RADIO FREQUENCY (RF) SYSTEM WITH EMBEDDED RF SIGNAL PICKUPS

    公开(公告)号:US20230132660A1

    公开(公告)日:2023-05-04

    申请号:US17514815

    申请日:2021-10-29

    摘要: A radio frequency (RF) system including: a first conductive covering surface, a portion of the first conductive covering surface including a portion of the first outer wall of a first RF device; a second conductive covering surface aligned to the first conductive covering surface, the second conductive covering surface being disposed around the insulating hole; an insulating hole for an RF center conductor extending through the first conductive covering surface and the second conductive covering surface, the first conductive covering surface and the second conductive covering surface being disposed around the insulating hole; a cavity bounded by the first conductive covering surface and the second conductive covering surface, the cavity being an insulating region; and an RF signal pickup disposed within the cavity.

    Method of detecting foreign object on stage and detection apparatus

    公开(公告)号:US11639947B2

    公开(公告)日:2023-05-02

    申请号:US17116201

    申请日:2020-12-09

    摘要: A method of detecting a foreign object on a stage according to one aspect of the present disclosure includes acquiring first position information of a first pattern included in a first image in a reference state of a surface of the stage capable of attracting an object to be inspected; acquiring second position information of a second pattern included in a second image of the surface, the second image being obtained after obtaining the first image; and detecting one or more foreign objects on the surface by comparing the first position information and the second position information.

    PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

    公开(公告)号:US20230127467A1

    公开(公告)日:2023-04-27

    申请号:US17970609

    申请日:2022-10-21

    IPC分类号: H01L21/3065 H01L21/67

    摘要: A plasma processing method includes: (a) providing a substrate having an etching target film including a silicon oxide film and a silicon nitride film, and a mask film defining an opening over the etching target film, on a substrate support in a chamber of a plasma processing apparatus; (b) generating a first plasma from a first processing gas including HF gas, CxFy gas (x and y are integers of 1 or more) or CsHtFu gas (s, t, and u are integers of 1 or more), and an oxygen-containing gas to etch the silicon nitride film; and (c) generating a second plasma from a second processing gas including HF gas, CvFw gas (v and w are integers of 1 or more), and an oxygen-containing gas to etch the silicon oxide film. In (b) and (c), a temperature of the substrate support is set to 0° C. or lower.

    SUBSTRATE PLACING METHOD AND SUBSTRATE PLACING MECHANISM

    公开(公告)号:US20230122317A1

    公开(公告)日:2023-04-20

    申请号:US17964708

    申请日:2022-10-12

    摘要: There is a substrate placing method for placing a substrate on a placing surface of a placing table in a chamber of a substrate processing apparatus for processing a substrate, the placing table having the placing surface on which a substrate is placed and a tapered surface for guiding the substrate disposed at an outer periphery of the placing surface, the method comprising, locating a lift pin to a substrate transfer position over the placing surface, the lift pin being capable of protruding from and retracting below the placing surface, and transferring the substrate onto the lift pin; lowering the lift pin, on which the substrate is placed, to a substrate placing position lower than the placing surface; and raising the lift pin by a short distance and then returning the lift pin to the substrate placing position.

    Substrate Processing Method and Substrate Processing Apparatus

    公开(公告)号:US20230119730A1

    公开(公告)日:2023-04-20

    申请号:US18082670

    申请日:2022-12-16

    发明人: Kohei FUKUSHIMA

    摘要: A substrate processing method includes supplying processing gas from a plurality of gas holes formed along a longitudinal direction of an injector, which extends in a vertical direction along an inner wall surface of a processing container and is rotatable around a rotational axis extending in the vertical direction, to perform a predetermined process on a substrate accommodated in the processing container. The predetermined process includes a plurality of operations, and a supply direction of the processing gas is changed by rotating the injector in accordance with the operations.

    Plasma Processing with Radio Frequency (RF) Source and Bias Signal Waveforms

    公开(公告)号:US20230117812A1

    公开(公告)日:2023-04-20

    申请号:US17451094

    申请日:2021-10-15

    IPC分类号: H01J37/32

    摘要: A method for plasma processing includes: sustaining a plasma in a plasma processing chamber, the plasma processing chamber including a first radio frequency (RF) electrode and a second RF electrode, where sustaining the plasma includes: coupling an RF source signal to the first RF electrode; and coupling a bias signal between the first RF electrode and the second RF electrode, the bias signal having a bipolar DC (B-DC) waveform including a plurality of B-DC pulses, each of the B-DC pulses including: a negative bias duration during which the pulse has negative polarity relative to a reference potential, a positive bias duration during which the pulse has positive polarity relative to the reference potential, and a neutral bias duration during which the pulse has neutral polarity relative to the reference potential.

    STAGE, TESTING APPARATUS, AND STAGE OPERATING METHOD

    公开(公告)号:US20230110797A1

    公开(公告)日:2023-04-13

    申请号:US17932752

    申请日:2022-09-16

    IPC分类号: H01L21/677 H01L21/68

    摘要: A stage includes a base on which an object to be transported or tested is placed, four movable bodies configured to support the base in a manner so that the base can be raised and lowered, four driving motors, provided in correspondence with the four movable bodies, and configured to independently raise and lower the four movable bodies, respectively, four guides configured to guide the four movable bodies, respectively, and a support frame, having wall surfaces parallel to a raising and lowering direction of the base and continuous along a direction perpendicular to the raising and lowering direction of the base, and the four guides fixed to the wall surfaces.