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1.发明申请公开(公告)号：US20230135057A1
公开(公告)日：2023-05-04
申请号：US17929584
申请日：2022-09-02
发明人： Howard E. Chen
IPC分类号： H01L23/498 , H01L23/552 , H01L23/66 , H01L21/48 , H01L25/10
摘要： A dual sided molded package has a substrate with pads of varying size configured to receive electrically conductive interconnect members thereon. The pads include first pads that have a larger surface area than a surface area of second pads. In one implementation, one or more first pads are proximate the corners of the substrate. First interconnect members are attached to the first pads and second interconnect members are attached to the second pads. The first interconnect members have an exposed solderable area that is smaller than the surface area of the first pads, and the second interconnect members have an exposed solderable area that is substantially equal to the surface area of the second pads. The first exposed solderable area is substantially equal to the second exposed solderable area.
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公开(公告)号：US20230126040A1
公开(公告)日：2023-04-27
申请号：US17959136
申请日：2022-10-03
发明人： Grant Darcy Poulin
摘要： Radio frequency systems and methods adjust power amplifier operation based on power amplifier operating mode or power level to achieve a tradeoff between improved linearity at lower power levels and improved out of band noise performance and coexistence at higher power levels.
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公开(公告)号：US20230123285A1
公开(公告)日：2023-04-20
申请号：US18046377
申请日：2022-10-13
发明人： Rei Goto , Hironori Fukuhara
IPC分类号： H03H9/02
摘要： An acoustic wave device is disclosed. The acoustic wave deice can include a membrane structure and a support substrate. The membrane structure includes a piezoelectric layer, an interdigital transducer electrode arranged on the piezoelectric layer, and a thermally conductive layer arranged at least partially in contact with the piezoelectric layer. The support substrate is connected to the membrane structure and configured such that a cavity is provided next to the membrane structure. The acoustic wave device can laterally excite a bulk acoustic wave.
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公开(公告)号：US20230121053A1
公开(公告)日：2023-04-20
申请号：US18045885
申请日：2022-10-12
摘要： Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.
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公开(公告)号：US20230117464A1
公开(公告)日：2023-04-20
申请号：US17929066
申请日：2022-09-01
发明人： Rei Goto , Hironori Fukuhara
摘要： An acoustic wave filter includes a substrate and a piezoelectric layer over the substrate. First acoustic wave resonators are disposed over the piezoelectric layer and arranged in series along a first branch, and second acoustic wave resonators are disposed over the piezoelectric layer, arranged in parallel, and connected to the first branch and to ground. The first and second acoustic wave resonators include an interdigital transducer electrode interposed between a pair of reflectors. A layer of positive temperature coefficient of frequency dielectric material is disposed over one or more of the first plurality of acoustic wave resonators to control the temperature coefficient of frequency and improve temperature stability of the acoustic wave filter.
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公开(公告)号：US20230114571A1
公开(公告)日：2023-04-13
申请号：US17956548
申请日：2022-09-29
发明人： Kunal Datta , Khaled A. Fayed
摘要： A power amplifier comprises a first amplification stage having an input terminal receiving a radio frequency (RF) signal to be amplified and having a first coupling unit, a second amplification stage outputting an amplified radio frequency signal and having a second coupling unit and a third coupling unit providing RF feedback to the input terminal of the first amplification stage through an RF feedback path, the second coupling unit being coupled to the first coupling unit, and the third coupling unit being coupled to the first coupling unit.
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公开(公告)号：US20230113099A1
公开(公告)日：2023-04-13
申请号：US17938426
申请日：2022-10-06
发明人： Rei Goto , Hironori Fukuhara
摘要： An acoustic wave device has a substrate, an optional functional layer disposed over at least a portion of the substrate, a piezoelectric layer disposed over at least a portion of the functional layer and/or substrate, and an interdigital transducer electrode disposed on the piezoelectric layer. The piezoelectric layer has an outer edge spaced inward of an outer edge of the substrate, the outer edge of the piezoelectric layer being tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer.
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公开(公告)号：US20230111032A1
公开(公告)日：2023-04-13
申请号：US17938433
申请日：2022-10-06
发明人： Rei Goto , Hironori Fukuhara
IPC分类号： H01L41/297 , H03H9/25 , H03H9/02 , H01L41/083 , H01L41/187
摘要： A method of making an acoustic wave device includes forming or providing a substrate, forming or providing a functional layer over at least a portion of the substrate, forming or providing a piezoelectric layer over at least a portion of the functional layer, and forming or providing an interdigital transducer electrode over the piezoelectric layer. Forming or providing the piezoelectric layer includes removing a portion of the piezoelectric layer so that the piezoelectric layer has an outer edge spaced inward of an outer edge of the substrate, and so that the outer edge of the piezoelectric layer is tapered at an angle relative to a surface of the substrate to thereby reduce an acoustic reflection magnitude at said outer edge of the piezoelectric layer.
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公开(公告)号：US20230110804A1
公开(公告)日：2023-04-13
申请号：US17955271
申请日：2022-09-28
摘要： In some embodiments, a low voltage system can include a capacitor between an output node of an amplifier and ground, with the output node connectable to a load, and the amplifier configured to operate with a series of pulses. The low voltage system can further include a monitoring circuit configured to monitor a voltage at the capacitor against a desired low voltage value, and a control system configured to generate the series of pulses for the amplifier, and to control charging and discharging of the capacitor based on an output of the monitoring circuit to regulate the voltage at the output node at approximately the desired low voltage value.
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公开(公告)号：US11626842B2
公开(公告)日：2023-04-11
申请号：US17121904
申请日：2020-12-15
IPC分类号： H03F1/56 , H03F3/24 , H04B1/3827
摘要： A tunable vector recombination amplifier comprises an input, an output, first and second amplifier circuit paths each including a respective phase shifter to receive a respective input signal from the input and to apply a respective phase shift to produce a respective phase-shifted signal, a respective interstage impedance matching network, and a respective amplifier connected between the respective phase shifter and interstage impedance matching network to receive and amplify the respective phase-shifted signal to produce a respective amplified signal, first and second controllable DC voltage sources each coupled to a respective amplifier and configured to provide a respective supply voltage to the respective amplifier, values of the supply voltages being independently controllable, and an output amplifier stage to receive, amplify, and vectorially combine the amplified signals to produce a combined signal having a specified phase determined by the phase shifts and supply-voltage values and a specified amplitude at the output.
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