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公开(公告)号:US20050098605A1
公开(公告)日:2005-05-12
申请号:US10702416
申请日:2003-11-06
IPC分类号: B23K20/00 , H01L23/485 , B23K37/00
CPC分类号: H01L24/85 , B23K20/007 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05083 , H01L2224/05124 , H01L2224/05147 , H01L2224/05609 , H01L2224/05611 , H01L2224/05644 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48463 , H01L2224/48609 , H01L2224/48611 , H01L2224/48644 , H01L2224/48709 , H01L2224/48711 , H01L2224/48744 , H01L2224/85203 , H01L2224/85205 , H01L2224/85359 , H01L2224/85801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2924/01049 , H01L2924/00 , H01L2924/00015
摘要: A structure and method for low-pressure wirebonding, reducing the propensity of dielectric material to mechanical failure due to wirebond stress. A low temperature alloy on the surface of a bond pad allows alloy bond formation to occur between the wire and the bond pad at reduced bond pressures and reduced thermal and ultrasonic energies. Preferred alloys include Au—Sn and Au—In. The Au—Sn alloy may be formed over the Cu bond pad, incorporated in an aluminum bond pad stack, or deposited on a bond pad having Ni—Au capping of Cu or Al bond pads.
摘要翻译: 一种用于低压引线键合的结构和方法,降低了由于引线键应力导致的介电材料对机械故障的倾向。 接合焊盘表面上的低温合金允许在降低的接合压力和降低的热和超声能量的情况下在导线和接合焊盘之间形成合金结合。 优选的合金包括Au-Sn和Au-In。 Au-Sn合金可以形成在结合在铝焊盘叠层中的Cu焊盘上,或者沉积在具有Cu或Al键合焊盘的Ni-Au封盖的焊盘上。
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公开(公告)号:US08945990B2
公开(公告)日:2015-02-03
申请号:US13454115
申请日:2012-04-24
申请人: Holger Torwesten , Manfred Mengel , Stefan Schmid , Soon Lock Goh , Swee Kah Lee
发明人: Holger Torwesten , Manfred Mengel , Stefan Schmid , Soon Lock Goh , Swee Kah Lee
IPC分类号: H01L21/00
CPC分类号: H01L23/3121 , H01L23/296 , H01L23/3142 , H01L23/492 , H01L23/49513 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/29139 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48609 , H01L2224/48611 , H01L2224/48639 , H01L2224/48709 , H01L2224/48711 , H01L2224/48739 , H01L2224/48809 , H01L2224/48811 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83411 , H01L2224/83439 , H01L2224/83805 , H01L2224/85205 , H01L2224/85207 , H01L2224/85214 , H01L2224/85409 , H01L2224/85411 , H01L2224/85439 , H01L2224/85805 , H01L2224/8592 , H01L2224/85939 , H01L2924/00011 , H01L2924/01047 , H01L2924/01322 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01028 , H01L2924/01082 , H01L2924/01029 , H01L2924/01046 , H01L2924/0105 , H01L2224/83205
摘要: Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.
摘要翻译: 实施例提供了形成芯片封装的方法。 该方法可以包括在载体上附加至少一个芯片,该芯片包括在芯片的与载体相对的表面上的多个芯片焊盘; 在所述载体上和所述芯片的所述芯片焊盘上沉积第一粘合层,所述第一粘附层包括锡或铟; 在第一粘合层上沉积第二粘合层,第二粘合层包括硅烷有机材料; 以及在所述第二粘合层和所述芯片上沉积层压层或封装层。
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公开(公告)号:US20130277813A1
公开(公告)日:2013-10-24
申请号:US13454115
申请日:2012-04-24
申请人: Holger Torwesten , Manfred Mengel , Stefan Schmid , Soon Lock Goh , Swee Kah Lee
发明人: Holger Torwesten , Manfred Mengel , Stefan Schmid , Soon Lock Goh , Swee Kah Lee
IPC分类号: H01L23/495 , H01L21/50
CPC分类号: H01L23/3121 , H01L23/296 , H01L23/3142 , H01L23/492 , H01L23/49513 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/29139 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48609 , H01L2224/48611 , H01L2224/48639 , H01L2224/48709 , H01L2224/48711 , H01L2224/48739 , H01L2224/48809 , H01L2224/48811 , H01L2224/48839 , H01L2224/73265 , H01L2224/83191 , H01L2224/83193 , H01L2224/83411 , H01L2224/83439 , H01L2224/83805 , H01L2224/85205 , H01L2224/85207 , H01L2224/85214 , H01L2224/85409 , H01L2224/85411 , H01L2224/85439 , H01L2224/85805 , H01L2224/8592 , H01L2224/85939 , H01L2924/00011 , H01L2924/01047 , H01L2924/01322 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13091 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01028 , H01L2924/01082 , H01L2924/01029 , H01L2924/01046 , H01L2924/0105 , H01L2224/83205
摘要: Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.
摘要翻译: 实施例提供了形成芯片封装的方法。 该方法可以包括在载体上附加至少一个芯片,该芯片包括在芯片的与载体相对的表面上的多个芯片焊盘; 在所述载体上和所述芯片的所述芯片焊盘上沉积第一粘合层,所述第一粘附层包括锡或铟; 在第一粘合层上沉积第二粘合层,第二粘合层包括硅烷有机材料; 以及在所述第二粘合层和所述芯片上沉积层压层或封装层。
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4.Electronic devices having metallurgies containing copper-semiconductor compounds 失效
标题翻译: 具有包含铜半导体化合物的冶金的电子器件公开(公告)号:US5855993A
公开(公告)日:1999-01-05
申请号:US200811
申请日:1994-02-22
申请人: Michael John Brady , Curtis Edward Farrell , Sung Kwon Kang , Jeffrey Robert Marino , Donald Joseph Mikalsen , Paul Andrew Moskowitz , Eugene John O'Sullivan , Terrence Robert O'Toole , Sampath Purushothaman , Sheldon Cole Rieley , George Frederick Walker
发明人: Michael John Brady , Curtis Edward Farrell , Sung Kwon Kang , Jeffrey Robert Marino , Donald Joseph Mikalsen , Paul Andrew Moskowitz , Eugene John O'Sullivan , Terrence Robert O'Toole , Sampath Purushothaman , Sheldon Cole Rieley , George Frederick Walker
IPC分类号: H01L21/60 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/603 , H01L21/768 , H01L23/495 , H01L23/498 , H01L23/532 , B32B3/00 , B23K35/14 , H01L23/48
CPC分类号: H01L23/53271 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/2885 , H01L21/6835 , H01L21/76838 , H01L23/4951 , H01L23/4985 , H01L23/49872 , H01L24/05 , H01L24/97 , H01L2224/02126 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/13022 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/2919 , H01L2224/3015 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85001 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92147 , H01L24/03 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10S428/901 , Y10T428/24917
摘要: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
摘要翻译: 在电子设备中的导体的表面使用含锗和锗的材料。 焊料可无焊接,电线可以与这些表面引线接合。 这些材料用作用于封装集成电路芯片的引线框架的表面涂层。 这些材料可以贴花地转移到导体表面上,或者无电解或电解地放置在其上。
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