公开(公告)号：US10062598B2

公开(公告)日：2018-08-28

申请号：US14698793

申请日：2015-04-28

申请人： Applied Materials, Inc.

发明人： Anhthu Ngo ,  Zuoming Zhu ,  Balasubramanian Ramachandran ,  Paul Brillhart ,  Edric Tong ,  Anzhong Chang ,  Kin Pong Lo ,  Kartik Shah ,  Schubert S. Chu ,  Zhepeng Cong ,  James Francis Mack ,  Nyi O. Myo ,  Kevin Joseph Bautista ,  Xuebin Li ,  Yi-Chiau Huang ,  Zhiyuan Ye

IPC分类号： H01L21/687 ,  H01L21/673 ,  C30B25/12 ,  B05C13/02 ,  B05C13/00 ,  C23C16/458

CPC分类号： H01L21/68735 ,  B05C13/00 ,  B05C13/02 ,  C23C16/4585 ,  C30B25/12 ,  H01L21/67326 ,  H01L21/6875 ,  H01L21/68785

摘要： In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.

公开(公告)号：US10002777B2

公开(公告)日：2018-06-19

申请号：US15363334

申请日：2016-11-29

申请人： K.C.Tech Co., Ltd.

发明人： Young Kyu Kweon ,  Joon Ho An ,  Byoung Chaul Son ,  Jin Sung Rho

IPC分类号： H01L21/67 ,  H01L21/673

CPC分类号： H01L21/67023 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67288 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

摘要： Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.

公开(公告)号：US20180090358A1

公开(公告)日：2018-03-29

申请号：US15695142

申请日：2017-09-05

申请人： SCREEN Holdings Co., Ltd.

发明人： Yukiteru MIYAMOTO

IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC分类号： H01L21/67781 ,  H01L21/67265 ,  H01L21/67288 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67718 ,  H01L21/67766 ,  H01L21/68 ,  H01L21/6875

摘要： A posture changing device changes the posture of a substrate from one of horizontal and vertical postures to the other posture. In the posture changing device, before transfer of the substrate between a vertical holder and a pusher, a controller controls a holder shifting mechanism on the basis of a warped state of the substrate to shift the position in the thickness direction of a horizontal holder by a shift distance from the vertical holder, the shift distance being determined on the basis of the warped state. Thus, it is possible to suitably transfer the substrate between the vertical holder and the pusher, even if the substrate is warped, while preventing the substrate from coming into contact with the horizontal holder.

公开(公告)号：US09543174B1

公开(公告)日：2017-01-10

申请号：US14834041

申请日：2015-08-24

申请人： Seagate Technology LLC

发明人： David V. Dougherty ,  Ian J. Beresford ,  Donald E. Curtiss ,  Thomas Y. Chang

IPC分类号： A47G19/08 ,  H01L21/673 ,  B65D85/38 ,  B65D25/10 ,  H01L21/67

CPC分类号： H01L21/67313 ,  B65D25/107 ,  B65D85/38 ,  H01L21/67 ,  H01L21/67326

摘要： A material handling apparatus adapted to support a plurality of disc-shaped platters, such as but not limited to a cassette assembly adapted to support data recording media or substrates during manufacturing. In some embodiments, a cassette assembly includes a base cassette with a base and opposing sidewalls configured to support an outermost perimeter of each of a first plurality of disc-shaped platters having a first diameter. An insert contactingly engages the base cassette. The insert has a plurality of spaced apart grooves to contactingly support an outermost perimeter of each of a second plurality of disc-shaped platters having a different, second diameter.

摘要翻译： 一种适于支撑多个盘形盘片的材料处理装置，例如但不限于适于在制造期间支撑数据记录介质或基板的盒式组件。 在一些实施例中，盒组件包括具有底座和相对的侧壁的底盒，所述底座被配置为支撑具有第一直径的第一多个盘形盘片中的每一个的最外周边。 插入件与底座接触地接合。 插入件具有多个间隔开的凹槽，以接触地支撑具有不同的第二直径的第二多个盘状盘片中的每一个的最外周边。

公开(公告)号：US20150050105A1

公开(公告)日：2015-02-19

申请号：US13882135

申请日：2012-07-25

申请人： Dan Zhang ,  Hui Chen ,  Jim K. Atkinson ,  Hung Chih Chen ,  Allen L. D'Ambra

发明人： Dan Zhang ,  Hui Chen ,  Jim K. Atkinson ,  Hung Chih Chen ,  Allen L. D'Ambra

IPC分类号： H01L21/67 ,  H01L21/677 ,  B25J11/00 ,  H01L21/673 ,  F26B25/00 ,  F26B25/14

CPC分类号： H01L21/67034 ,  B25J11/0095 ,  F26B25/001 ,  F26B25/14 ,  H01L21/67057 ,  H01L21/67326 ,  H01L21/67748 ,  H01L21/67751

摘要： Embodiments described herein generally relate to a vapor dryer module for cleaning substrates during a chemical mechanical polishing (CMP) process. In one embodiment, a module for processing a substrate is provided. The module includes a tank having sidewalls with an outer surface and an inner surface defining a processing volume, a substrate support structure for transferring a substrate within the processing volume, the substrate support structure having a first portion that is at least partially disposed in the processing volume and a second portion that is outside of the processing volume, and one or more actuators disposed on an outer surface of one of the sidewalls of the tank and coupled between the outer surface and the second portion of the support structure, the one or more actuators operable to move the support structure relative to the tank.

摘要翻译： 本文描述的实施例通常涉及用于在化学机械抛光（CMP）工艺期间清洁衬底的蒸汽干燥器模块。 在一个实施例中，提供了一种用于处理衬底的模块。 模块包括具有外表面和限定处理体积的内表面的侧壁的槽，用于在处理体积内转移衬底的衬底支撑结构，衬底支撑结构具有至少部分地设置在处理中的第一部分 体积和在处理体积外的第二部分，以及一个或多个致动器，其设置在罐的侧壁中的一个的外表面上并且联接在支撑结构的外表面和第二部分之间，一个或多个 致动器可操作以相对于罐移动支撑结构。

公开(公告)号：US08734698B2

公开(公告)日：2014-05-27

申请号：US13747171

申请日：2013-01-22

申请人： Entegris, Inc.

发明人： Sanjiv M. Bhatt ,  Shawn D. Eggum

IPC分类号： B29C45/14

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

摘要翻译： 根据本发明实施例的复合晶片载体包括由第一热塑性材料形成的操作部分和由第二不同热塑性材料形成的支撑部分。 其中一个操作部分和支撑部分被包覆模制在另一个上，以形成将这些部分牢固地结合在一起的无间隙的密封界面。 操作部分可以是透明窗口，闩锁机构的一部分或晶片接触部分。 本发明的优选实施例包括具有所述特征的晶片载体，具有所述特征的工艺载体和用于制造具有所述特征的晶片载体的工艺。

公开(公告)号：US20120061288A1

公开(公告)日：2012-03-15

申请号：US13301422

申请日：2011-11-21

申请人： Sanjiv M. BHATT ,  Shawn D. EGGUM

发明人： Sanjiv M. BHATT ,  Shawn D. EGGUM

IPC分类号： H01L21/673 ,  B28B5/00

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

摘要翻译： 根据本发明实施例的复合晶片载体包括由第一热塑性材料形成的操作部分和由第二不同热塑性材料形成的支撑部分。 其中一个操作部分和支撑部分被包覆模制在另一个上，以形成将这些部分牢固地结合在一起的无间隙的密封界面。 操作部分可以是透明窗口，闩锁机构的一部分或晶片接触部分。 本发明的优选实施例包括具有所述特征的晶片载体，具有所述特征的工艺载体和用于制造具有所述特征的晶片载体的工艺。

公开(公告)号：US20110198256A1

公开(公告)日：2011-08-18

申请号：US13028180

申请日：2011-02-15

申请人： Lutz Rebstock

发明人： Lutz Rebstock

IPC分类号： B65D21/024 ,  B65D21/028

CPC分类号： H01L21/67326 ,  H01L21/67313

摘要： In an embodiment, the present invention discloses a stackable substrate carrier for scalably storing, transporting or processing multiple substrates. The present substrate carriers can be stacked side-by-side by an attaching mechanism, forming an integrated carrier with double, triple or multiple capacity. The attaching mechanism comprises a locking mechanism to secure the substrate carriers together, engaged by mating two substrate carriers, together with an additional rotating or translating action of the two substrate carriers. Alternatively, the locking mechanism can be engaged by pressing two substrate carriers against each other, using friction to keep the carriers together. Other locking mechanism can also be used, such as hooks or latches.

摘要翻译： 在一个实施例中，本发明公开了一种可堆叠的基板载体，用于可扩展地存储，传输或处理多个基板。 本衬底载体可以通过附接机构并排堆叠，形成具有双重，三重或多倍容量的集成载体。 附接机构包括锁定机构，以将衬底载体固定在一起，通过配合两个衬底载体接合，以及两个衬底载体的附加旋转或平移作用。 或者，通过使用摩擦力将两个基板载体彼此压靠以将载体保持在一起，可以将锁定机构接合。 还可以使用其他锁定机构，例如钩或闩锁。

公开(公告)号：US20090230019A1

公开(公告)日：2009-09-17

申请号：US12213249

申请日：2008-06-17

申请人： Cheng-AN Yang ,  Chien-Li Ho ,  Kung-Hsu Yeh ,  Ming-Hung Huang

发明人： Cheng-AN Yang ,  Chien-Li Ho ,  Kung-Hsu Yeh ,  Ming-Hung Huang

IPC分类号： H01L21/673 ,  B65D85/30

CPC分类号： C23C16/4587 ,  C30B25/105 ,  C30B25/12 ,  C30B29/06 ,  H01L21/67326 ,  H01L21/6734

摘要： A substrate cassette having an electrode array includes a base frame, a plurality of first electrode plates, a plurality of second electrode plates, and a plurality of struts. The base frame includes at least one conductive member located at a bottom side thereof and each having a plurality of first channels and second channels parallel to the first channels. The first and second channels are alternately arranged. The base frame includes a plurality of fixtures located at a top side thereof. An insulator is mounted in each of the second channels. Each of the struts is mounted to two opposite sides of a bottom edge of each of the corresponding first and second electrode plates. The struts and the corresponding fixtures are vertically opposite to each other to jointly define a limited space for receiving substrates, wherein the struts carry the substrates. Therefore, the substrate cassette is applicable to the CVD process.

摘要翻译： 具有电极阵列的基板盒包括基架，多个第一电极板，多个第二电极板和多个支柱。 底架包括位于其底侧的至少一个导电构件，每个具有多个第一通道和与第一通道平行的第二通道。 第一和第二通道交替布置。 底架包括位于其顶侧的多个固定装置。 绝缘体安装在每个第二通道中。 每个支柱安装到每个对应的第一和第二电极板的底部边缘的两个相对侧。 支柱和相应的夹具彼此垂直相对，以共同限定用于接收基板的有限空间，其中支柱承载基板。 因此，基板盒适用于CVD工艺。

公开(公告)号：US20080295860A1

公开(公告)日：2008-12-04

申请号：US12094765

申请日：2007-12-10

申请人： Norbert Burger

发明人： Norbert Burger

IPC分类号： B08B3/12 ,  B08B13/00

CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B3/10 ,  B08B11/02 ,  H01L21/67023 ,  H01L21/67057 ,  H01L21/67313 ,  H01L21/67326

摘要： The invention relates to an apparatus for the cleaning of thin wafers (6), wherein the wafers (6) are fixed with one side to a carrier device (2), and wherein an interspace (7) is formed between two adjacent substrates, wherein the apparatus substantially consists of a shower device (15) by which fluid is injected into the respective interspaces (7), and a basin (14) that can be filled with fluid and that is dimensioned such that it houses the carrier device (2).According to the invention, optionally either the shower device (15) can be moved in relation to the immobile carrier device (2), or the carrier device (2) can be moved in relation to the immobile shower device (15), or both the carrier device (2) as well as the shower device (15) can be moved in relation to each other.The method stands out by the fact that in a preferred cleaning process, a shower with warm fluid takes place at first with the carrier device (2) being moved within the basin, followed by an ultrasonic cleaning in cold fluid and another shower with warm fluid.

摘要翻译： 本发明涉及一种用于清洁薄晶片（6）的设备，其中晶片（6）以一侧固定到载体装置（2），并且其中在两个相邻基板之间形成间隙（7），其中 该设备基本上由淋浴装置（15）组成，淋浴装置（15）将流体注入相应的间隙（7）中，以及可以填充流体的盆（14），其尺寸使其容纳载体装置（2） 。 根据本发明，可选地，淋浴装置（15）可以相对于不动的载体装置（2）移动，或者载体装置（2）可以相对于不动的淋浴装置（15）或两者 载体装置（2）以及淋浴装置（15）可相对于彼此移动。 该方法突出于以下事实：在优选的清洁过程中，首先发生具有暖流体的淋浴，其中载体装置（2）在盆内移动，然后在冷流体中进行超声波清洗，另外用温热流体喷淋 。