electrode; and forming a lower metal electrode under the electron-selective contact layer. In forming the hole-selective contact layer, a sandwich-structured multilayer film is formed by depositing a copper iodide thin film on a top surface and a bottom surface of an iodine thin film, and a single-film copper iodide thin film is formed by low-temperature annealing the sandwich-structured multilayer film.

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