公开(公告)号：US08923005B2

公开(公告)日：2014-12-30

申请号：US13400342

申请日：2012-02-20

Applicant: Rainer Dohle ,  Florian Schuessler ,  Rolf Diehm ,  Oliver Kessling ,  Thomas Oppert

Inventor： Rainer Dohle ,  Florian Schuessler ,  Rolf Diehm ,  Oliver Kessling ,  Thomas Oppert

IPC: H05K7/00 ,  H01L23/28 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/10135 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1319 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29388 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/053 ,  H01L2924/049 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: An electrical component and a method for the manufacture thereof, comprising a connection arrangement between an active surface of an electrical component and a carrier, wherein electrical connecting elements are disposed in a connection zone on the active surface and/or on the carrier, and at least one spacer element is provided, which is disposed on the active surface and/or on the carrier. The at least one spacer element has a smaller height than the connecting elements before the connecting elements are reflowed to produce the electrically conductive connection, and is preferably disposed in an edge region of the connection zone.

Abstract translation: 一种电气部件及其制造方法，包括电气部件的活性表面和载体之间的连接装置，其中电连接元件设置在活性表面和/或载体上的连接区域中，并且在 提供了至少一个间隔元件，其设置在活性表面和/或载体上。 所述至少一个间隔元件在连接元件回流之前具有比连接元件更小的高度以产生导电连接，并且优选地设置在连接区域的边缘区域中。

公开(公告)号：US20120088330A1

公开(公告)日：2012-04-12

申请号：US13269609

申请日：2011-10-09

Applicant: Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

Inventor： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC: H01L21/50

CPC classification number: H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

Abstract: A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

Abstract translation: 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

公开(公告)号：US07817434B2

公开(公告)日：2010-10-19

申请号：US11403492

申请日：2006-04-13

Applicant: James M. Hattis

Inventor： James M. Hattis

IPC: H05K1/00

CPC classification number: H01L24/17 ,  H01L23/3677 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/13291 ,  H01L2224/13299 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/17519 ,  H01L2224/81141 ,  H01L2224/81385 ,  H01L2224/81902 ,  H01L2224/94 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/0154 ,  H05K2201/10674 ,  H01L2224/11 ,  H01L2224/0401

Abstract: A method and apparatus for improving the thermal conductivity of a circuit board (CB) assembly comprising an integrated circuit (IC) die mounted on a CB. A high thermal conductivity device is attached on a first end to a surface of the die. When the die is mounted on the CB, a void formed in the CB receives a second end of the HTC device, and the second end of the HTC device comes into contact with a portion of the CB. During operation of the die, heat produced by the die is dissipated through the HTC device and into the CB.

Abstract translation: 一种用于改善电路板（CB）组件的热导率的方法和装置，其包括安装在CB上的集成电路（IC）模具。 高导热性装置在第一端附接到模具的表面。 当芯片安装在CB上时，形成在CB中的空隙接收HTC设备的第二端，并且HTC设备的第二端与CB的一部分接触。 在模具的操作期间，由模具产生的热量通过HTC装置消散并进入CB。

公开(公告)号：US09287210B2

公开(公告)日：2016-03-15

申请号：US14561751

申请日：2014-12-05

Applicant: FUJITSU LIMITED

Inventor： Hajime Kubota

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/525 ,  H01L23/34 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/525 ,  H01L23/345 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1012 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13025 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13187 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/13561 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13647 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/81815 ,  H01L2224/819 ,  H01L2224/81902 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00012 ,  H01L2924/0715 ,  H01L2924/0497 ,  H01L2924/01025 ,  H01L2924/0549 ,  H01L2924/05342 ,  H01L2924/0536 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014

Abstract: A semiconductor device includes: a first semiconductor-chip including a first electrode; a second semiconductor-chip including a second electrode; and a switch including a core element configured to contract and expand by a temperature change, a heat generation unit configured to heat the core element, a first metal element configured to cover the core element and connected to the first electrode, and a second metal element configured to cover the core element and connected to the second electrode, wherein, when the core element contracts, the first metal element and the second metal element come in contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically connected with each other, and when the core element expands, the first metal element and the second metal element become in non-contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically separated from each other.

Abstract translation: 一种半导体器件包括：包括第一电极的第一半导体芯片; 包括第二电极的第二半导体芯片; 以及包括被构造成通过温度变化而收缩和膨胀的芯体元件的开关，被配置为加热所述芯元件的发热单元，被配置为覆盖所述芯元件并连接到所述第一电极的第一金属元件，以及第二金属元件 被配置为覆盖所述芯体并连接到所述第二电极，其中，当所述芯体收缩时，所述第一金属元件和所述第二金属元件彼此接触，使得所述第一半导体芯片和所述第二半导体芯片是 彼此电连接，并且当芯元件膨胀时，第一金属元件和第二金属元件彼此不接触，使得第一半导体芯片和第二半导体芯片彼此电分离。

公开(公告)号：US20140166194A1

公开(公告)日：2014-06-19

申请号：US14089612

申请日：2013-11-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd. ,  IMEC

Inventor： Yu-Hsiang Hu ,  Chung-Shi Liu

IPC: H01L23/00

CPC classification number: H01L24/06 ,  G03F7/0002 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/742 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/98 ,  H01L2224/02126 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05562 ,  H01L2224/05572 ,  H01L2224/10126 ,  H01L2224/111 ,  H01L2224/1144 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11602 ,  H01L2224/1181 ,  H01L2224/1182 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13541 ,  H01L2224/13562 ,  H01L2224/13693 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/1703 ,  H01L2224/17505 ,  H01L2224/29036 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81902 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  Y10T29/49 ,  Y10T29/49014 ,  Y10T29/49117 ,  Y10T156/1028 ,  Y10T156/11 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method is provided for transferring a graphene sheet to metal contact bumps of a substrate that is to be used in a semiconductor device package, i.e. a stack of substrates connected by said contact bumps, e.g., copper contact bumps for which graphene forms a protective layer. An imprinter device can be used comprising an imprinter substrate, said substrate being provided with cavities, whereof each cavity is provided with a rim portion. The imprinter substrate is aligned with the substrate comprising the bumps and lowered onto said substrate so that each bump becomes enclosed by a cavity, until the rim portion of the cavities cuts through the graphene sheet, leaving graphene layer portions on top of each of bumps when the imprinter is removed. The graphene sheet is preferably attached to the substrate by imprinting it into a passivation layer surrounding the bumps.

Abstract translation: 提供了一种用于将石墨烯片材转移到用于半导体器件封装中的衬底的金属接触凸块的方法，即由所述接触凸块连接的一叠衬底，例如，石墨烯形成保护层的铜接触凸块 。 可以使用包含打印机基板的打印机装置，所述基板设置有空腔，每个空腔设置有边缘部分。 打印机基板与包括凸块的基板对准并且下降到所述基板上，使得每个凸块被空腔包围，直到空腔的边缘部分穿过石墨烯片，在每个凸块的顶部留下石墨烯层部分， 打印机被删除。 石墨烯片优选通过将其印刷到围绕凸起的钝化层中附着到基底上。

公开(公告)号：US08525353B2

公开(公告)日：2013-09-03

申请号：US13330316

申请日：2011-12-19

Applicant: Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

Inventor： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/473 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06519 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1161 ,  H01L2224/11618 ,  H01L2224/11825 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/1401 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/17519 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81902 ,  H01L2224/81903 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01024 ,  H01L2924/0104 ,  H01L2924/014 ,  H01L2924/00

Abstract: In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.

Abstract translation: 在使用电子微弹簧将集成电路管芯临时或永久连接到基底基板的系统中，提供了一种热元件，其有助于在使用期间对焊盘结构进行冷却。 热元件可以由与微弹簧相同的材料和我类似的方法形成。 热元件可以是一个或多个块结构或一个或多个热微型弹簧。 热元件可以设置有容纳和/或引导热传递流体的流动的通道。 可以提供与衬垫结构（例如，IC）相关联的部件的冷却。

公开(公告)号：US09204551B2

公开(公告)日：2015-12-01

申请号：US13883130

申请日：2011-11-08

Applicant: Masahiro Kubo

Inventor： Masahiro Kubo

IPC: H02B1/00 ,  H05K1/18 ,  H01L23/13 ,  H05K3/34 ,  H01L23/00 ,  H05K1/11 ,  H05K1/02 ,  G02B6/42

CPC classification number: H05K1/18 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/4274 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/13011 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/16237 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/29111 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/81902 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/0274 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/1173 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00

Abstract: Provided is a mounting structure capable of maintaining highly accurate connection reliability even when the temperature of the environment in which the mounting structure is used is high. Mounting structure (10) includes electronic component (11), metal (12), wiring substrate (13), and a preventing structure. Electronic component (11) includes first electrode (14). The melting point of metal (12) is 130° C. or less. Wiring substrate (13) includes second electrode (15) electrically connected to first electrode (14) via metal (12). The preventing structure prevents flowing-out of metal (12) in a melted state from a region where first electrode (14) and second electrode (15) are formed. Further, preventing structure (14) is formed in at least one member selected from electronic component (11) and wiring substrate (12).

Abstract translation: 提供了即使当使用安装结构的环境的温度高时也能够保持高度精确的连接可靠性的安装结构。 安装结构（10）包括电子部件（11），金属（12），布线基板（13）和防止结构。 电子部件（11）包括第一电极（14）。 金属（12）的熔点为130℃以下。 配线基板（13）包括通过金属（12）与第一电极（14）电连接的第二电极（15）。 防止结构防止从形成第一电极（14）和第二电极（15）的区域流出熔融状态的金属（12）。 此外，防止结构（14）形成在从电子部件（11）和布线基板（12）中选择的至少一个中。

公开(公告)号：US20150200157A1

公开(公告)日：2015-07-16

申请号：US14561751

申请日：2014-12-05

Applicant: FUJITSU LIMITED

Inventor： Hajime Kubota

IPC: H01L23/525 ,  H01L25/065 ,  H01L23/34

CPC classification number: H01L23/525 ,  H01L23/345 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1012 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13025 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13187 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/13561 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13647 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/81815 ,  H01L2224/819 ,  H01L2224/81902 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00012 ,  H01L2924/0715 ,  H01L2924/0497 ,  H01L2924/01025 ,  H01L2924/0549 ,  H01L2924/05342 ,  H01L2924/0536 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014

Abstract: A semiconductor device includes: a first semiconductor-chip including a first electrode; a second semiconductor-chip including a second electrode; and a switch including a core element configured to contract and expand by a temperature change, a heat generation unit configured to heat the core element, a first metal element configured to cover the core element and connected to the first electrode, and a second metal element configured to cover the core element and connected to the second electrode, wherein, when the core element contracts, the first metal element and the second metal element come in contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically connected with each other, and when the core element expands, the first metal element and the second metal element become in non-contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically separated from each other.

Abstract translation: 一种半导体器件包括：包括第一电极的第一半导体芯片; 包括第二电极的第二半导体芯片; 以及包括被构造成通过温度变化而收缩和膨胀的芯体元件的开关，被配置为加热所述芯元件的发热单元，被配置为覆盖所述芯元件并连接到所述第一电极的第一金属元件，以及第二金属元件 被配置为覆盖所述芯体并连接到所述第二电极，其中，当所述芯体收缩时，所述第一金属元件和所述第二金属元件彼此接触，使得所述第一半导体芯片和所述第二半导体芯片是 彼此电连接，并且当芯元件膨胀时，第一金属元件和第二金属元件彼此不接触，使得第一半导体芯片和第二半导体芯片彼此电分离。

公开(公告)号：US20140374912A1

公开(公告)日：2014-12-25

申请号：US13925753

申请日：2013-06-24

Applicant: Palo Alto Research Center Incorporated

Inventor： John C. Knights

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/06051 ,  H01L2224/06154 ,  H01L2224/06515 ,  H01L2224/1111 ,  H01L2224/13016 ,  H01L2224/13023 ,  H01L2224/13027 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13171 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14154 ,  H01L2224/14505 ,  H01L2224/16105 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/17517 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81902 ,  H01L2224/81905 ,  H01L2924/12041 ,  H05K3/32 ,  H05K3/341 ,  H05K2201/0311 ,  H05K2201/10674 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/01024 ,  H01L2924/01074 ,  H01L2924/0104 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: Standard solder-based interconnect structures are utilized as mechanical fasteners to attach an IC die in a “flip-chip” orientation to a support structure (e.g., a package base substrate or printed circuit board). Electrical connections between the support structure and the IC die are achieved by curved micro-springs that are disposed in peripheral regions of the IC die and extend through a gap region separating the upper structure surface and the processed surface of the IC die. The micro-springs are fixedly attached to one of the support structure and the IC die, and have a free (tip) end that contacts an associated contact pad disposed on the other structure/IC die. Conventional solder-based connection structures (e.g., solder-bumps/balls) are disposed on “dummy” (non-functional) pads disposed in a central region of the IC die. After placing the IC die on the support structure, a standard solder reflow process is performed to complete the mechanical connection.

Abstract translation: 标准的基于焊料的互连结构被用作机械紧固件，以将“芯片”取向的IC管芯连接到支撑结构（例如，封装基底或印刷电路板）上。 支撑结构和IC芯片之间的电连接通过设置在IC管芯的周边区域中的弯曲的微型弹簧实现，并且延伸穿过分离IC模具的上部结构表面和加工表面的间隙区域。 微弹簧固定地附接到支撑结构和IC模具中的一个，并且具有与设置在另一个结构/ IC芯片上的相关接触焊盘接触的自由（尖端）端。 常规的基于焊料的连接结构（例如，焊料凸起/球）设置在设置在IC管芯的中心区域中的“虚拟”（非功能）焊盘上。 将IC管芯放置在支撑结构上之后，进行标准的回流焊工艺以完成机械连接。

公开(公告)号：US20010049158A1

公开(公告)日：2001-12-06

申请号：US09811803

申请日：2001-03-19

Inventor： Mike Warner ,  Elliott Pflughaupt

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L24/81 ,  H01L24/14 ,  H01L2224/10135 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81902 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/81805

Abstract: A method of making a microelectronic assembly comprises providing a first side assembly juxtaposed with a second side assembly and a first resilient element disposed therebetween. Leads extend between the first side assembly and the second side assembly. A compressive force is applied to the juxtaposed assemblies so as to compress the first resilient element and the compressive force is at least partially released so as to allow the first resilient element to expand, thereby moving one or both of the first side assembly and the second side assembly to deform the leads.

Abstract translation: 制造微电子组件的方法包括提供与第二侧组件并置的第一侧组件和设置在其间的第一弹性元件。 引线在第一侧组件和第二侧组件之间延伸。 压缩力被施加到并置组件以便压缩第一弹性元件，并且压缩力被至少部分地释放，以便允许第一弹性元件膨胀，从而移动第一侧组件和第二弹性元件中的一个或两个 侧组件使引线变形。