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    METHOD OF EMBEDDING MAGNETIC COMPONENT IN SUBSTRATE
    1.
    发明申请
    METHOD OF EMBEDDING MAGNETIC COMPONENT IN SUBSTRATE 有权
    在基板上嵌入磁性元件的方法

    公开(公告)号：US20130104365A1

    公开(公告)日：2013-05-02

    申请号：US13477919

    申请日：2012-05-22

    申请人： Bo-Shiung HUANG ,  Han-Ching SHIH ,  Tzu-Yuan FAN ,  Wei-Hsiung YANG ,  Kai-Hsiang CHEN

    发明人： Bo-Shiung HUANG ,  Han-Ching SHIH ,  Tzu-Yuan FAN ,  Wei-Hsiung YANG ,  Kai-Hsiang CHEN

    IPC分类号： B23P17/04

    CPC分类号： H05K1/165 ,  H01F41/0253 ,  H01F41/14 ,  H05K2201/086 ,  H05K2201/09854 ,  Y10T29/4902 ,  Y10T29/49075 ,  Y10T29/49826 ,  Y10T29/49833

    摘要： A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.

    摘要翻译： 公开了一种在基板中嵌入磁性部件的方法。 通过机械钻孔在基板中形成孔。 每个孔包括顶部开口，底部和侧壁，其中顶部开口的区域大于底部开口的面积。 侧壁从顶部开口垂直向下延伸到预定深度，然后向内倾斜到底部，以在孔的底部形成倾斜的侧壁。 沿着顶部开口的边缘的一部分限定预定区域，并且通过布线移除在该预定区域下方的基底材料的一部分，以形成部分容纳沟槽，其中倾斜侧壁的一部分位于底部。 然后，将磁性部件放置在部件容纳沟槽中。

    PACKAGING STRUCTURE
    4.
    发明申请
    PACKAGING STRUCTURE 审中-公开
    包装结构

    公开(公告)号：US20100101623A1

    公开(公告)日：2010-04-29

    申请号：US12401610

    申请日：2009-03-10

    申请人： Tzu-Chien WEI ,  Chao PENG ,  Jo-Lin LAN ,  Ya-Huei CHANG ,  Wen-Chi HSU ,  Hai-Peng CHENG ,  Shien-Ping FENG ,  Wen-Hsiang CHEN

    发明人： Tzu-Chien WEI ,  Chao PENG ,  Jo-Lin LAN ,  Ya-Huei CHANG ,  Wen-Chi HSU ,  Hai-Peng CHENG ,  Shien-Ping FENG ,  Wen-Hsiang CHEN

    IPC分类号： H01L31/042

    CPC分类号： H02J7/355

    摘要： A packaging structure with a box for containing at least a portable electronic device is provided. The box has plates, which are connected to one another and surrounded to form an opening for the portable electronic device passing through, and a lid selectively covering or exposing the opening. First solar cells each fastened on an inner surface of each plate in the box. At least a cable electrically connects the first solar cells and is operated for electrically connecting the portable electronic device.

    摘要翻译： 提供一种具有用于容纳至少一个便携式电子设备的盒子的包装结构。 盒子具有彼此连接并被包围以形成通过便携式电子设备的开口的板，以及选择性地覆盖或暴露开口的盖子。 第一个太阳能电池各自固定在盒子中每个板的内表面上。 至少电缆电连接第一太阳能电池并且被操作用于电连接便携式电子设备。

    Printed circuit board package structure and manufacturing method thereof
    5.
    发明授权
    Printed circuit board package structure and manufacturing method thereof 有权
    印刷电路板封装结构及其制造方法

    公开(公告)号：US09258888B2

    公开(公告)日：2016-02-09

    申请号：US14205344

    申请日：2014-03-11

    申请人： TRIPOD TECHNOLOGY CORPORATION

    发明人： Bo-Shiung Huang ,  Wei-Hsiung Yang ,  Han-Ching Shih ,  Cheng-Feng Lin

    IPC分类号： H01F5/00 ,  H01F27/28 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46 ,  H05K3/42 ,  H01F17/00 ,  H01F17/06

    CPC分类号： H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

    摘要： A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

    摘要翻译： 印刷电路板封装结构包括具有第一表面和第二表面的基板，环形磁性元件，粘合剂层，导电部分和导电通道。 第一表面和第二表面分别具有第一和第二金属部分。 在未被第一表面的第一金属部分覆盖的位置处形成环形凹部。 环形磁性元件放置在环形凹部中。 粘合剂层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道穿透导电部分，粘合剂层和基底，并且分别位于环形凹部的内壁和外壁外侧。 每个导电通道包括导电膜电连接到对准的导电部分和第二金属部分。

    PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    印刷电路板封装结构及其制造方法

    公开(公告)号：US20140266549A1

    公开(公告)日：2014-09-18

    申请号：US14205344

    申请日：2014-03-11

    申请人： TRIPOD TECHNOLOGY CORPORATION

    发明人： Bo-Shiung HUANG ,  Wei-Hsiung YANG ,  Han-Ching SHIH ,  Cheng-Feng LIN

    IPC分类号： H05K1/02 ,  H05K3/42 ,  H01F27/28

    CPC分类号： H05K1/0271 ,  H01F17/0033 ,  H01F17/062 ,  H01F27/2804 ,  H05K1/165 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/086 ,  H05K2201/09636 ,  H05K2203/1178 ,  Y10T29/49165

    摘要： A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

    摘要翻译： 印刷电路板封装结构包括具有第一表面和第二表面的基板，环形磁性元件，粘合剂层，导电部分和导电通道。 第一表面和第二表面分别具有第一和第二金属部分。 在未被第一表面的第一金属部分覆盖的位置处形成环形凹部。 环形磁性元件放置在环形凹部中。 粘合剂层覆盖第一金属部分和环形磁性元件。 导电部分形成在粘合剂层上。 导电通道穿透导电部分，粘合剂层和基底，并且分别位于环形凹部的内壁和外壁外侧。 每个导电通道包括导电膜电连接到对准的导电部分和第二金属部分。

    Method of making colloidal metal nanoparticles
    9.
    发明授权
    Method of making colloidal metal nanoparticles 有权

    公开(公告)号：US10099191B1

    公开(公告)日：2018-10-16

    申请号：US15630838

    申请日：2017-06-22

    申请人： TRIPOD TECHNOLOGY CORPORATION

    发明人： Lin Lu ,  Kuei-Sheng Fan ,  Chen-Hsiang Wang ,  Chun-Lun Chiu ,  Ta-Wei Chang ,  Cheng-Ding Wang ,  Jim-Min Fang

    IPC分类号： B82Y30/00 ,  B01J13/00

    摘要： Provided is a method of making colloidal metal nanoparticles. The method includes the steps of: mixing a metal aqueous solution and a reducing agent to form a mixture solution in a reaction tank; heating the mixture solution and undergoing a reduction reaction to produce a composition containing metal nanoparticles, residues and gas, wherein the amount of the residues is less than 20% by volume of the mixture solution, and guiding the gas out of the reaction tank; dispersing the metal nanoparticles with a medium to obtain colloidal metal nanoparticles. By separating the reduction reaction step and the dispersion step, the method of making colloidal metal nanoparticles is simple, safe, time-effective, cost-effective, and has the advantage of high yield.

    Method of making inorganic gold compound
    10.
    发明授权
    Method of making inorganic gold compound 有权

    公开(公告)号：US10046976B1

    公开(公告)日：2018-08-14

    申请号：US15415391

    申请日：2017-01-25

    申请人： TRIPOD TECHNOLOGY CORPORATION

    发明人： Lin Lu ,  Chen-Hsiang Wang ,  Kuei-Sheng Fan ,  Cheng-Ding Wang ,  Jim-Min Fang

    IPC分类号： C01G7/00 ,  C01C3/10

    摘要： A method of making the inorganic gold compound, such as tetrachloroauric acid, sodium tetrachloroaurate, potassium tetrachloroaurate, sodium tetracyanoaurate, and potassium tetracyanoaurate, includes the step of: treating gold with a halogen-containing oxidizing agent in a hydrochloric acid to obtain the inorganic gold compound, wherein the halogen-containing oxidizing agent excludes chlorine gas. The method of making the inorganic gold compound is simple, safe, time-effective, cost-effective, and environment-friendly, and has the advantage of high yield.