摘要:
A static induction transistor is formed on a silicon carbide substrate doped with a first conductivity type. First recessed regions in a top surface of the silicon carbide substrate are filled with epitaxially grown gate regions in situ doped with a second conductivity type. Epitaxially grown channel regions in situ doped with the first conductivity type are positioned between adjacent epitaxial gate regions. Epitaxially grown source regions in situ doped with the first conductivity type are positioned on the epitaxial channel regions. The bottom surface of the silicon carbide substrate includes second recessed regions vertically aligned with the channel regions and silicided to support formation of the drain contact. The top surfaces of the source regions are silicided to support formation of the source contact. A gate lead is epitaxially grown and electrically coupled to the gate regions, with the gate lead silicided to support formation of the gate contact.
摘要:
This invention relates to a GaAs semiconductor device and more particularly to a GaAs static induction transistor integrated circuit which operates at a very high speed. Gallium arsenide has the features that the mobility of electrons is higher than that in silicon and that the band structure has a direct gap. The mobility of electrons in gallium arsenide is several times as high as that in silicon; this is very suitable for the manufacture of a semiconductor device of high-speed operation. Further, since gallium arsenide has the direct gap, the electron-hole recombination rate is high and the minority carrier storage effect is extremely small. By causing the recombination at the direct gap, light emission can be achieved more efficiently. Accordingly, a light receiving and emitting semiconductor device can be obtained through the use of gallium arsenide. As the propagation velocity of light is very fast, signal transfer between semiconductor chips can be achieved at ultra-high speed. By combining this with the high mobility of electrons in gallium arsenide, an ultra-high speed logical operation device can be realized.
摘要:
A static induction transistor logic circuit comprising: an injector transistor having a control electrode held at a reference potential, a first electrode, and a second electrode applied with a potential to thereby cause a current having a value determined by the potential applied to flow through the first electrode; a driver static induction transistor having a gate connected to said first electrode of the injector transistor, a drain, and a source held at said reference potential; and a bypath static induction transistor having a gate, a drain connected to both the gate of the bypath transistor and said gate of said driver transistor, and a source held at said reference potential, said bypath transistor being operative so that when said driver transistor is in its conductive state, the bypath transistor becomes conductive to allow a part of said current supplied from said first electrode to flow through the bypath transistor, with a certain potential developed at the drain of the bypath transistor, said certain potential, when applied at said gate of said driver transistor, allowing said driver transistor to turn to be conductive, and having a value associated with that of said current supplied from said first electrode.
摘要:
An insulated-gate static induction transistor is formed by establishing a potential barrier in a semiconductor region of one conductivity type between the source and the drain regions of the other conductivity type. The height of the potential barrier should be sensitive to the drain voltage as well as to the gate voltage. Therefore, the semiconductor region should have a low impurity concentration and short length. The potential barrier can be established by varying the field effect of the gate voltage in the semiconductor region and/or by the built-in potential between the source region and the semiconductor region.
摘要:
The new kind of field effect transistor having a non-saturating characteristic, i.e. static induction transistor (SIT), proposed by the present inventor is modified to serve as a substitute of any conventional bipolar transistor in a given circuitry. That is, the gate-to-gate distance and the impurity concentration of the channel region of an SIT are so selected that the channel is pinched off by the depletion layer at a predetermined forward gate bias. When the forward gate bias applied is below a certain level, the drain current will increase fundamentally exponentially with an increase of the drain voltage above some threshold voltage, whereas when the gate bias applied is above the certain value, the drain current will increase rapidly with a small increase in the drain voltage.
摘要:
This invention relates to a GaAs semiconductor device and more particularly to a GaAs static induction transistor integrated circuit which operates at a very high speed. Gallium arsenide has the features that the mobility of electrons is higher than that in silicon and that the band structure has a direct gap. The mobility of electrons in gallium arsenide is several times as high as that in silicon; this is very suitable for the manufacture of a semiconductor device of high-speed operation. Further, since gallium arsenide has the direct gap, the electron-hole recombination rate is high and the minority carrier storage effect is extremely small. By causing the recombination at the direct gap, light emission can be achieved more efficiently. Accordingly, a light receiving and emitting semiconductor device can be obtained through the use of gallium arsenide. As the propagation velocity of light is very fast, signal transfer between semiconductor chips can be achieved at ultra-high speed. By combining this with the high mobility of electrons in gallium arsenide, an ultra-high speed logical operation device can be realized.
摘要:
In a static induction transistor, the gate structure is split into two separate gates facing each other to cooperatively define therebetween a channel or channels of this transistor. One of these two separate gates is operative as a driving gate for driving the transistor in response to a driving signal applied thereto, while the other one is operative as a non-driving gate which has no driving signal applied. The non-driving gate may be held at a certain potential or floated. Such split-gate structure provides a higher operating speed of the transistor, and can be effectively applied to semiconductor memory devices.In such a memory device having split-gate structures, a plurality of field effect type semiconductor memory cells are formed perpendicular to a surface of a semiconductor wafer to enhance a high packing density of the memory device. Charge carriers are transported in the semiconductor bulk through channels defined by the split-gate structure, thereby enhancing a high-speed operation of the memory device.
摘要:
An improved transistor comprising an embedded electrode formed in a semiconductor substrate and having a high resistivity semiconductor region intervening between the embedded electrode and the substrate. The dimension and the impurity concentration of the high resistivity region are selected to insure that this latter region is substantially pinched off in the operative state of this transistor by the depletion layer growing from either the embedded electrode or the substrate, the width of said depletion layer varying in good faith without delay with the quick changes in the voltage of the embedded electrode. This provides an effective reduction mainly in the capacitance between the embedded electrode and the substrate, and also in the conductance in high-speed operation, which jointly bring about a high speed operation and a large driving ability. This transistor is extremely useful when adopted in a semiconductor integrated circuit.
摘要:
An integrated semiconductor device comprising: a first and a second static induction transistor each including a drain and a source, each having a first conductivity type, a current channel having the first conductivity type and located between the drain and the source, and a gate having a second conductivity type opposite to the first conductivity type and located adjacent to the current channel; and a third bipolar transistor including a collector and an emitter each having the second conductivity type, and a base having the first conductivity type and located between the collector and the emitter, the collector being connected to the gates of the first and second transistors and also to the drain of the second transistor, the source of the second transistor being connected to the source of the first transistor. The second transistor is operative for suppressing the occurrence of an unrequired excessive minority carrier injection in the first transistor.
摘要:
A static induction transistor is formed on a silicon carbide substrate doped with a first conductivity type. First recessed regions in a top surface of the silicon carbide substrate are filled with epitaxially grown gate regions in situ doped with a second conductivity type. Epitaxially grown channel regions in situ doped with the first conductivity type are positioned between adjacent epitaxial gate regions. Epitaxially grown source regions in situ doped with the first conductivity type are positioned on the epitaxial channel regions. The bottom surface of the silicon carbide substrate includes second recessed regions vertically aligned with the channel regions and silicided to support formation of the drain contact. The top surfaces of the source regions are silicided to support formation of the source contact. A gate lead is epitaxially grown and electrically coupled to the gate regions, with the gate lead silicided to support formation of the gate contact.