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1.
公开(公告)号:US09985119B2
公开(公告)日:2018-05-29
申请号:US15489265
申请日:2017-04-17
IPC分类号: H01L21/00 , H01L31/113 , H01L29/66 , H01L27/146
CPC分类号: H01L29/66977 , H01L27/1462 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14645 , H01L27/14685 , H01L2027/11892 , H04N2209/045
摘要: An integrated image sensor may include adjacent pixels, with each pixel including an active semiconductor region including a photodiode, an antireflection layer disposed above the photodiode, a dielectric region disposed above the antireflection layer, an optical filter disposed above the dielectric region, and a diffraction grating disposed in the antireflection layer. The diffraction grating includes an array of pads.
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公开(公告)号:US09223996B2
公开(公告)日:2015-12-29
申请号:US13751628
申请日:2013-01-28
发明人: Albert Martinez , William Orlando
CPC分类号: G06F21/62 , G06F12/1408 , G06F12/1483 , G06F21/52 , G06F21/602 , G06F21/79 , G06F2212/1052 , G06F2221/033 , G06F2221/2105
摘要: A method for loading a program, contained in at least a first memory, into a second memory accessible by an execution unit, in which the program is in a cyphered form in the first memory, a circuit for controlling the access to the second memory is configured from program initialization data, instructions of the program, and at least initialization data being decyphered to be transferred into the second memory after configuration of the circuit.
摘要翻译: 一种用于将包含在至少第一存储器中的程序加载到执行单元可访问的第二存储器中的方法,其中程序处于第一存储器中的加密形式,用于控制对第二存储器的访问的电路是 由程序初始化数据,程序的指令,以及至少初始化数据被解密以在电路配置之后被传送到第二存储器中。
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3.
公开(公告)号:US09191597B2
公开(公告)日:2015-11-17
申请号:US13605685
申请日:2012-09-06
申请人: Frédéric Barbier , Yvon Cazaux
发明人: Frédéric Barbier , Yvon Cazaux
IPC分类号: H04N3/14 , H04N5/3745 , H04N5/359
CPC分类号: H04N5/3745 , H04N5/3597
摘要: A device for controlling an image sensor including at least one photosensitive cell including a photodiode capable of discharging into a sense node via a first MOS transistor, the sense node being connected to the gate of a second MOS transistor having its source connected to a processing system. The device includes a bias circuit capable of increasing the voltage of the source during the discharge of the photodiode into the sense node.
摘要翻译: 一种用于控制图像传感器的装置,包括至少一个感光单元,该感光单元包括经由第一MOS晶体管能够放电到感测节点的光电二极管,所述感测节点连接到其源极连接到处理系统的第二MOS晶体管的栅极 。 该器件包括偏置电路,其能够在将光电二极管放电到感测节点期间增加源极的电压。
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公开(公告)号:US09182474B2
公开(公告)日:2015-11-10
申请号:US13768707
申请日:2013-02-15
发明人: Thierry Michel , Bruno Paille
CPC分类号: G01S5/14 , G01S5/0221 , G01S5/06 , H04B1/707
摘要: A method for localizing an object, including the acts of: transmission of a first signal by a first transmitter assigned to the object and of a second signal by at least one second transmitter; reception of the first and of the second signal by at least three receivers; in each receiver and for the first and the second signal: a) generation of a first and of a second reference signal; b) correlation between the first signal and the first reference signal and between the second signal and the second reference signal; c) interpolation of samples resulting from the correlation; d) deduction of the propagation time of the first and of the second signal; e) calculation of the difference between the propagation times of the first and of the second signal; and, by triangulation, deduction of the position of the object.
摘要翻译: 一种用于定位对象的方法,包括以下动作:由分配给对象的第一发射机传输第一信号,以及由至少一个第二发射机传输第二信号; 由至少三个接收器接收第一和第二信号; 在每个接收机中以及对于第一和第二信号:a)产生第一和第二参考信号; b)第一信号和第一参考信号之间以及第二信号和第二参考信号之间的相关; c)由相关产生的样本的插值; d)扣除第一和第二信号的传播时间; e)计算第一和第二信号的传播时间之差; 并通过三角测量来扣除物体的位置。
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公开(公告)号:US09099604B2
公开(公告)日:2015-08-04
申请号:US13858481
申请日:2013-04-08
IPC分类号: H01L21/00 , H01L31/18 , H01L27/146
CPC分类号: H01L31/18 , H01L27/14605
摘要: A method for manufacturing an image sensor, including the successive steps of: forming columns of a semiconductor material; forming one or several pixels at a first end of each of the columns; and deforming the structure so that the second ends of each of the columns come closer to each other or draw away from each other to form a surface in the shape of a polyhedral cap.
摘要翻译: 一种用于制造图像传感器的方法,包括以下连续步骤:形成半导体材料的列; 在每个列的第一端形成一个或几个像素; 并且使结构变形使得每个柱的第二端彼此靠近或彼此拉开以形成多面体盖的形状的表面。
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公开(公告)号:US09012957B2
公开(公告)日:2015-04-21
申请号:US14017024
申请日:2013-09-03
发明人: Vincent Quenette
IPC分类号: H01L29/76 , H01L29/78 , H01L29/66 , H01L29/423
CPC分类号: H01L29/7813 , H01L29/4236 , H01L29/66734 , H01L29/66787 , H01L29/66795 , H01L29/7851
摘要: A MOS transistor including a U-shaped channel-forming semiconductor region and source and drain regions having the same U shape located against the channel-forming region on either side thereof, the internal surface of the channel-forming semiconductor region being coated with a conductive gate, a gate insulator being interposed.
摘要翻译: 一种MOS晶体管,包括U形沟道形成半导体区域和具有相同U形的源极和漏极区域,其位于其任一侧上的沟道形成区域,沟道形成半导体区域的内表面涂覆有导电 栅极,插入栅极绝缘体。
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公开(公告)号:US08975737B2
公开(公告)日:2015-03-10
申请号:US13279138
申请日:2011-10-21
CPC分类号: H01P3/082 , H01L23/66 , H01L25/0657 , H01L2223/6627 , H01L2225/06513 , H01L2225/06527 , H01L2924/0002 , H01P5/028 , H01L2924/00
摘要: A transmission line formed in a device including a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, this line including: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the first chip; and a ground plane made of a conductive material formed in at least one metallization level of the second chip.
摘要翻译: 一种传输线,形成在包括第一和第二芯片堆叠的器件中,其前表面彼此面对,并且其中填充材料层将第一芯片的前表面与第二芯片的前表面分离,该线包括 :形成在所述第一芯片的至少一个金属化层中的所述第一芯片的前表面侧上的导电条; 以及由在第二芯片的至少一个金属化层中形成的导电材料制成的接地平面。
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公开(公告)号:US08963273B2
公开(公告)日:2015-02-24
申请号:US14247084
申请日:2014-04-07
发明人: Michel Marty , François Roy , Jens Prima
IPC分类号: H01L31/00 , H01L27/146
CPC分类号: H01L27/1464 , H01L27/1463 , H01L27/14683 , H01L27/14687 , H01L27/14689
摘要: A method for forming a back-side illuminated image sensor, including the steps of: a) forming, from the front surface, doped polysilicon regions, of a conductivity type opposite to that of the substrate, extending in depth orthogonally to the front surface and emerging into the first layer; b) thinning the substrate from its rear surface to reach the polysilicon regions, while keeping a strip of the first layer; c) depositing, on the rear surface of the thinned substrate, a doped amorphous silicon layer, of a conductivity type opposite to that of the substrate; and d) annealing at a temperature capable of transforming the amorphous silicon layer into a crystallized layer.
摘要翻译: 一种用于形成背面照明图像传感器的方法,包括以下步骤:a)从前表面形成与衬底相反的导电类型的掺杂多晶硅区域,其垂直于正面延伸, 进入第一层; b)使衬底从其后表面变薄到达多晶硅区域,同时保持第一层的条带; c)在所述薄化衬底的后表面上沉积与所述衬底相反的导电类型的掺杂非晶硅层; 和d)在能够将非晶硅层转变成结晶层的温度下退火。
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公开(公告)号:US08759898B2
公开(公告)日:2014-06-24
申请号:US12990682
申请日:2009-05-12
申请人: Pascal Fornara
发明人: Pascal Fornara
IPC分类号: H01L29/788
CPC分类号: H01L27/1052 , H01L27/112 , H01L27/11213 , H01L27/11519 , H01L27/11521
摘要: A non-volatile memory including at least first and second memory cells each including a storage MOS transistor with dual gates and an insulation layer provided between the two gates. The insulation layer of the storage transistor of the second memory cell includes at least one portion that is less insulating than the insulation layer of the storage transistor of the first memory cell.
摘要翻译: 包括至少第一和第二存储器单元的非易失性存储器,每个存储单元包括具有双栅极的存储MOS晶体管和设置在两个栅极之间的绝缘层。 第二存储单元的存储晶体管的绝缘层包括与第一存储单元的存储晶体管的绝缘层绝缘性更差的至少一部分。
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10.
公开(公告)号:US20140170834A1
公开(公告)日:2014-06-19
申请号:US14104903
申请日:2013-12-12
申请人: STMicroelectronics (Crolles 2) SAS , Commissariat à l'Énergie Atomique et aux Énergies Alternatives , STMicroelectronics, Inc. , STMicroelectronics S.A.
发明人: Claire Fenouillet-Beranger , Stephane Denorme , Nicolas Loubet , Qing Liu , Emmanuel Richard , Pierre Perreau
IPC分类号: H01L21/762
CPC分类号: H01L21/76283 , H01L21/84 , H01L27/1207
摘要: A method for manufacturing a hybrid SOI/bulk substrate, including the steps of starting from an SOI wafer comprising a single-crystal semiconductor layer called SOI layer, on an insulating layer, on a single-crystal semiconductor substrate; depositing on the SOI layer at least one masking layer and forming openings crossing the masking layer, the SOI layer, and the insulating layer, to reach the substrate; growing by a repeated alternation of selective epitaxy and partial etching steps a semiconductor material; and etching insulating trenches surrounding said openings filled with semiconductor material, while encroaching inwards over the periphery of the openings.
摘要翻译: 一种制造混合SOI /体基板的方法,包括以下步骤:在绝缘层上在单晶半导体衬底上从包括称为SOI层的单晶半导体层的SOI晶片开始; 在SOI层上沉积至少一个掩模层,并形成与掩模层,SOI层和绝缘层交叉的开口,以到达衬底; 通过选择性外延和部分蚀刻步骤的重复交替生长半导体材料; 以及蚀刻围绕填充有半导体材料的所述开口的绝缘沟槽,同时在开口的周边向内侵入。
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