公开(公告)号：US09931709B2

公开(公告)日：2018-04-03

申请号：US15409172

申请日：2017-01-18

申请人： ORTHODYNE ELECTRONICS CORPORATION

发明人： Dominick A. DeAngelis

IPC分类号： B23K31/02 ,  B23K20/10 ,  H01L23/00 ,  B23K20/00

CPC分类号： B23K20/106 ,  B23K20/004 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/78252 ,  H01L2224/78319 ,  H01L2224/78349 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099

摘要： A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

公开(公告)号：US20170209956A1

公开(公告)日：2017-07-27

申请号：US15409172

申请日：2017-01-18

申请人： ORTHODYNE ELECTRONICS CORPORATION

发明人： Dominick A. DeAngelis

IPC分类号： B23K20/10 ,  H01L23/00

CPC分类号： B23K20/106 ,  B23K20/004 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/78252 ,  H01L2224/78319 ,  H01L2224/78349 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099

摘要： A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

公开(公告)号：US08967452B2

公开(公告)日：2015-03-03

申请号：US13448866

申请日：2012-04-17

申请人： Yiu Ming Cheung ,  Tsan Yin Peter Lo ,  Ming Li ,  Yick Hong Mak ,  Ka San Lam

发明人： Yiu Ming Cheung ,  Tsan Yin Peter Lo ,  Ming Li ,  Yick Hong Mak ,  Ka San Lam

IPC分类号： B23K31/02 ,  B23K26/20

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/75251 ,  H01L2224/75263 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/78252 ,  H01L2224/78253 ,  H01L2224/81048 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/9205 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

摘要： A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

摘要翻译： 通过首先将芯片上的电触点对准到将要安装裸片的基板上的接合焊盘，准备用于热压接的裸片。 这些电触头用接合工具保持在基板上的接合焊盘上。 通过向模具的一部分提供热量将模具部分地粘合到基板上，以将其温度升高到电触点中焊料的熔点以使熔化至少一些焊料。 然后热压整个模头并将其加热到电触头的焊料的熔点以上，使得电接触部分外部的电触点的焊料也被熔化，以将模具结合到衬底。

公开(公告)号：US20150303166A1

公开(公告)日：2015-10-22

申请号：US14642667

申请日：2015-03-09

申请人： FUJI ELECTRIC CO., LTD.

发明人： Fumihiko MOMOSE ,  Takashi SAITO ,  Kazumasa KIDO ,  Yoshitaka NISHIMURA

IPC分类号： H01L23/00 ,  B23K20/10 ,  B23K20/26 ,  B23K20/00

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K20/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2224/78252 ,  H01L2224/78313 ,  H01L2224/78353 ,  H01L2224/78611 ,  H01L2224/789 ,  H01L2224/85048 ,  H01L2224/85099 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/2076 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00015

摘要： Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 μm and not greater than 600 μm. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50° C. and not higher than 100° C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device.

摘要翻译： 提供一种用于通过引线接合将电极和铝合金线彼此电连接的引线接合装置。 该装置包括馈送线的送丝装置。 电线的直径不小于500μm，不大于600μm。 该装置包括加热装置将线材加热至不低于50℃且不高于100℃的温度。该装置还包括将线压靠在电极上的压力装置。 该装置还包括：超声波发生装置，其产生施加到由压力装置按压的线材的超声波振动。

公开(公告)号：US07576297B2

公开(公告)日：2009-08-18

申请号：US11480195

申请日：2006-06-30

申请人： Kazuo Fujita ,  Toru Maeda

发明人： Kazuo Fujita ,  Toru Maeda

IPC分类号： B23K10/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region 52 in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma 303 containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.

摘要翻译： 一种接合装置，包括：毛细管40，其顶端部具有高频线圈50，并使接合线2通过;位置改变单元，用于改变接合线的前端的位置;气体供给单元， 向毛细管供应气体，以及用于向高频线圈提供高频电力的高频电源单元。 当接合线在毛细管中的等离子体区域52之外时，在等离子体区域中产生的微血浆从毛细管中排出，并去除粘合对象表面上的异物或污染物。 当接合线在等离子体区域内时，接合线的材料变成微细的颗粒，并且从毛细管喷出含有溅射的细颗粒的微量的等离子体303，使得与接合线相同的材料沉积在 绑定主体。

公开(公告)号：US20080093416A1

公开(公告)日：2008-04-24

申请号：US11818754

申请日：2007-06-15

申请人： Tetsuya Utano ,  Yutaka Kondo ,  Toru Maeda

发明人： Tetsuya Utano ,  Yutaka Kondo ,  Toru Maeda

IPC分类号： B23K1/06 ,  B23K1/00 ,  B23K3/00

CPC分类号： B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78252 ,  H01L2224/78302 ,  H01L2224/78308 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A tip end portion and an outer surface of a capillary (or of a wedge tool) used in, for instance, a wire bonding apparatus and method, being covered by a diamond layer with a heating element attached to the outer surface thereof. The inside of the capillary is formed by alumina ceramics, having a tapered hole. The tip end of the capillary is formed by the diamond layer, and a face portion and an inner chamfer portion are formed at the tip end to make a wire heating portion. Heat is transferred from the heating element to the wire heating portion through a heat supply path formed by the diamond layer, and a bonding surface formed by a wire and a pad is heated.

摘要翻译： 在例如引线接合装置和方法中使用的毛细管（或楔形工具）的前端部分和外表面被金刚石层覆盖，加热元件附接到其外表面。 毛细管内部由具有锥形孔的氧化铝陶瓷形成。 毛细管的前端由金刚石层形成，并且在前端形成面部和内倒角部，以形成线加热部。 通过由金刚石层形成的供热路径将加热元件从加热元件传递到线加热部分，并且加热由金属丝和焊盘形成的接合表面。

公开(公告)号：US4315128A

公开(公告)日：1982-02-09

申请号：US894344

申请日：1978-04-07

申请人： Thomas J. Matcovich ,  Dan Valenski

发明人： Thomas J. Matcovich ,  Dan Valenski

IPC分类号： H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  B23K3/00 ,  H05B3/16

CPC分类号： H01L24/78 ,  H01L2224/78252 ,  H01L2224/78302 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/19043

摘要： A heated bonding tool for the manufacture of semiconductor devices comprises a high density non-porous alumina body having a mounting portion at one end and a working portion at the other end. The working portion end is tapered and converges toward the working tip portion. An electrically conductive-resistive thick film is deposited over the outer surface of the tapered portion intermediate said mounting portion and said working tip portion which is capable of heating said working tip of said bonding tool up to 600.degree. C. Preferably the thick film material has a positive or negative temperature coefficient of resistance which permits the temperature of the working tip to be monitored as a function of the measured resistance of the thick film. An insulative heat resistant terminal block is provided with a pair of resilient leads connected to a power source. Cam means on the terminal block are adapted to move the resilient leads to permit release of the leads from engagement with thick film conductive leads deposited on the mounting portion of the bonding tool.

摘要翻译： 用于制造半导体器件的加热焊接工具包括高密度无孔氧化铝主体，其具有一端的安装部分和另一端的工作部分。 工作部分端部是锥形的并且朝着工作尖端部分会聚。 在所述安装部分和所述工作尖端部分之间的锥形部分的外表面上沉积导电电阻厚膜，其能够将所述焊接工具的所述工作尖端加热至600℃。优选地，厚膜材料具有 电阻的正或负温度系数允许工作尖端的温度作为测得的厚膜电阻的函数来监测。 绝缘耐热端子块设置有连接到电源的一对弹性引线。 接线端子上的凸轮装置适于移动弹性引线，以允许引线脱离与沉积在接合工具的安装部分上的厚膜导电引线接合。

公开(公告)号：US20180200828A1

公开(公告)日：2018-07-19

申请号：US15924056

申请日：2018-03-16

申请人： Kulicke and Soffa Industries, Inc.

发明人： Dominick A. DeAngelis

IPC分类号： B23K20/10 ,  B23K20/00 ,  H01L23/00

CPC分类号： B23K20/106 ,  B23K20/004 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/78252 ,  H01L2224/78319 ,  H01L2224/78343 ,  H01L2224/78349 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2924/206

摘要： A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

公开(公告)号：US20130270230A1

公开(公告)日：2013-10-17

申请号：US13448866

申请日：2012-04-17

申请人： Yiu Ming CHEUNG ,  Tsan Yin Peter LO ,  Ming LI ,  Yick Hong MAK ,  Ka San LAM

发明人： Yiu Ming CHEUNG ,  Tsan Yin Peter LO ,  Ming LI ,  Yick Hong MAK ,  Ka San LAM

IPC分类号： B23K26/00 ,  B23K3/04 ,  B23K31/02

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/75251 ,  H01L2224/75263 ,  H01L2224/75744 ,  H01L2224/75753 ,  H01L2224/78252 ,  H01L2224/78253 ,  H01L2224/81048 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/9205 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

摘要： A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

摘要翻译： 通过首先将芯片上的电触点对准到将要安装裸片的基板上的接合焊盘，准备用于热压接的裸片。 这些电触头用接合工具保持在基板上的接合焊盘上。 通过向模具的一部分提供热量将模具部分地粘合到基板上，以将其温度升高到电触点中焊料的熔点以使熔化至少一些焊料。 然后热压整个模头并将其加热到电触头的焊料的熔点以上，使得电接触部分外部的电触点的焊料也被熔化，以将模具结合到衬底。

公开(公告)号：US08444044B2

公开(公告)日：2013-05-21

申请号：US12062989

申请日：2008-04-04

申请人： Low Peng Wang ,  Mitchell Ong ,  Lee Choon Kuan

发明人： Low Peng Wang ,  Mitchell Ong ,  Lee Choon Kuan

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  B23K20/24 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/78252 ,  H01L2224/78283 ,  H01L2224/78301 ,  H01L2224/85048 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85948 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.

摘要翻译： 引线接合装置包括处理块，接合头组件和红外辐射源，用于选择性地加热衬底上的一个或多个半导体管芯和/或结合部位的焊盘区域。 还公开了使用对衬底上的一个或多个半导体管芯和/或结合部位的焊盘区域进行选择性加热来形成引线接合的方法。