公开(公告)号：US07497365B2

公开(公告)日：2009-03-03

申请号：US11608897

申请日：2006-12-11

申请人： Hideo Kimura ,  Toshiyuki Yokoue ,  Yasuhiko Shiota

发明人： Hideo Kimura ,  Toshiyuki Yokoue ,  Yasuhiko Shiota

IPC分类号： B05C1/08 ,  B05C1/06

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L24/75 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/136 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/758 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/1275 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0534

摘要： A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.

摘要翻译： 描述了可以以窄间距向小直径凸块电极施加一定数量的焊膏的糊涂机。 糊涂机包括：由子框架支撑的转印辊; 用于使转印辊旋转的辊驱动机构; 糊状物存储单元，用于存储供给到转印辊表面的糊状物; 刮板具有平行于转印辊的旋转轴的远端边缘，其与远端边缘到转印辊表面间隔开; 用于保持并包括用于沿第一方向推动刮板的偏压装置的刮板保持器，从而扩大间隙; 以及具有用于沿第二方向推动刮板的偏置装置的间隙调节机构，从而使间隙变窄。

公开(公告)号：US20050284921A1

公开(公告)日：2005-12-29

申请号：US11157921

申请日：2005-06-22

申请人： Tadahiko Sakai ,  Tadashi Maeda

发明人： Tadahiko Sakai ,  Tadashi Maeda

IPC分类号： H01L21/60 ,  H05K3/34 ,  B23K31/00

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

摘要： A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

摘要翻译： 一种将在其上形成有焊料凸块（7）的电子部件（6）焊接到基板（12）上的方法，其中凸块（7）被压在其上形成有由金属粉末的焊剂（10）形成薄膜的焊剂转移台 （16），使焊料具有良好的润湿性，从而使金属粉末（16）穿透氧化膜（7a）并嵌入在凸块（7）的底部的表面上，并且在该状态下的凸块（7）被定位 并安装到基板（12）上的电极（12a）上。 然后将基板（12）加热以熔化凸块（7），并使熔融的焊料沿着金属粉末（16）的表面朝向电极（12a）流动并扩散。 因此，该方法可以提供高质量的焊接部分，而没有任何焊接缺陷和绝缘性能的劣化。

公开(公告)号：US20010014490A1

公开(公告)日：2001-08-16

申请号：US09783605

申请日：2001-02-15

发明人： Tsutomu Ida ,  Akio Ishizu ,  Masakazu Hashizume ,  Isao Hagiwara ,  Yoshinori Shiokawa

IPC分类号： H01L021/44

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L23/04 ,  H01L23/13 ,  H01L23/36 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L24/93 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/75305 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/181 ,  H05K3/341 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/05599

摘要： In a method of manufacturing a high frequency module to be assembled by providing, on a wiring board, a chip part and a semiconductor pellet to be bare chip mounted and then mounting the chip part and the semiconductor pellet through soldering, the wiring board is separated from a heat block with the semiconductor pellet pressurized against the wiring board in a main heating portion heating and melting a reflow solder, thereby cooling a soldering portion. Consequently, the generation of a void in the soldering portion can be prevented and the connecting reliability of the soldering portion can be enhanced. In addition, a degree of mounting horizontality of the semiconductor pellet on the wiring board can be enhanced.

摘要翻译： 在通过在布线基板上设置裸芯片安装的芯片部件和半导体芯片，然后通过焊接来安装芯片部件和半导体芯片来制造要组装的高频模块的方法中，布线板被分离 从加热和熔化回流焊料的主加热部分中的半导体芯片加热到布线板的散热块，从而冷却焊接部分。 因此，可以防止在焊接部分中产生空隙，并且可以提高焊接部分的连接可靠性。 此外，可以提高半导体芯片在布线板上的安装水平度。

公开(公告)号：US20130062782A1

公开(公告)日：2013-03-14

申请号：US13600153

申请日：2012-08-30

申请人： Atsushi Yoshimura ,  Shoko Omizo

发明人： Atsushi Yoshimura ,  Shoko Omizo

IPC分类号： H01L23/48 ,  B32B38/18 ,  H01L21/50

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L21/67144 ,  H01L23/3121 ,  H01L24/75 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/75745 ,  H01L2224/758 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/181 ,  Y10T156/1744 ,  H01L2924/00014 ,  H01L2924/00012

摘要： After formation of an opening by exposing and development of the photosensitive surface protection film and adhesive layer which is formed on the circuit side of the semiconductor wafer, the semiconductor chips having a photosensitive surface protection film and adhesive layer thereon is fabricated by cutting individual chips from the semiconductor wafer. After the second semiconductor chip is placed over the first semiconductor chip up by the suction collet, the second semiconductor chip is bonded with the first semiconductor chip by the first surface protection film and adhesive layer. The suction side of the suction collet has lower adhesion to the second semiconductor chip than that between the now bonded semiconductor chips.

摘要翻译： 通过曝光和显影形成在半导体晶片的电路侧上的感光表面保护膜和粘合剂层形成开口后，通过将单独的芯片切割成具有感光表面保护膜和粘合剂层的半导体芯片， 半导体晶片。 在第二半导体芯片被吸入夹头放置在第一半导体芯片上之后，第二半导体芯片通过第一表面保护膜和粘合剂层与第一半导体芯片接合。 吸入夹头的吸入侧与现在粘接的半导体芯片之间的吸附侧具有比第二半导体芯片更低的粘附力。

公开(公告)号：US08209858B2

公开(公告)日：2012-07-03

申请号：US11627719

申请日：2007-01-26

申请人： Roland Speckels ,  Karsten Guth

发明人： Roland Speckels ,  Karsten Guth

IPC分类号： H05K13/04

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75314 ,  H01L2224/758 ,  H01L2224/81005 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/1305 ,  H01L2924/13055 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00

摘要： An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

摘要翻译： 一种用于使用具有工具子结构（5）和工具上部结构（6）的组装工具将多个部件（9,10）特别是具有不规则表面形貌的部件安装在支撑件（7）上的装置，其中所述工具子结构 （5）被设计成接收支撑件和要安装在其上的部件，并且除了用于传递组装力的装置（11,12）之外，工具上部结构（6）还具有用于补偿 部件和支撑件和/或用于补偿不规则表面拓扑结构的装置。

公开(公告)号：US20070137559A1

公开(公告)日：2007-06-21

申请号：US11608897

申请日：2006-12-11

申请人： Hideo Kimura ,  Toshiyuki Yokoue ,  Yasuhiko Shiota

发明人： Hideo Kimura ,  Toshiyuki Yokoue ,  Yasuhiko Shiota

IPC分类号： B05C1/06 ,  B05C11/00

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L24/75 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/136 ,  H01L2224/75 ,  H01L2224/7515 ,  H01L2224/758 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H05K3/1275 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0534

摘要： A paste coater that can apply an amount of a solder paste to small-diameter bump electrodes at a narrow pitch is described. A paste coater includes: a transfer roller, supported by a sub frame; a roller drive mechanism for rotating the transfer roller; a paste storage unit for storing paste to be supplied to the surface of the transfer roller; a squeegee having a distal edge, parallel to the rotary shaft of the transfer roller, separated by a gap from the distal edge to the surface of the transfer roller; a squeegee holder for holding and including biasing means for pushing the squeegee in a first direction thereby widening the gap; and a gap adjustment mechanism with biasing means for pushing the squeegee in a second direction thereby narrowing the gap.

摘要翻译： 描述了可以以窄间距向小直径凸块电极施加一定数量的焊膏的糊涂机。 糊涂机包括：由子框架支撑的转印辊; 用于使转印辊旋转的辊驱动机构; 糊状物存储单元，用于存储供给到转印辊表面的糊状物; 刮板具有平行于转印辊的旋转轴的远端边缘，其与远端边缘到转印辊表面间隔开; 用于保持并包括用于沿第一方向推动刮板的偏压装置的刮板保持器，从而扩大间隙; 以及具有用于沿第二方向推动刮板的偏置装置的间隙调节机构，从而使间隙变窄。

公开(公告)号：US07222773B2

公开(公告)日：2007-05-29

申请号：US10828414

申请日：2004-04-20

申请人： Toru Kuboi

发明人： Toru Kuboi

IPC分类号： B23K1/00 ,  B23K5/00 ,  B23K37/04

CPC分类号： H01L21/67253 ,  B23K20/023 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/758 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/0401

摘要： There is disclosed a semiconductor bonding apparatus which mounts a semiconductor chip via an elastic member disposed between the semiconductor chip and a mounting substrate, comprising a holding section which holds the semiconductor chip facing the mounting substrate, a translatory gas bearing which is connected to the holding section and which is capable of moving the semiconductor chip in a bonding direction with respect to the mounting substrate, a voice coil motor connected to the translatory gas bearing, a load cell which detects a pressing force to be applied to the elastic member by the holding section, and a driving section which generates a driving signal in accordance with the pressing force detected by the load cell to drive the voice coil motor.

摘要翻译： 公开了一种半导体接合装置，其通过设置在半导体芯片和安装基板之间的弹性构件安装半导体芯片，该弹性构件包括：保持部，保持半导体芯片面向安装基板;平移气体轴承， 并且能够相对于安装基板在接合方向上移动半导体芯片，连接到平移气体轴承的音圈电动机，负载传感器，其通过保持来检测施加到弹性部件的按压力 以及驱动部，其根据由测力传感器检测出的按压力产生驱动信号，以驱动音圈马达。

公开(公告)号：US20060091555A1

公开(公告)日：2006-05-04

申请号：US11037266

申请日：2005-01-19

申请人： Koichi Shimamura ,  Kazuyuki Ikura

发明人： Koichi Shimamura ,  Kazuyuki Ikura

IPC分类号： H01L23/48

CPC分类号： H05K13/0452 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/758 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An apparatus 1 for mounting an electronic part to a substrate according to the present invention includes: a mounting unit 12 for mounting an electronic part 11 to a substrate 10; a substrate supplying unit 17 for supplying the substrate 10 to a predetermined position; an electronic part supplying unit 14 for supplying the electronic part 11 to the unit 12; a substrate return transporting unit 32 for transporting the substrate 10, on which the electronic part 11 has been mounted by the unit 12, to a predetermined position; a carrier 100 which detachably holds the substrate supplied from the unit 17 and has a heat capacity of a predetermined value or higher; and a carrier heating and moving unit 101 for moving the carrier 100 from a substrate transport start position 13a of a substrate feed transporting unit 13 to a predetermined position while heating the carrier 100.

摘要翻译： 根据本发明的用于将电子部件安装到基板的装置1包括：用于将电子部件11安装到基板10的安装单元12; 用于将基板10供给到预定位置的基板供给单元17; 电子部件供应单元14，用于将电子部件11提供给单元12; 用于将其上安装了电子部件11的基板10输送到预定位置的基板返回传送单元32; 载体100，其可拆卸地保持从单元17供应并具有预定值或更高的热容量的基板; 以及载体加热和移动单元101，用于在载体100加热的同时将载体100从基材输送传送单元13的基板传送开始位置13a移动到预定位置。

公开(公告)号：US6015081A

公开(公告)日：2000-01-18

申请号：US206270

申请日：1994-03-07

申请人： Takahiro Okabayashi ,  Tetsuo Yoshizawa ,  Toyohide Miyazaki ,  Hiroshi Kondo ,  Yoshimi Terayama ,  Takashi Sakaki ,  Yuichi Ikegami ,  Kazuo Kondo ,  Yoichi Tamura ,  Yasuo Nakatsuka

发明人： Takahiro Okabayashi ,  Tetsuo Yoshizawa ,  Toyohide Miyazaki ,  Hiroshi Kondo ,  Yoshimi Terayama ,  Takashi Sakaki ,  Yuichi Ikegami ,  Kazuo Kondo ,  Yoichi Tamura ,  Yasuo Nakatsuka

IPC分类号： B23K31/02 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R12/55 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01R12/714 ,  H05K3/368 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75313 ,  H01L2224/758 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K3/325 ,  H05K3/328

摘要： A method for the electrical connection between electrical joints of electric circuit components includes disposing said electric circuit components so that said joints for the electrical connection are opposed to each other, and making the electrical connection between said electrical joints with a biasing force which is exerted by an elastic member from at least one side of said electric circuit component so that the biasing force is exerted consecutively from an intermediate position of connecting area where said joints are located to the periphery of said connecting area.

摘要翻译： 一种用于电气电路部件的电接头之间的电连接的方法包括布置所述电路部件，使得所述用于电连接的所述接头彼此相对，并且以所述电接头之间的电连接以由 来自所述电路部件的至少一侧的弹性部件，使得所述偏置力从所述接头所在的连接区域的中间位置连续地施加到所述连接区域的周边。

公开(公告)号：US20150083786A1

公开(公告)日：2015-03-26

申请号：US14497424

申请日：2014-09-26

申请人： NIKON CORPORATION

发明人： Kazuya OKAMOTO ,  Isao SUGAYA ,  Naohiko KURATA ,  Masashi OKADA ,  Hajime MITSUISHI

IPC分类号： H01L23/00 ,  B23K37/04 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L24/75 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/68 ,  H01L22/12 ,  H01L22/20 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/758 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81047 ,  H01L2224/8109 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/8115 ,  H01L2224/8116 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

摘要翻译： 一种将第一基板和第二基板结合在一起的基板接合装置，包括将第一基板和第二基板连接在一起的接合部分，彼此对准以便堆叠; 检测部，其在由所述接合部接合之前，检测所述第一基板和所述第二基板中的至少一个上的不均匀状态; 以及确定部，其确定由所述检测部检测到的所述不均匀状态是否满足预定条件，其中如果由所述确定部确定所述接合部不接合所述第一基板和所述第二基板，所述不均匀状态不满足 预定条件。