公开(公告)号：US09939200B2

公开(公告)日：2018-04-10

申请号：US14948673

申请日：2015-11-23

申请人： TOKYO ELECTRON LIMITED

发明人： Koyu Hasegawa ,  Kyoko Ikeda

IPC分类号： F27D3/00 ,  H01L21/47

CPC分类号： F27D3/0084 ,  F27D2003/0086 ,  H01L21/47 ,  H01L21/67017 ,  H01L21/67178 ,  H01L21/67766 ,  H01L21/67781

摘要： A substrate transfer system includes a substrate transfer part capable of transferring a substrate while holding the substrate, an elevating mechanism including a support axis extending in an upper-lower direction and being capable of moving the substrate transfer part along the support axis within a predetermined range, a first exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis above an upper limit of the predetermined range, a second exhaust port located at a position selected from at least one of on the supporting axis and near the supporting axis below a lower limit of the predetermined range, and an exhaust part connected such that exhaust is available through the first exhaust port and the second exhaust port.

公开(公告)号：US09803924B2

公开(公告)日：2017-10-31

申请号：US14633367

申请日：2015-02-27

申请人： Tokyo Electron Limited

发明人： Hiroshi Kikuchi ,  Tsutomu Wakamori

IPC分类号： H01L21/22 ,  H01L21/31 ,  F27B17/00 ,  F27D3/00 ,  H01L21/677

CPC分类号： F27B17/0025 ,  F27D3/0084 ,  F27D2003/0065 ,  F27D2003/0086 ,  H01L21/67757

摘要： Disclosed is a vertical heat treatment apparatus. The apparatus includes: a heat treatment furnace provided with a furnace inlet at a lower end thereof; a cover unit disposed on the furnace inlet of the heat treatment furnace; a cover unit opening/closing mechanism configured to support the cover unit in a cantilever manner from a bottom side of the cover unit; and an auxiliary mechanism configured to press the cover unit from the bottom side of the cover unit when the cover unit is disposed on the furnace inlet. The auxiliary mechanism is provided with a toggle mechanism.

公开(公告)号：US20160172218A1

公开(公告)日：2016-06-16

申请号：US14957985

申请日：2015-12-03

申请人： Tokyo Electron Limited

发明人： Masato Mizuta ,  Tatsuya Kawaji ,  Keigo Nakano

IPC分类号： H01L21/67 ,  F27D7/04 ,  F26B3/04 ,  H01L21/3105

CPC分类号： H01L21/67109 ,  F27B3/02 ,  F27D3/0084 ,  F27D7/04 ,  H01L21/02115 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/67103 ,  H01L21/6719

摘要： Disclosed is a heat treatment apparatus for performing a heat treatment on a coating film formed on a substrate. The apparatus includes a placing unit provided within a processing container, and configured to place the substrate thereon; a heating unit configured to heat the substrate placed on the placing unit; a gas supply port provided along a circumferential direction outside the substrate on the placing unit in a plan view, and configured to supply gas into the processing container; an outer circumferential exhaust port provided along the circumferential direction outside the substrate on the placing unit in a plan view, and configured to exhaust an inside of the processing container; and a central exhaust port provided above a central portion of the substrate on the placing unit, and configured to exhaust the inside of the processing container.

摘要翻译： 公开了一种对形成在基板上的涂膜进行热处理的热处理装置。 该装置包括设置在处理容器内的放置单元，并配置成将基板放置在其上; 加热单元，其构造成加热放置在所述放置单元上的所述基板; 气体供给口，其沿着圆周方向设置在所述放置单元上的所述基板的外侧，并且被配置为向所述处理容器供给气体; 外周排气口在平面图中沿着圆周方向设置在所述放置单元的基板外侧，并且构造成排出所述处理容器的内部; 以及中央排气口，其设置在所述基板的位于所述放置单元的中央部的上方，并且构造成排出所述处理容器的内部。

公开(公告)号：US20160068425A1

公开(公告)日：2016-03-10

申请号：US14396060

申请日：2014-09-22

申请人： Shenzhen China Star Optoelectronics Technology Co. Ltd.

发明人： Shih Ying Sun

IPC分类号： C03B35/20 ,  F27D3/00

CPC分类号： F27D3/0084 ,  F27D2003/0002 ,  F27D2003/0046 ,  F27D2003/0051 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6838 ,  Y10S901/40

摘要： A glass substrate transfer system and a robot arm thereof are provided. The robot arm includes: a substrate fork for taking a glass substrate; a moving assembly connected with the substrate fork and for making the substrate fork to be moved in a working space; a vacuum chuck disposed on the substrate fork and for sucking the glass substrate; and a heat-dissipating assembly disposed at a side of the substrate fork, the moving assembly or the vacuum chuck and for being moved to above the vacuum chuck to dissipate heat of the vacuum chuck when the vacuum chuck is heated and does not suck the glass substrate. The glass substrate transfer system and its robot arm cool the vacuum chuck in time and thus can avoid affecting the product quality caused by the vacuum chuck being overheated, and the product yield is improved.

摘要翻译： 提供了玻璃基板输送系统及其机器人臂。 机器人手臂包括：用于取玻璃基板的基板叉; 与所述基板叉连接并用于使所述基板叉在工作空间中移动的移动组件; 设置在所述基板叉上并用于吸取所述玻璃基板的真空卡盘; 以及散热组件，其设置在基板叉，移动组件或真空卡盘的一侧，并且当真空卡盘被加热并且不吸入玻璃时被移动到真空卡盘上方以散发真空卡盘的热量 基质。 玻璃基板转印系统及其机器人手臂及时冷却真空卡盘，避免因真空卡盘过热而导致的产品质量受到影响，产品成品率提高。

公开(公告)号：US08641350B2

公开(公告)日：2014-02-04

申请号：US13030781

申请日：2011-02-18

申请人： Chris G. M. de Ridder

发明人： Chris G. M. de Ridder

IPC分类号： B65G25/00

CPC分类号： F27D3/0084 ,  F27D5/0037

摘要： A wafer boat assembly for use with a loading apparatus configured to insert the wafer boat assembly loaded with semiconductor substrates into a furnace. The wafer boat assembly includes a first wafer boat part comprising a base and a first cover part mounted on the base; and a second wafer boat part comprising a second cover part that is provided with receiving slots for holding a plurality of semiconductor substrates. The second cover part has an arcuate shape that extends from a first longitudinal edge to a second longitudinal edge. The first and second wafer boat parts are detachably connectable, such that they mate together to extend around an outer perimeter of a loaded substrate at a predetermined distance.

摘要翻译： 一种与装载装置一起使用的晶片舟组件，构造成将装载有半导体衬底的晶片舟组件插入炉中。 晶片舟组件包括第一晶片舟形部件，其包括基座和安装在基座上的第一盖部分; 以及第二晶片舟部件，其包括设置有用于保持多个半导体衬底的接收槽的第二盖部分。 第二盖部分具有从第一纵向边缘延伸到第二纵向边缘的弓形形状。 第一和第二晶片舟部分是可拆卸地连接的，使得它们配合在一起，以预定距离围绕加载的基底的外周延伸。

公开(公告)号：US07943887B2

公开(公告)日：2011-05-17

申请号：US11812236

申请日：2007-06-15

申请人： Christopher Vincent ,  Drew Knopfel ,  Richard Heckert

发明人： Christopher Vincent ,  Drew Knopfel ,  Richard Heckert

IPC分类号： F27B5/12 ,  B65H1/00

CPC分类号： F27B17/0025 ,  F27D3/0084 ,  F27D5/0037 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67754 ,  H01L21/67757 ,  H05B6/80

摘要： An oven includes: an inlet elevator having multiple receiving bays for receiving a piece to be heated in the oven where the receiving bays are stacked vertically and the elevator is configured to move up or down to align a receiving bay; a mandrel having multiple shelves to correspond a shelf to a bay of the inlet elevator, each shelf configured to support a piece received from the inlet elevator, the mandrel configured to rotate each piece on a shelf between a loading position, a baking position, and an unloading position; an outlet elevator having multiple receiving bays for unloading a piece heated in the oven, the unloading bays are stacked vertically and the elevator is configured to move up or down to align an unloading bay with a material handling system moving the heated pieces; and a microwave generator configured to heat at least one of the pieces when the pieces are in the baking position. A method of heating a material is also provided.

摘要翻译： 烤箱包括：入口升降机，其具有多个接收托架，用于接收在烘箱中待加热的件，其中接收托架垂直堆叠，并且电梯被配置为上下移动以对准接收间隔; 心轴具有多个搁架以将架子对应于入口升降机的隔间，每个搁架被构造成支撑从入口升降机接收的件，该心轴构造成使每个件在装载位置，烘烤位置和 卸货位置 出口电梯具有多个用于卸载在烘箱中加热的部件的接收托架，卸载托架垂直堆叠，并且电梯构造成上下移动以使卸载托架与移动加热件的材料处理系统对准; 以及微波发生器，其构造成当所述片处于烘焙位置时加热至少一个所述片。 还提供了加热材料的方法。

公开(公告)号：US20100330815A1

公开(公告)日：2010-12-30

申请号：US12880716

申请日：2010-09-13

申请人： Shinichi Hayashi ,  Tetsuo Fukuoka ,  Tetsuya Oda ,  Hiroaki Inadomi

发明人： Shinichi Hayashi ,  Tetsuo Fukuoka ,  Tetsuya Oda ,  Hiroaki Inadomi

IPC分类号： H01L21/26

CPC分类号： F27B5/04 ,  F27B17/0025 ,  F27D3/0084 ,  H01L21/67109

摘要： A substrate heating apparatus includes a top plate arranged above a hot plate so that a vertical space is formed between the hot plate and the top plate. The top plate has an evacuated internal chamber serving as a vacuum insulating layer that suppresses heat transfer from a first surface of the top plate facing the hot plate to a second surface of the top plate opposite to the first surface. When heating the substrate, a gas flow flowing through the space between the hot plate and the top plate is generated.

公开(公告)号：US20080308546A1

公开(公告)日：2008-12-18

申请号：US11812236

申请日：2007-06-15

申请人： Christopher Vincent ,  Drew Knopfel ,  Richard Heckert

发明人： Christopher Vincent ,  Drew Knopfel ,  Richard Heckert

IPC分类号： F27D11/00

CPC分类号： F27B17/0025 ,  F27D3/0084 ,  F27D5/0037 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67754 ,  H01L21/67757 ,  H05B6/80

摘要： An oven includes: an inlet elevator having multiple receiving bays for receiving a piece to be heated in the oven where the receiving bays are stacked vertically and the elevator is configured to move up or down to align a receiving bay; a mandrel having multiple shelves to correspond a shelf to a bay of the inlet elevator, each shelf configured to support a piece received from the inlet elevator, the mandrel configured to rotate each piece on a shelf between a loading position, a baking position, and an unloading position; an outlet elevator having multiple receiving bays for unloading a piece heated in the oven, the unloading bays are stacked vertically and the elevator is configured to move up or down to align an unloading bay with a material handling system moving the heated pieces; and a microwave generator configured to heat at least one of the pieces when the pieces are in the baking position. A method of heating a material is also provided.

摘要翻译： 烤箱包括：入口升降机，其具有多个接收托架，用于接收在烘箱中待加热的件，其中接收托架垂直堆叠，并且电梯被配置为上下移动以对准接收间隔; 心轴具有多个搁架以将架子对应于入口升降机的隔间，每个搁架被构造成支撑从入口升降机接收的件，该心轴构造成使每个件在装载位置，烘烤位置和 卸货位置 出口电梯具有多个用于卸载在烘箱中加热的部件的接收托架，卸载托架垂直堆叠，并且电梯构造成上下移动以使卸载托架与移动加热件的材料处理系统对准; 以及微波发生器，其构造成当所述片处于烘焙位置时加热至少一个所述片。 还提供了加热材料的方法。

公开(公告)号：US07059849B2

公开(公告)日：2006-06-13

申请号：US09934756

申请日：2001-08-23

申请人： Kazunari Sakata ,  Koyu Hasegawa ,  Keiichi Katabuchi ,  Shingo Watanabe ,  Shinya Mochizuki ,  Motoki Akimoto ,  Hiroshi Motono

发明人： Kazunari Sakata ,  Koyu Hasegawa ,  Keiichi Katabuchi ,  Shingo Watanabe ,  Shinya Mochizuki ,  Motoki Akimoto ,  Hiroshi Motono

IPC分类号： F27D9/00

CPC分类号： H01L21/67373 ,  F27B5/04 ,  F27B17/0025 ,  F27D3/0084 ,  F27D5/0037 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67739 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/68707 ,  Y10S269/903 ,  Y10S414/135 ,  Y10S414/137

摘要： A heat treatment system and method for cooling a loading chamber that includes a heat treatment furnace for heat-treating an object to be treated. The heat treatment furnace includes a throat for carrying the object in and out, and a cooling mechanism for cooling the vicinity of the throat. The cooling mechanism has a ventilating unit with a ventilating port for sending a cooling fluid toward the vicinity of the throat and a heat exchanger arranged so as to face the ventilating port in the vicinity of the throat. The cooling mechanism also has an intake fan for sucking the cooling fluid in the vicinity of the throat over the heat exchanger. When the object to be treated is carried in, the structure of various mechanisms in the vicinity of the throat is simplified, and space is saved.

摘要翻译： 一种用于冷却装载室的热处理系统和方法，其包括用于对待处理物体进行热处理的热处理炉。 热处理炉包括用于输入和输出物体的喉部和用于冷却喉部附近的冷却机构。 冷却机构具有通风单元，其具有用于向喉部附近发送冷却流体的通风口和布置成面对喉部附近的通气口的热交换器。 冷却机构还具有用于吸引热交换器上的喉部附近的冷却流体的进气扇。 当被处理物被携带时，喉部附近的各种机构的结构被简化，节省了空间。

公开(公告)号：US20050053891A1

公开(公告)日：2005-03-10

申请号：US10939432

申请日：2004-09-14

申请人： Shinya Mochizuki ,  Motoki Akimoto

发明人： Shinya Mochizuki ,  Motoki Akimoto

IPC分类号： H01L21/324 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  F27D1/18

CPC分类号： H01L21/67373 ,  F27B5/04 ,  F27B17/0025 ,  F27D3/0084 ,  F27D5/0037 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67379 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67739 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/68707 ,  Y10S269/903 ,  Y10S414/135 ,  Y10S414/137

摘要： There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment. In a vertical heat treatment system for carrying an object W to be treated, which is housed in a treating-object housing box 2 closed by an opening/closing lid 10, in a treating-object transfer area 46 via an opening 28, which is formed in a partition wall 26 separating a housing-box transfer area 44 for transferring the treating-object housing box from the treating-object transfer area 46 in an atmosphere of an inert gas, to carry out a predetermined treatment, a standby box transfer means 60 is provided in the housing-box transfer area for holding a treating-object housing box, which houses therein the next object to be carried in the treating-object transfer area, in the vicinity of the opening to cause the treating-object housing box to stand by. Thus, when the object to be treated is carried in via the opening of the partition wall, which separates the housing-box transfer area from the treating-object transfer area (wafer transfer area), to carry out a predetermined treatment, the structure of various mechanisms in the vicinity of the opening is simplified, and the space is saved.

摘要翻译： 提供了一种垂直式热处理系统，其能够简化形成在将箱体搬送区域从处理对象搬送区域（晶片转移区域）分离的分隔壁的开口附近的各种机构的结构， 并且当通过开口在垂直热处理系统中承载待处理物体时，有助于节省空间，以进行预定处理。 在用于承载被打开/关闭盖10封闭的处理对象收纳箱2中的待处理对象物W的立式热处理系统经由开口28在处理对象转移区域46中 形成在隔离壁26中，隔离箱26分离用于在惰性气体气氛中将处理对象收纳箱从处理对象转移区域46传送的收纳箱传送区域44，以执行预定处理;待机箱传送装置 60设置在用于保持处理对象收纳箱的收纳箱传送区域中，处理对象收纳箱在其内容纳有待处理对象转移区域中的下一个物体的开口附近，从而使处理对象收纳箱 待命 因此，当待处理物体经由将箱体转移区域从处理对象转移区域（晶片转移区域）分离的分隔壁的开口进行预定处理时，结构 简化了开口附近的各种机构，节省了空间。