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公开(公告)号：US20180320006A1
公开(公告)日：2018-11-08
申请号：US15774034
申请日：2016-11-17
Applicant: DSM IP Assets, B.V.
Inventor： Tai Yeon LEE , Mike SCIANNA , Paulus STEEMAN , Marco DRIESSEN , Johan JANSEN , Sainath VAIDYA
IPC: C09D7/63 , B33Y10/00 , B33Y70/00 , B29C64/124 , B22C9/04 , C09D163/00 , C08G59/24
CPC classification number: C09D7/63 , B22C9/043 , B29C64/124 , B29K2105/0005 , B33Y10/00 , B33Y70/00 , C08F2/50 , C08G59/22 , C08G59/24 , C08G59/245 , C08G59/687 , C08G65/18 , C09D163/00
Abstract: Radiation curable compositions for additive fabrication are described and claimed. Such compositions are particularly suited for investment casting applications, and include a cationically polymerizable component, a radically polymerizable component, a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator, and a free-radical photoinitiator. In other embodiments, the composition may also include a photosensitizer and/or a UV/absorber. Also described and claimed is a method for using a liquid radiation curable resin for additive fabrication with a certain type of prescribed antimony-free, sulfonium salt-based cationic photoinitiator and a certain type of prescribed photosensitizer in an investment casting process.
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公开(公告)号：US20180244836A1
公开(公告)日：2018-08-30
申请号：US15757008
申请日：2016-09-02
Applicant: Technische Universitaet Wien , Albert-Ludwigs-Universitaet Freiburg , Polymer Competence Center Leoben GmbH
Inventor： Robert LISKA , Daniel BOMZE , Ingo KROSSING , Patrick KNAACK
CPC classification number: C08G59/682 , C01F7/02 , C01F7/50 , C08G59/68 , C08G59/687 , C08G65/105
Abstract: The invention relates to the use of aryliodonium and/or arylsulfonium salts of the tetrakis(perfluoro-t-butyloxy)aluminate anion of the following formula (I): as cationic initiators cleavable by light and/or free radicals for polymerizing cationically polymerizable monomers.
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公开(公告)号：US20180215861A1
公开(公告)日：2018-08-02
申请号：US15748037
申请日：2016-08-03
Applicant: DAICEL CORPORATION
Inventor： Takeshi FUJIKAWA , Sadayuki FUKUI
CPC classification number: C08G59/24 , B29C33/405 , B29C35/0888 , B29C39/02 , B29C39/24 , B29C39/26 , B29C39/36 , B29C39/38 , B29C2033/0005 , B29C2035/0827 , B29C2793/0027 , B29C2793/009 , B29D11/00269 , B29D11/00298 , B29K2063/00 , B29K2105/24 , B29K2883/00 , B29L2011/005 , C08G59/226 , C08G59/245 , C08G59/38 , C08G59/687 , C08G65/18 , G02B1/04 , G02B1/041 , G02B3/08 , C08L63/00
Abstract: Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.
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公开(公告)号：US09865558B2
公开(公告)日：2018-01-09
申请号：US14712674
申请日：2015-05-14
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Young Ju Shin , Kyoung Ku Kang , Ji Yeon Kim , Kyoung Soo Park , Young Woo Park , Byeong Geun Son , Kyoung Hun Shin , Kwang Jin Jung , Jae Sun Han , Ja Young Hwang
CPC classification number: H01L24/29 , C08G59/687 , C08G59/72 , C08K5/372 , C08K5/55 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2201/622 , C09J2203/326 , C09J2205/102 , C09J2463/00 , H01B1/20 , H01L24/32 , H01L2224/16238 , H01L2224/2929 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/32225 , H01L2924/0665 , H01L2924/00014
Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60° C. to 85° C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below, Elastic modulus change(%)={(M1−M0)/M0}×100 [Equation 1] wherein M0 is an initial elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C., and M1 is a elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C. after the film is left at 25° C. for 170 hours.
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公开(公告)号：US09815933B2
公开(公告)日：2017-11-14
申请号：US15096365
申请日：2016-04-12
Applicant: QINETIQ LIMITED
Inventor： Simon Andrew Torry , Anthony Vernon Cunliffe , David Arthur Tod
CPC classification number: C08G59/245 , C06B21/0025 , C08G59/24 , C08G59/687 , C08G59/688 , C08L63/00 , C08L71/02 , C09D163/00 , C08L2666/22
Abstract: This invention relates to a novel curing method of oligomers, using metal triflates, and particularly to the curing of hydroxyl terminated elastomers to achieve crosslinked polymers. The method finds particular use as an alternative cure methodology to replace isocyanate curing. There is further provided a cured and crosslinked polymer binder, which is particularly suitable and compatible for use with energetic materials.
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公开(公告)号：US20170298197A1
公开(公告)日：2017-10-19
申请号：US15596057
申请日：2017-05-16
Applicant: Nano Dimension Technologies, LTD
Inventor： Hila Elimelech
IPC: C08J5/18 , C08K7/26 , C09D11/101 , C09D11/30
CPC classification number: C08J5/18 , C08F222/1006 , C08G59/184 , C08G59/245 , C08G59/42 , C08G59/44 , C08G59/46 , C08G59/50 , C08G59/56 , C08G59/687 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K7/26 , C08L33/062 , C08L63/00 , C09D11/101 , C09D11/30 , H05K1/0366 , H05K3/0011 , H05K2203/013 , H05K2203/10
Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
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公开(公告)号：US20170267809A1
公开(公告)日：2017-09-21
申请号：US15505629
申请日：2015-11-24
Applicant: Dow Global Technologies LLC
Inventor： Kevin J. Meyer , Gary A. Hunter , Douglas L. Potts , William L. Ritter
CPC classification number: C08G59/5026 , C08G59/245 , C08G59/50 , C08G59/504 , C08G59/687 , C08G2650/50 , C08J3/24 , C08J5/24 , C08J2363/02
Abstract: An amine hardener system useful for curing a curable resin composition including a blend of: (I) a first amine hardener comprising at least one cycloaliphatic amine; and (II) a second amine hardener comprising at least one polyetheramine; and a curable epoxy resin composition including (A) at least one epoxy resin compound; and (B) at least one curing agent; wherein the at least one curing agent includes the above amine hardener system.
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8.发明申请
公开(公告)号：US20170256331A1
公开(公告)日：2017-09-07
申请号：US15599078
申请日：2017-05-18
Applicant: NIKON CORPORATION
Inventor： Shohei KOIZUMI , Takashi SUGIZAKI , Kenji MIYAMOTO , Yusuke KAWAKAMI
IPC: H01B3/46 , G03F7/40 , C08L63/00 , C08G59/32 , C08G59/62 , C08G59/68 , G03F7/075 , H01L51/00 , G03F7/004 , G03F7/20 , G03F7/038 , H01L51/05 , H01L21/02
CPC classification number: H01B3/46 , C08G59/3254 , C08G59/621 , C08G59/687 , C08L63/00 , G03F7/004 , G03F7/038 , G03F7/0752 , G03F7/0755 , G03F7/20 , G03F7/40 , H01L21/02126 , H01L51/0002 , H01L51/0015 , H01L51/0023 , H01L51/052 , H01L51/0545 , Y10T428/31663
Abstract: A method of manufacturing a laminate, transistor, and method of manufacturing transistor using a composition that includes an organic compound having a hydroxy group; a first cross-linking agent that is at least one organic silicon compound selected from the group including an organic silicon compound including a siloxane bond in the molecule and having three or more cyclic ether groups in the molecule, a chain organic silicon compound including two or more siloxane bonds in the molecule and having two or more cyclic ether groups in the molecule, a cyclic organic silicon compound including D unit in the molecule and having four or more cyclic ether groups bonded to a silicon atom of the D unit in the molecule, and a cyclic organic silicon compound including a T unit in the molecule and having two or more cyclic ether groups in the molecule; and a photocationic polymerization initiator.
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公开(公告)号：US09637598B2
公开(公告)日：2017-05-02
申请号：US14766433
申请日：2014-02-03
Inventor： Hiroaki Fujiwara , Yuki Kitai , Hirosuke Saito
IPC: C08L61/04 , C08G73/22 , C08J5/24 , H01L23/29 , H01L23/14 , C08G73/02 , C08K5/378 , C08L79/04 , H05K1/03 , B32B15/14 , C08L63/00 , C08G14/06 , C08L61/34 , B32B15/08 , B32B15/092 , B32B27/04
CPC classification number: C08K5/378 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2305/076 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , B32B2457/08 , B32B2581/00 , C08G14/06 , C08G59/686 , C08G59/687 , C08G73/0233 , C08G73/22 , C08J5/24 , C08J2379/02 , C08J2379/04 , C08K5/3445 , C08L61/04 , C08L61/34 , C08L63/00 , C08L79/02 , C08L79/04 , C08L2203/20 , H01L23/145 , H01L23/295 , H01L2924/0002 , H05K1/0326 , H05K1/0346 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0129 , H01L2924/00
Abstract: A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.
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10.发明申请
公开(公告)号：US20170081487A1
公开(公告)日：2017-03-23
申请号：US15126351
申请日：2015-03-02
Inventor： Pavel SMOLKA , Josef GRINDLING , Kenneth SCOBBIE , Duncan HOWLAND , Zoubair Cherkaoui
CPC classification number: C08J5/24 , B29C70/48 , B29K2063/00 , B29K2105/0005 , B29K2307/04 , C08G59/245 , C08G59/5026 , C08G59/687 , C08J2363/02
Abstract: A process for the preparation of a fiber reinforced composite article comprising the steps of a) providing a fibre preform in a mold, b) injecting a multiple component thermosetting resin composition into the mold, wherein the resin composition comprises (b 1) a liquid epoxy resin, (b2) a curing agent comprising 1,3-bis(aminomethyl)cyclohexane, and (b3) an accelerator comprising at least one compound selected from the group sulfonic acid and imidazolium salt of a sulfonic acid, c) allowing the resin to impregnate the fiber preform, d) curing the resin impregnated preform, e) demolding the cured composite part, facilitates manufacturing of composite articles with reduced cycle times, said composite articles exhibit excellent mechanical properties, especially elongation and fracture toughness, and can be used for the construction of mass transportation vehicles, in particular in automotive and aerospace industry.
