ETCHING COMPOSITION AND METHOD FOR ETCHING A SUBSTRATE
    1.
    发明申请
    ETCHING COMPOSITION AND METHOD FOR ETCHING A SUBSTRATE 审中-公开
    蚀刻组合物和蚀刻基材的方法

    公开(公告)号:US20090008366A1

    公开(公告)日:2009-01-08

    申请号:US12208732

    申请日:2008-09-11

    IPC分类号: B44C1/22

    CPC分类号: H01L21/31111 H01L21/67086

    摘要: This etching composition for etching hafnium compound, includes a fluoride compound and a chloride compound. This method for etching a substrate, includes etching a film which contains hafnium compound and is formed on a substrate by using an etching composition, wherein the etching composition contains a fluoride compound and a chloride compound.

    摘要翻译: 用于蚀刻铪化合物的蚀刻组合物包括氟化物和氯化物。 用于蚀刻基板的方法包括使用蚀刻组合物蚀刻含有铪化合物的膜并在基板上形成,其中蚀刻组合物含有氟化物和氯化物。