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公开(公告)号:US20240276690A1
公开(公告)日:2024-08-15
申请号:US18628288
申请日:2024-04-05
发明人: Karen BRUZDA , John David RYAN , Hoang Dinh DO
IPC分类号: H05K9/00
CPC分类号: H05K9/0083
摘要: Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 5 Watts per meter per Kelvin (W/mK). The thermally-conductive EMI absorber may have an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher. Or the thermally-conductive EMI absorber may have an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz.
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2.
公开(公告)号:US20240268090A1
公开(公告)日:2024-08-08
申请号:US18427243
申请日:2024-01-30
发明人: Yuqin Li
IPC分类号: H05K9/00
CPC分类号: H05K9/0083
摘要: The present disclosure relates to the use of silicone carbinols as components in composites, such as polymer-inorganic composites useful for the management of heat and/or electromagnetic interference (EMI) and other polymer-inorganic composites used for other purposes. In exemplary embodiments, silicone carbinol is added to a composite in an amount sufficient for increasing flow rate of the composite. The increased flow rate of the composite enables a useful increase in functional filler content, which, in turn, allows increased benefits related to performance. For example, functional filler loadings/particle concentrations may be increased in a thermal and/or EMI management material for higher thermal and/or electrical conductivity as the silicone carbinol helps to retain a desired dispensing flow rate for the composite despite the higher functional filler loadings/particle concentrations in the composite.
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3.
公开(公告)号:US20240250416A1
公开(公告)日:2024-07-25
申请号:US18603420
申请日:2024-03-13
CPC分类号: H01Q1/422 , B32B3/12 , B32B5/024 , B32B5/18 , B32B5/245 , B32B7/025 , B32B27/12 , B32B2250/03 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0253 , B32B2262/0269 , B32B2264/107 , B32B2307/204 , B32B2307/3065 , B32B2307/54 , B32B2307/558 , B32B2307/706 , B32B2307/712
摘要: Exemplary embodiments are disclosed of low dielectric, low loss radomes. Also disclosed are materials and methods for making low dielectric, low loss radomes.
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公开(公告)号:US12040306B2
公开(公告)日:2024-07-16
申请号:US16988919
申请日:2020-08-10
发明人: Jason L. Strader , Michael S. Wladyka , Keith David Johnson , Jingting Yang , Kevin Joel Bohrer , Mark D. Kittel
IPC分类号: H01L21/67 , B32B37/00 , B32B38/00 , B32B38/06 , H01L21/48 , H01L23/00 , H01L23/367 , H01L23/373 , H01L23/552 , B23P15/20 , B23P15/26 , H01L21/683 , H01L31/0203
CPC分类号: H01L24/743 , B32B37/025 , B32B38/0004 , B32B38/06 , H01L21/4882 , H01L21/67132 , H01L23/3675 , H01L23/3737 , H01L23/552 , H01L24/27 , H01L24/97 , B23P15/20 , B23P15/26 , B32B2457/00 , H01L21/6835 , H01L24/73 , H01L31/0203 , H01L2224/27436 , H01L2224/27602 , H01L2224/32245 , H01L2224/83192 , Y10T29/53178 , Y10T29/53265
摘要: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.
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公开(公告)号:US20240105663A1
公开(公告)日:2024-03-28
申请号:US18374770
申请日:2023-09-29
IPC分类号: H01L23/00 , F28F13/00 , H01L23/433
CPC分类号: H01L24/29 , F28F13/003 , H01L23/4334 , H01L24/27 , H01L24/83 , H01L23/3731 , H01L2224/29005 , H01L2224/29187 , H01L2224/29191 , H01L2224/29195 , H01L2224/29387 , H01L2224/29391 , H01L2924/3025
摘要: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
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公开(公告)号:USD1000986S1
公开(公告)日:2023-10-10
申请号:US29781612
申请日:2021-04-30
摘要: FIG. 1 is an upper perspective view of a frame for a shielding assembly showing our new design;
FIG. 2 is a lower perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a back elevation view thereof;
FIG. 7 is a left side elevation view thereof; and,
FIG. 8 is a right side view thereof.
In the drawings, the details shown in broken lines depict environmental subject matter only and form no part of the claimed design.-
公开(公告)号:USD998827S1
公开(公告)日:2023-09-12
申请号:US29731731
申请日:2020-04-17
摘要: FIG. 1 is a perspective view of a material having edge shape showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having edge shape of FIG. 1, taken along lines 2-2 in FIG. 1;
FIG. 3 is a front elevation view of the material having edge shape of FIG. 1;
FIG. 4 is a rear elevation view of the material having edge shape of FIG. 1;
FIG. 5 is a top plan view of the material having edge shape of FIG. 1;
FIG. 6 is a right side elevation view of the material having edge shape of FIG. 1; and,
FIG. 7 is a left side elevation view of the material having edge shape of FIG. 1.
The evenly spaced broken lines in FIGS. 1 through 7 represent portions of the material having edge shape and form no part of the claimed design. The material having edge shape is shown with a symbolic break in its length and width. The appearance of any portion of the material having edge shape between the break lines forms no part of the claimed design.-
公开(公告)号:US11610831B2
公开(公告)日:2023-03-21
申请号:US17197611
申请日:2021-03-10
发明人: Jason L. Strader , Richard F. Hill
IPC分类号: H01L23/42 , H01L23/367 , H01L23/427 , B23P15/26
摘要: According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
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公开(公告)号:US11276662B2
公开(公告)日:2022-03-15
申请号:US16513031
申请日:2019-07-16
IPC分类号: H01L23/00 , F28F13/00 , H01L23/433 , H01L23/373 , C08J9/12
摘要: Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.
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公开(公告)号:US11173934B2
公开(公告)日:2021-11-16
申请号:US16146527
申请日:2018-09-28
发明人: Jeremy Jovenall
摘要: A control unit for controlling a rolling stock includes a user interface. The control unit is configured to receive, via the user interface, a plurality of user inputs corresponding to a plurality of users servicing the rolling stock, determine whether at least one user of the plurality of users remains servicing the rolling stock, and if at least one user of the one or more users remains servicing the rolling stock, prevent unauthorized movement of the rolling stock. Other example control units, computer systems including one or more control units, and computer-implemented methods for preventing unauthorized movement of a rolling stock are also disclosed.
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