公开(公告)号：US20200273327A1

公开(公告)日：2020-08-27

申请号：US16328264

申请日：2017-08-25

申请人： KYOCERA Corporation

发明人： Yasuhiro UENO ,  Shigeki TANABE ,  Hideki MORITA ,  Isao MASUIKE ,  Koutaro YAMAUCHI ,  Manabu SAKUMA

IPC分类号： G08G1/01 ,  G01S19/14 ,  G08G1/16 ,  G01C21/28

摘要： Provided is an electronic device including a communication unit, an acquisition unit, and a controller. The communication unit communicates a roadside unit associated with a pedestrian overpass to acquire height information of the pedestrian overpass from the roadside unit. The acquisition unit acquires height calculation information for calculating the height information of the electronic device. The controller determines whether a user of the electronic device is crossing the pedestrian overpass based on the height information of the electronic device calculated based on the height calculation information and the height information of the pedestrian overpass.

公开(公告)号：US12132142B2

公开(公告)日：2024-10-29

申请号：US17434253

申请日：2020-02-28

申请人： KYOCERA Corporation

发明人： Katsuaki Masaki ,  Kentaro Murakawa

IPC分类号： H01L33/00 ,  H01L23/00 ,  H01L33/40

CPC分类号： H01L33/0093 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/40 ,  H01L2224/05073 ,  H01L2224/05171 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/08123 ,  H01L2224/08145 ,  H01L2224/08147 ,  H01L2224/80365 ,  H01L2224/80801 ,  H01L2933/0016

摘要： A method of manufacturing a semiconductor element according to the present disclosure includes an element forming step (S1) of forming, on an underlying substrate (11), a semiconductor element (15) connected to the underlying substrate (11) via a connecting portion (13b) and including an upper surface (15a) inclined with respect to a growth surface of the underlying substrate (11), a preparing step (S2) of preparing a support substrate (16) including an opposing surface (16c) facing the underlying substrate (11), a bonding step (S3) of pressing the upper surface (15a) of the semiconductor element (15) against the opposing surface (16c) of the support substrate (16) and heating the upper surface (15a) to bond the upper surface (15a) of the semiconductor element (15) to the support substrate (16), and a peeling step (S4) of peeling the semiconductor element (15) from the underlying substrate (11).

公开(公告)号：US20240356522A1

公开(公告)日：2024-10-24

申请号：US18687518

申请日：2022-08-31

申请人： KYOCERA Corporation

发明人： Motoki ITO

IPC分类号： H03H9/145 ,  H03H9/02 ,  H03H9/25 ,  H03H9/64 ,  H03H9/72

CPC分类号： H03H9/14544 ,  H03H9/02559 ,  H03H9/02574 ,  H03H9/02637 ,  H03H9/02866 ,  H03H9/25 ,  H03H9/6483 ,  H03H9/725

摘要： An acoustic wave device includes a piezoelectric layer made of a piezoelectric crystal and an interdigital transducer (IDT) electrode on an upper surface of the piezoelectric layer. The IDT electrode includes multiple electrode fingers. A normalized thickness D1/p of the piezoelectric layer and a duty d of the IDT electrode have a relationship expressed by 0.166≤d×D1/p≤0.241 . . . (1), where p is a repetition interval between centers of the multiple electrode fingers, and D1 is a thickness of the piezoelectric layer.

公开(公告)号：US20240355845A1

公开(公告)日：2024-10-24

申请号：US18686337

申请日：2022-08-17

申请人： KYOCERA Corporation

发明人： Kenichi KOHAMA

IPC分类号： H01L27/146

CPC分类号： H01L27/14618

摘要： In the present disclosure that provides an electronic element mounting substrate capable of reducing the possibility of a change in a size of an element mounting surface even when a position shift occurs at a time of layering a plurality of frame portions, the electronic element mounting substrate includes a base, a first frame portion, and a second frame portion. The first frame portion includes at least one set of a first protrusion portion and a second protrusion portion each protruding further than the second frame portion to a side of an element mounting portion on which an element is mounted. A protrusion width of the first protrusion portion is larger than a protrusion width of the second protrusion portion, and a distance between the first protrusion portion and the element mounting portion is smaller than a distance between the second protrusion portion and the element mounting portion.

公开(公告)号：US20240354951A1

公开(公告)日：2024-10-24

申请号：US18759250

申请日：2024-06-28

申请人： KYOCERA Corporation ,  The University of Tokyo

发明人： Kenichi WATANABE ,  Masayuki KYOMOTO ,  Shintaro HONDA ,  Toru MORO ,  Sakae TANAKA

IPC分类号： G06T7/00 ,  A61B6/50 ,  G06T7/11

CPC分类号： G06T7/0012 ,  A61B6/505 ,  G06T7/11 ,  G06T2207/10116 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30008 ,  G06T2207/30096

摘要： An estimation apparatus includes an input unit and an approximator. Input information including an image in which a bone appears is input into the input unit. The approximator is configured to determine an estimation result related to bone density of the bone from the input information. The approximator includes a learned parameter to obtain the estimation result.

公开(公告)号：US20240349937A1

公开(公告)日：2024-10-24

申请号：US18575200

申请日：2022-06-29

申请人： KYOCERA Corporation

发明人： Takanori NISHIHARA ,  Masatoshi MACHIDA

IPC分类号： A47J36/02 ,  A47J37/10

CPC分类号： A47J36/02 ,  A47J37/10

摘要： A cooking tool includes a base member including a cooking region on one surface, and a coating film layer deposited on the one surface of the base member. The coating film layer includes a primer layer disposed on the base member side, a topcoat layer disposed on an outermost surface, and at least one intermediate layer disposed between the primer layer and the topcoat layer. The topcoat layer and the at least one intermediate layer are made of fluorine-based resin, and ceramic particles having different shapes are located across the topcoat layer and the at least one intermediate layer in a cross-sectional view.

公开(公告)号：US20240349133A1

公开(公告)日：2024-10-17

申请号：US18752276

申请日：2024-06-24

申请人： KYOCERA Corporation

发明人： Masato FUJISHIRO

IPC分类号： H04W36/00 ,  H04W36/36

CPC分类号： H04W36/0061 ,  H04W36/362

摘要： A handover control according to a first aspect is a method for performing conditional handover of user equipment from a source cell to which the user equipment is connected to a target cell. The handover control method comprises receiving, by the user equipment, from the source cell, an RRC message for handover, the RRC message including identifiers of a plurality of candidate cells being candidates for the target cell; and transmitting, by the user equipment, a report message including information related to a radio link failure detected in the source cell, to a cell to which the user equipment connects after the radio link failure. The report message includes the identifiers of all the candidate cells included in the RRC message.

公开(公告)号：US20240348344A1

公开(公告)日：2024-10-17

申请号：US18755678

申请日：2024-06-27

申请人： KYOCERA CORPORATION

发明人： Masaki NAKAO

IPC分类号： H04B10/80

CPC分类号： H04B10/80

摘要： An underwater communication apparatus that performs underwater visible light communication includes: a plurality of light emitting regions configured to emit visible light in respective different directions and including respective light emitters; a plurality of light receivers configured to detect visible light incident on each of the plurality of light emitting regions; and a controller configured to control the respective light emitters to selectively cause part of the plurality of light emitting regions to emit light, depending on a status of detection of incident visible light at the plurality of light receivers.

公开(公告)号：US20240348003A1

公开(公告)日：2024-10-17

申请号：US18292721

申请日：2022-07-27

申请人： KYOCERA CORPORATION

发明人： Kentaro MURAKAWA ,  Takeshi KAMIKAWA ,  Yoshinobu KAWAGUCHI

IPC分类号： H01S5/02 ,  H01S5/042 ,  H01S5/22 ,  H01S5/323

CPC分类号： H01S5/0202 ,  H01S5/0203 ,  H01S5/0217 ,  H01S5/04256 ,  H01S5/2201 ,  H01S5/32341 ,  H01S2304/12

摘要： A manufacturing method for a semiconductor device includes a step of preparing a main substrate, a base semiconductor part formed above the main substrate, and a compound semiconductor part formed on the base semiconductor part, and a step of isolating the base semiconductor part and the compound semiconductor part with a cavity surface formed at least in the compound semiconductor part, and isolating the base semiconductor part and the compound semiconductor part into multiple element portions.

公开(公告)号：US20240345912A1

公开(公告)日：2024-10-17

申请号：US18292545

申请日：2022-08-01

申请人： KYOCERA Corporation

发明人： Saki AYASHIRO ,  Tomonari OGAMI ,  Koji KURATA

IPC分类号： G06F11/07 ,  G06F11/14

CPC分类号： G06F11/079 ,  G06F11/0778 ,  G06F11/1438

摘要： To take measures to cause an event not to occur before the event occurs. A prediction device includes an acquiring unit configured to acquire time-series data at a predetermined cycle and a prediction unit configured to perform a first prediction for predicting first time-series data for a first period after a prediction execution time point in accordance with past time-series data for a period before the prediction execution time point and a second prediction for predicting second time-series data after the first period in accordance with the past time-series data and the first time-series data.