公开(公告)号：US20190139809A1

公开(公告)日：2019-05-09

申请号：US16044701

申请日：2018-07-25

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sang-Joon HONG ,  Sang-Hyun PARK

IPC分类号： H01L21/687 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/68742 ,  G02F1/1303 ,  G03F7/70716 ,  H01L21/67724 ,  H01L21/67745 ,  H01L21/67784 ,  H01L21/67787 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/68764 ,  H01L21/68778 ,  H01L21/68785

摘要： A substrate supporting and transferring apparatus and associated methods, the apparatus including a shuttle configured to move in a x-direction and a y-direction, the y-direction being perpendicular to the x-direction; a lower wedge block on the shuttle, the lower wedge block including a lower surface that is parallel with an upper surface of the shuttle and an upper surface that is inclined with respect to the lower surface of the lower wedge block; an upper wedge block on the lower wedge block, the upper wedge block including a lower surface that is parallel with the upper surface of the lower wedge block and an upper surface that is parallel with the upper surface of the shuttle; and a chuck on the upper wedge block, the chuck being configured to support a substrate.

公开(公告)号：US20180323223A1

公开(公告)日：2018-11-08

申请号：US16023646

申请日：2018-06-29

申请人： Japan Display Inc.

发明人： Takashi SAEKI

IPC分类号： H01L27/12 ,  H01L23/544 ,  G02F1/1345 ,  H01L21/67 ,  H01L21/687 ,  G02F1/13 ,  G02F1/1333 ,  H01L51/00

CPC分类号： H01L27/1262 ,  G02F1/1303 ,  G02F1/133305 ,  G02F1/13452 ,  G02F2201/54 ,  H01L21/67092 ,  H01L21/68757 ,  H01L21/68778 ,  H01L23/544 ,  H01L27/1218 ,  H01L27/124 ,  H01L51/0097 ,  H01L2223/54426 ,  H01L2227/323 ,  H01L2251/5338

摘要： A method for producing a display device includes locating a substrate, including a plurality of pixels, on a jig including a magnet; locating a plate formed of a magnetic material on the substrate to secure the substrate; and folding back an end portion of the substrate in a state where the substrate is held between the jig and the plate.

公开(公告)号：US09821469B2

公开(公告)日：2017-11-21

申请号：US14648280

申请日：2013-11-27

申请人： NIKON CORPORATION

发明人： Hideaki Hara

IPC分类号： G03B27/58 ,  B25J11/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  G03F7/20 ,  B25J15/06

CPC分类号： B25J11/0095 ,  B25J15/0616 ,  G03F7/70716 ,  G03F7/7075 ,  G03F7/70783 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/6838 ,  H01L21/68778

摘要： A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.

公开(公告)号：US20170297203A1

公开(公告)日：2017-10-19

申请号：US15637069

申请日：2017-06-29

申请人： NIKON CORPORATION

发明人： Hideaki HARA

IPC分类号： B25J11/00 ,  H01L21/683 ,  H01L21/68 ,  H01L21/67 ,  B25J15/06 ,  G03F7/20 ,  H01L21/687

CPC分类号： B25J11/0095 ,  B25J15/0616 ,  G03F7/70716 ,  G03F7/7075 ,  G03F7/70783 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/6838 ,  H01L21/68778

摘要： A carrier system is provided with a wafer stage which holds a mounted wafer and is also movable along an XY plane, a chuck unit which holds the wafer from above in a non-contact manner above a predetermined position and is vertically movable, and a plurality of vertical movement pins, which can support from below the wafer held by the chuck unit on the wafer stage when the wafer stage is positioned at the predetermined position above and can also move vertically. Then, flatness of the wafer is measured by a Z position detection system, and based on the measurement results, the chuck unit and the vertical movement pins that hold (support) the wafer are independently driven.

公开(公告)号：US09716028B2

公开(公告)日：2017-07-25

申请号：US14840001

申请日：2015-08-30

申请人： International Business Machines Corporation

发明人： Donald A. Merte ,  Thomas Weiss

IPC分类号： H01L21/687 ,  H01L23/00 ,  B23Q3/06

CPC分类号： H01L21/68721 ,  B23Q3/061 ,  H01L21/68728 ,  H01L21/68778 ,  H01L24/75 ,  H01L2224/75704 ,  Y10T29/49826 ,  Y10T29/49842 ,  Y10T29/49998 ,  Y10T29/50

摘要： A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface.

公开(公告)号：US09435848B2

公开(公告)日：2016-09-06

申请号：US14806262

申请日：2015-07-22

申请人： SunPower Corporation

发明人： Jose Francisco Capulong ,  Emmanuel Abas

IPC分类号： G01R31/40 ,  G01R31/26 ,  G01R1/04 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  B23Q3/18 ,  H02S50/10

CPC分类号： G01R31/26 ,  B23Q3/18 ,  G01R1/04 ,  H01L21/67103 ,  H01L21/6838 ,  H01L21/68757 ,  H01L21/68778 ,  H02S50/10 ,  Y10T279/11

摘要： In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

公开(公告)号：US20160163907A1

公开(公告)日：2016-06-09

申请号：US14826129

申请日：2015-08-13

申请人： SolarCity Corporation

发明人： Pablo Gonzalez ,  Bobby Yang

IPC分类号： H01L31/18

CPC分类号： H01L31/18 ,  B28D5/0052 ,  B28D5/0094 ,  B32B38/10 ,  B32B43/006 ,  H01L21/3043 ,  H01L21/683 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/68778 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/1967 ,  Y10T156/1983

摘要： A cleaving system is described. The system can include a holding apparatus to retain a photovoltaic structure at a center section of a cleaving platform. The system can further include a contact apparatus to make contact with the photovoltaic structure and separate it into a plurality of strips. During operation, the system can activate an actuator to move the contact apparatus against the photovoltaic structure, thereby separating the photovoltaic structure into strips.

摘要翻译： 描述劈裂系统。 该系统可以包括保持装置，以将光伏结构保持在劈裂平台的中心部分。 该系统还可以包括与光伏结构接触并将其分离成多个条的接触装置。 在操作期间，系统可以启动致动器以使接触装置抵靠光伏结构移动，从而将光伏结构分离成条带。

公开(公告)号：US09305813B2

公开(公告)日：2016-04-05

申请号：US14374244

申请日：2012-03-16

申请人： Markus Wimplinger ,  Alfred Sigl

发明人： Markus Wimplinger ,  Alfred Sigl

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01L23/00

CPC分类号： H01L21/67144 ,  H01L21/68771 ,  H01L21/68778 ,  H01L24/75 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75316 ,  H01L2224/75317 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/757 ,  H01L2224/75704 ,  H01L2224/75724 ,  H01L2224/75744 ,  H01L2224/75822 ,  H01L2224/75823 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/9205 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/351 ,  H01L2924/00

摘要： This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B).

摘要翻译： 本发明涉及将多个芯片接合到基板上的压力传递装置。 压力传递装置包括用于将与键合方向（B）作用的接合力施加到芯片的压力体。 压力体具有第一压力侧和相对的第二压力侧，两者均定向成横向于接合方向（B）。 提供固定装置以附接到压力传递装置的周边，用于将压力传递装置固定在粘合方向（B）上的保持体上。 提供滑动层，用于使压力体横向于接合方向（B）滑动。

公开(公告)号：US20150371888A1

公开(公告)日：2015-12-24

申请号：US14840004

申请日：2015-08-30

申请人： International Business Machines Corporation

发明人： Donald A. Merte ,  Thomas Weiss

IPC分类号： H01L21/687 ,  B23Q3/06

CPC分类号： H01L21/68721 ,  B23Q3/061 ,  H01L21/68728 ,  H01L21/68778 ,  H01L24/75 ,  H01L2224/75704 ,  Y10T29/49826 ,  Y10T29/49842 ,  Y10T29/49998 ,  Y10T29/50

摘要： A clamping apparatus and method for maintaining a workpiece flatness during processing includes a base having a planar surface for receiving a first workpiece. Two sets of opposing clamping mechanisms are mounted to the base and include a clamp head at a distal end of a rod extending from a housing in removable overlapping relation to the first workpiece. Each set of the clamp heads are in opposing spaced relationship to each other defining a second workpiece area, and the clamp heads are configured to mate with a top surface of the first workpiece. A biasing member is coupled to each of the housings and apply a downward vertical force to the housings, rods, and the clamp heads for applying a downward vertical pressure to the first workpiece. The first workpiece is thereby discouraged from thermally expanding in a vertical direction and is thermally expandable horizontally along the planar surface.

公开(公告)号：US20150326178A1

公开(公告)日：2015-11-12

申请号：US14806262

申请日：2015-07-22

申请人： Jose Francisco Capulong ,  Emmanuel Abas

发明人： Jose Francisco Capulong ,  Emmanuel Abas

IPC分类号： H02S50/10 ,  G01R1/04

CPC分类号： G01R31/26 ,  B23Q3/18 ,  G01R1/04 ,  H01L21/67103 ,  H01L21/6838 ,  H01L21/68757 ,  H01L21/68778 ,  H02S50/10 ,  Y10T279/11

摘要： In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

摘要翻译： 在一个实施例中，提供了用于在热点测试中支撑太阳能电池的卡盘。 卡盘的该实施例包括基部和设置在基部上方的支撑部。 所述支撑部构造成将所述太阳能电池支撑在所述基部的上方，并且在所述太阳能电池的底面与所述基部之间形成有将所述太阳能电池的底面的一部分与所述基部热分离的空腔。