-
公开(公告)号：US08371723B2
公开(公告)日：2013-02-12
申请号：US13303563
申请日：2011-11-23
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Abstract translation: 一个或多个发光二极管二极管（LED）连接到印刷电路板。 所连接的LED可通过印刷电路板的电路与电源连接。 包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。 独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。 在一些实施例中，自由高的导热材料是热塑性材料。
-
公开(公告)号：US09585239B2
公开(公告)日：2017-02-28
申请号：US14268476
申请日：2014-05-02
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
IPC: H05K3/30 , H05K1/02 , F21V29/00 , G09F9/33 , H05K3/28 , F21V9/16 , F21V23/00 , F21V29/70 , F21V29/85 , F21V23/02 , F21V31/04 , F21V3/04 , F21Y101/00 , F21Y101/02
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Abstract translation: 一个或多个发光二极管二极管（LED）连接到印刷电路板。 所连接的LED可通过印刷电路板的电路与电源连接。 包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。 独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。 在一些实施例中，自由高的导热材料是热塑性材料。
-
公开(公告)号：US08847481B2
公开(公告)日：2014-09-30
申请号：US13290477
申请日：2011-11-07
Applicant: Jong Chan Park , Young Jin Kim
Inventor： Jong Chan Park , Young Jin Kim
IPC: H01J1/62 , H01J63/04 , F21V9/16 , F21K99/00 , F21V3/00 , F21V3/04 , F21Y101/02 , F21V29/00 , F21V15/01
CPC classification number: F21V29/70 , F21K9/00 , F21K9/232 , F21K9/64 , F21V3/00 , F21V3/0463 , F21V3/0481 , F21V3/08 , F21V3/12 , F21V9/16 , F21V9/30 , F21V29/004 , F21V29/507 , F21V29/74 , F21Y2115/10
Abstract: A lighting device including a photoluminescent plate may be provided that includes a light source and a photoluminescent plate disposed over the light source. The photoluminescent plate includes a base layer and a first phosphor layer. The base layer transmits light and has a first roughness on one surface thereof. The first phosphor layer is disposed on the one surface of the base layer and includes a first phosphor.
Abstract translation: 可以提供包括光致发光板的照明装置，其包括设置在光源上的光源和光致发光板。 光致发光板包括基底层和第一荧光体层。 基层透光并且在其一个表面上具有第一粗糙度。 第一荧光体层设置在基底层的一个表面上并且包括第一荧光体。
-
公开(公告)号：US20160270207A1
公开(公告)日：2016-09-15
申请号：US15164054
申请日：2016-05-25
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
-
公开(公告)号：US08756801B2
公开(公告)日：2014-06-24
申请号：US13303591
申请日：2011-11-23
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
IPC: H05K3/30
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Abstract translation: 一个或多个发光二极管二极管（LED）连接到印刷电路板。 所连接的LED可通过印刷电路板的电路与电源连接。 包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。 独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。 在一些实施例中，自由高的导热材料是热塑性材料。
-
公开(公告)号：US20120066900A1
公开(公告)日：2012-03-22
申请号：US13303591
申请日：2011-11-23
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
IPC: H05K3/30
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
-
公开(公告)号：US20120063128A1
公开(公告)日：2012-03-15
申请号：US13303563
申请日：2011-11-23
Applicant: Jeffrey NALL , Matthew Mrakovich
Inventor： Jeffrey NALL , Matthew Mrakovich
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Abstract translation: 一个或多个发光二极管二极管（LED）连接到印刷电路板。 所连接的LED可通过印刷电路板的电路与电源连接。 包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。 独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。 在一些实施例中，自由高的导热材料是热塑性材料。
-
公开(公告)号：US20170122543A1
公开(公告)日：2017-05-04
申请号：US15403766
申请日：2017-01-11
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
IPC: F21V29/85 , H05K3/28 , H05K1/18 , F21V23/00 , F21K9/90 , F21S4/10 , F21V3/02 , F21V9/16 , H05K1/02 , H05K3/32
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
-
公开(公告)号：US20140237814A1
公开(公告)日：2014-08-28
申请号：US14268476
申请日：2014-05-02
Applicant: Jeffrey Nall , Matthew Mrakovich
Inventor： Jeffrey Nall , Matthew Mrakovich
IPC: F21V29/00
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Abstract translation: 一个或多个发光二极管二极管（LED）连接到印刷电路板。 所连接的LED可通过印刷电路板的电路与电源连接。 包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。 独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。 在一些实施例中，自由高的导热材料是热塑性材料。
-
公开(公告)号：US20130155681A1
公开(公告)日：2013-06-20
申请号：US13764264
申请日：2013-02-11
Applicant: Jeffrey NALL , Matthew MRAKOVICH
Inventor： Jeffrey NALL , Matthew MRAKOVICH
IPC: F21V29/00
CPC classification number: H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
Abstract translation: 一个或多个发光二极管二极管（LED）连接到印刷电路板。 所连接的LED可通过印刷电路板的电路与电源连接。 包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。 独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。 在一些实施例中，自由高的导热材料是热塑性材料。
