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公开(公告)号：US12130157B2
公开(公告)日：2024-10-29
申请号：US17804944
申请日：2022-06-01
发明人： Kazumasa Takai
IPC分类号： G01D5/16
CPC分类号： G01D5/16
摘要： Implementations of a resolver sensor system may include a signal amplifier portion configured to be coupled to a magnetoresistive sensor coupled with a movable element where the signal amplifier portion configured to receive a sine signal and a cosine signal from the magnetoresistive sensor; and a sensor offset canceling portion coupled with a signal amplifier portion. The sensor offset canceling portion may be configured to generate a direct current offset correction signal to the signal amplifier portion which uses two or more amplifiers included in the signal amplifier portion to receive the sine signal and the cosine signal and to generate corresponding adjusted digital sine and cosine signals. The signal amplifier portion may be configured to provide the adjusted digital sine signal and the adjusted digital cosine signal to one of the servo signal processor or the system controller for use in determining a position of the movable element.
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公开(公告)号：US20240353537A1
公开(公告)日：2024-10-24
申请号：US18762256
申请日：2024-07-02
发明人： Steven John BUCKLEY
IPC分类号： G01S7/4861 , G01S17/10 , G04F10/00
CPC分类号： G01S7/4861 , G01S17/10 , G04F10/005
摘要： Various embodiments of the present technology may provide methods and apparatus for repetitive histogramming. The apparatus may provide a limited number of physical bins to perform multiple histograms on a total number of virtual bins. The apparatus may provide a single physical bin that is used to sweep over the total number of virtual bins.
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公开(公告)号：US12123980B2
公开(公告)日：2024-10-22
申请号：US16948380
申请日：2020-09-16
IPC分类号： G01S7/4865 , G01S7/481 , G01S17/10
CPC分类号： G01S7/4865 , G01S7/4814 , G01S7/4816 , G01S17/10
摘要： An imaging system may include a silicon photomultiplier with single-photon avalanche diodes (SPADs). The imaging system may be a LIDAR imaging system with LIDAR processing circuitry. To reduce memory requirements in the LIDAR processing circuitry, a dynamic resolution storage scheme may be used. The LIDAR processing circuitry may include autonomous dynamic resolution circuitry that receives input from a time-to-digital converter (TDC). The autonomous dynamic resolution circuitry may include a plurality of memory banks having different resolutions. Based on the magnitude of the input from the TDC, an appropriate memory bank may be selected. In parallel, an address encoder may select a memory bin based on the input from the TDC.
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公开(公告)号：US20240348991A1
公开(公告)日：2024-10-17
申请号：US18341993
申请日：2023-06-27
IPC分类号： H04R25/00
CPC分类号： H04R25/407 , H04R25/505
摘要： Audio communication methods, devices, and systems are provided with an ultra-low latency communications protocol. One illustrative communication method suitable for a primary hearing instrument includes: transmitting a preamble packet to initiate a wireless connection; after receiving a preamble response packet, wirelessly sending a downlink stream of audio data frames; and wirelessly receiving an uplink stream of audio data frames. The audio data frames of the downlink stream and the uplink stream each consist of a message packet, a check packet, and multiple single-sample audio data packets, and these packets exclude any preambles or sync words. The audio data frame packets of the downlink stream and the uplink stream are interleaved with each other.
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公开(公告)号：US20240348243A1
公开(公告)日：2024-10-17
申请号：US18301952
申请日：2023-04-17
发明人： Karel PTACEK , Jaroslav KNOP
IPC分类号： H03K17/082 , H02M1/08 , H02M7/537
CPC分类号： H03K17/0822 , H02M1/08 , H02M7/537 , H03K2217/0063 , H03K2217/0072
摘要： Operating a gate driver. At least one example is a method of operating the gate driver, the method comprising: de-asserting a drive-low terminal of the gate driver; starting a single timer within the gate driver; and after expiration of the single timer asserting a drive-high terminal of the gate driver responsive to assertion of an in-high terminal of the gate driver; and then de-asserting the drive-high terminal; starting the single timer; and after a second expiration of the single timer asserting the drive-low terminal responsive to assertion of an in-low terminal of the gate driver.
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公开(公告)号：US20240348142A1
公开(公告)日：2024-10-17
申请号：US18300646
申请日：2023-04-14
发明人： Basil ALMUKHTAR
CPC分类号： H02M1/0032 , H02M1/083
摘要： A multi-phase power converter includes a digital ramp pulse modulation controller, a digital constant on-time controller, and a driver stage. The digital ramp pulse modulation controller provides a trigger ramp signal in response to an error signal when the multi-phase power converter is not in a green mode, wherein at least a portion of the digital ramp pulse modulation controller is inactive in the green mode. The digital constant on-time controller provides on-time thresholds and off-time thresholds when the multi-phase power converter is in the green mode. The driver stage provides a plurality of drive signals to a corresponding plurality of power stages in response to the trigger ramp signal when the multi-phase power converter is not in the green mode and to the on-time thresholds and the off-time thresholds when the multi-phase power converter is in the green mode.
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公开(公告)号：US12113445B2
公开(公告)日：2024-10-08
申请号：US18371332
申请日：2023-09-21
发明人： Anders Lind
CPC分类号： H02M3/1588 , H02M1/0009 , H02M1/083 , H02M1/32 , H02M1/42 , H02M1/4225 , H02M7/219 , H02M1/4233
摘要： A method of detecting zero crossings in an AC input voltage at an input of a power converter includes measuring, at a first time, a first voltage. If the first voltage is positive: determining that the first time corresponds to a positive half-cycle of the AC input voltage. If the first voltage is equal to zero: a) determining that the first time corresponds to a negative half-cycle of the AC input voltage; b) turning on a high-side switch of the power converter for a first time period; and c) measuring, during the first time period, a second voltage. If the second voltage is less than a first threshold, turning off the high-side switch and repeating b) and c) after a time delay. If the second voltage is less than a second threshold, maintaining the high-side switch in an ON state for a second time period.
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8.发明授权公开(公告)号：US12113138B2
公开(公告)日：2024-10-08
申请号：US18194714
申请日：2023-04-03
IPC分类号： H01L31/02 , G02B3/06 , H01L27/146 , H01L31/0232 , H01L31/055 , H01L31/107 , H04N25/63
CPC分类号： H01L31/02027 , G02B3/06 , H01L27/14605 , H01L27/14621 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14643 , H01L27/14649 , H01L31/02327 , H01L31/055 , H01L31/107 , H01L27/1464 , H04N25/63
摘要： An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. The light scattering structures may include a low-index material formed in trenches in the semiconductor substrate. One or more microlenses may focus light onto the semiconductor substrate. Areas of the semiconductor substrate that receive more light from the microlenses may have a higher density of light scattering structures to optimize light scattering while mitigating dark current.
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9.发明授权公开(公告)号：US12113101B2
公开(公告)日：2024-10-08
申请号：US17369600
申请日：2021-07-07
IPC分类号： H01L29/06 , H01L21/265 , H01L21/266 , H01L21/324 , H01L29/40
CPC分类号： H01L29/0615 , H01L21/26546 , H01L21/266 , H01L21/3245 , H01L29/401 , H01L29/402
摘要： A method for manufacturing a semiconductor device includes: providing a semiconductor substrate; epitaxially growing a first semiconductor layer coupled to the semiconductor substrate; epitaxially growing a second semiconductor layer coupled to the first semiconductor layer, wherein the second semiconductor layer comprises a contact region and a terminal region surrounding the contact region; forming a mask layer on the second semiconductor layer, wherein the mask layer is patterned with a tapered region aligned with the terminal region of the second semiconductor layer; implanting ions into the terminal region of the second semiconductor layer using the mask layer to form a tapered junction termination element in the terminal region of the second semiconductor layer; and forming a contact structure in the contact region of the second semiconductor layer.
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公开(公告)号：US20240332148A1
公开(公告)日：2024-10-03
申请号：US18617325
申请日：2024-03-26
IPC分类号： H01L23/498 , H01L21/48 , H01L23/00 , H01L23/367 , H01L23/473 , H01L25/07
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/3677 , H01L23/473 , H01L24/40 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/40137 , H01L2224/40227 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49176
摘要： A single side direct cooling (SSDC) package is disclosed for use in high-power electronic device modules in electric vehicles and industrial applications. The power modules route large currents through a set of metal power tabs instead of passing high currents through conductive layers of a direct bonded metal structure. By orienting the metal power tabs in a mini-heart design, stray inductance and resistance can both be reduced, thereby improving performance while simultaneously reducing the footprint of the high power module. In addition, wire bonds between chip assemblies in a high-power semiconductor device module can be replaced by solid metal clips that can better withstand high currents and voltages. The SSDC package incorporates the metal power tabs and provides heat dissipation via a metal base plate that includes a heat sink. The heat sink can be immersed in a cooling fluid to provide faster heat dissipation.
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