摘要:
A resistive element including a main body portion, and first and second terminal portions with different shapes that are provided at opposite ends of the main body portion in the long-side direction. At least one side portion of the main body portion in the short-side direction has a protruding portion.
摘要:
A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.
摘要:
A resistive element including a main body portion, and first and second terminal portions with different shapes that are provided at opposite ends of the main body portion in the long-side direction. At least one side portion of the main body portion in the short-side direction has a protruding portion.
摘要:
A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may consist of a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.
摘要:
Disclosed herein is an electrical component comprising a segment having a diameter in the range of about 1 micrometers to about 10 cm, the segment comprising a plurality of non-metallic, resistive fibers in a non-metallic binder. The segment is precisely trimmed to impart to the segment an electrical resistance within 1% of the desired resistance value. A manufacturing system and methods of manufacturing components having precise specifications also are disclosed.
摘要:
The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.
摘要:
The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
摘要:
There is provided a method for manufacturing rectangular plate type chip resistors which provides easy and convenient control of resistance, and easy and low cost manufacture of rectangular plate type chip resistors having a reliable electrode structure, as well as a rectangular plate type chip resistor obtained by this method and having excellent properties particularly at low resistance. The method includes the steps of (A) providing a resistive alloy plate strip 10 of predetermined width and thickness, (B) forming an insulating protective film (11a, 11b) of a predetermined width longitudinally along the middle of upper and lower faces of the alloy plate strip, (C) forming an electrode layer 12 composed of integrated surface, back, and end electrodes (12a, 12c, 12b, respectively), along both sides of the protective film by electroplating, and (D) cutting the alloy plate strip coated with the protective films and the electrode layers in step (C) transversely in predetermined lengths, wherein resistance is controlled to be within a predetermined range by adjusting the thickness of the alloy plate strip in step (A), the width of the protective film formed in step (B), and the cutting length in step (D).
摘要:
A cylindrical film-type resistor comprising a cylindrical ceramic substrate to which is adherently applied a film of resistive material. Laminated over or under such resistive film are a plurality of termination films of conductive material. The termination films extend longitudinally of the substrate, and are so shaped and connected that the heat generated in the resistive film causes the temperature of the resistor to be substantially uniform throughout the length of the substrate. Stated more specifically, the termination films are combs with intermeshing teeth, and each tooth is relatively narrow at the central region of the substrate and relatively wide at the end portions thereof. Preferably, each comb tooth is generally hourglass-shaped.
摘要:
A process for the manufacturing of an electric resistance for a hybrid miniaturized circuit from a wafer of p-type silicon or germanium, consisting in preparing said wafer with dimensions exceeding those corresponding to the required resistance value; diamond cutting said wafer into smaller ones, preparing for each smaller wafer two connections in the form of gilded metal strips, welding each smaller wafer to its two connections at a temperature above the gold-semiconductor eutectic formation point, and adjusting said smaller wafers to said required resistance value by removing material therefrom by means of an abrasive powder stream.