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公开(公告)号:US09613926B2
公开(公告)日:2017-04-04
申请号:US14712729
申请日:2015-05-14
发明人: Chen-Hua Yu , Ming-Fa Chen , Wen-Ching Tsai
CPC分类号: H01L24/81 , B81C1/00238 , B81C3/001 , B81C2203/031 , B81C2203/035 , H01L21/50 , H01L23/10 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/03602 , H01L2224/03614 , H01L2224/03616 , H01L2224/03912 , H01L2224/0401 , H01L2224/04026 , H01L2224/05022 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05149 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05567 , H01L2224/05569 , H01L2224/05571 , H01L2224/056 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/06051 , H01L2224/08225 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11614 , H01L2224/119 , H01L2224/11912 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13149 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/16014 , H01L2224/16147 , H01L2224/2745 , H01L2224/27452 , H01L2224/27462 , H01L2224/27464 , H01L2224/2747 , H01L2224/27614 , H01L2224/279 , H01L2224/27912 , H01L2224/29011 , H01L2224/29013 , H01L2224/29014 , H01L2224/29082 , H01L2224/291 , H01L2224/29111 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29164 , H01L2224/29166 , H01L2224/32014 , H01L2224/32147 , H01L2224/32225 , H01L2224/73103 , H01L2224/80805 , H01L2224/80893 , H01L2224/80894 , H01L2224/80895 , H01L2224/80896 , H01L2224/81815 , H01L2224/8183 , H01L2224/83805 , H01L2224/83815 , H01L2224/8383 , H01L2224/92 , H01L2224/9202 , H01L2224/94 , H01L2924/10158 , H01L2924/1461 , H01L2924/163 , H01L2924/00014 , H01L2924/01014 , H01L2224/03 , H01L2224/11 , H01L2224/27 , H01L2924/00012 , H01L2224/0347 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2224/114 , H01L2224/1146 , H01L2224/1161 , H01L2224/274 , H01L2224/2746 , H01L2224/2761 , H01L21/302 , H01L2224/034 , H01L2224/0361 , H01L2224/80
摘要: Bonded structures and method of forming the same are provided. A conductive layer is formed on a first surface of a bonded structure, the bonded structure including a first substrate bonded to a second substrate, the first surface of the bonded structure being an exposed surface of the first substrate. A patterned mask having first openings and second openings is formed on the conductive layer, the first openings and the second openings exposing portions of the conductive layer. First portions of first bonding connectors are formed in the first openings and first portions of second bonding connectors are formed in the second openings. The conductive layer is patterned to form second portions of the first bonding connectors and second portions of the second bonding connectors. The bonded structure is bonded to a third substrate using the first bonding connectors and the second bonding connectors.
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公开(公告)号:US20160190089A1
公开(公告)日:2016-06-30
申请号:US14712729
申请日:2015-05-14
发明人: Chen-Hua Yu , Ming-Fa Chen , Wen-Ching Tsai
IPC分类号: H01L23/00
CPC分类号: H01L24/81 , B81C1/00238 , B81C3/001 , B81C2203/031 , B81C2203/035 , H01L21/50 , H01L23/10 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/80 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/03602 , H01L2224/03614 , H01L2224/03616 , H01L2224/03912 , H01L2224/0401 , H01L2224/04026 , H01L2224/05022 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05149 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05567 , H01L2224/05569 , H01L2224/05571 , H01L2224/056 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05684 , H01L2224/06051 , H01L2224/08225 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11614 , H01L2224/119 , H01L2224/11912 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13149 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/16014 , H01L2224/16147 , H01L2224/2745 , H01L2224/27452 , H01L2224/27462 , H01L2224/27464 , H01L2224/2747 , H01L2224/27614 , H01L2224/279 , H01L2224/27912 , H01L2224/29011 , H01L2224/29013 , H01L2224/29014 , H01L2224/29082 , H01L2224/291 , H01L2224/29111 , H01L2224/29124 , H01L2224/29138 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29149 , H01L2224/29155 , H01L2224/29164 , H01L2224/29166 , H01L2224/32014 , H01L2224/32147 , H01L2224/32225 , H01L2224/73103 , H01L2224/80805 , H01L2224/80893 , H01L2224/80894 , H01L2224/80895 , H01L2224/80896 , H01L2224/81815 , H01L2224/8183 , H01L2224/83805 , H01L2224/83815 , H01L2224/8383 , H01L2224/92 , H01L2224/9202 , H01L2224/94 , H01L2924/10158 , H01L2924/1461 , H01L2924/163 , H01L2924/00014 , H01L2924/01014 , H01L2224/03 , H01L2224/11 , H01L2224/27 , H01L2924/00012 , H01L2224/0347 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2224/114 , H01L2224/1146 , H01L2224/1161 , H01L2224/274 , H01L2224/2746 , H01L2224/2761 , H01L21/302 , H01L2224/034 , H01L2224/0361 , H01L2224/80
摘要: Bonded structures and method of forming the same are provided. A conductive layer is formed on a first surface of a bonded structure, the bonded structure including a first substrate bonded to a second substrate, the first surface of the bonded structure being an exposed surface of the first substrate. A patterned mask having first openings and second openings is formed on the conductive layer, the first openings and the second openings exposing portions of the conductive layer. First portions of first bonding connectors are formed in the first openings and first portions of second bonding connectors are formed in the second openings. The conductive layer is patterned to form second portions of the first bonding connectors and second portions of the second bonding connectors. The bonded structure is bonded to a third substrate using the first bonding connectors and the second bonding connectors.
摘要翻译: 提供了粘合结构及其形成方法。 导电层形成在接合结构的第一表面上,接合结构包括与第二基底结合的第一基底,接合结构的第一表面是第一基底的暴露表面。 具有第一开口和第二开口的图案化掩模形成在导电层上,第一开口和第二开口露出导电层的部分。 第一接合连接器的第一部分形成在第一开口中,第二接合连接器的第一部分形成在第二开口中。 图案化导电层以形成第一接合连接器的第二部分和第二接合连接器的第二部分。 使用第一接合连接器和第二接合连接器将接合结构接合到第三基板。
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