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公开(公告)号：US20240324116A1
公开(公告)日：2024-09-26
申请号：US18499899
申请日：2023-11-01
Inventor： Hayato YAMAGUCHI , Masahide TAKAZAWA , Shinra YAMANAKA , Nobuhiro YAMAMOTO , Taichi OKANO
CPC classification number: H05K5/0069 , H05K1/0393 , H05K1/05 , H05K1/116 , H05K3/0094 , H05K2201/10303
Abstract: According to one embodiment, a storage includes a flexible printed circuit board and an electronic component. The flexible printed circuit board includes a first insulating layer, a first conductive layer on a first surface of the first insulating layer, and a second conductive layer on a second surface of the first insulating layer. The second surface is opposite the first surface. The first conductive layer is provided with a land. The second conductive layer covers the land via the first insulating layer in a first direction in which the first surface faces. The electronic component includes a pin joined to the land.
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公开(公告)号：US20240324104A1
公开(公告)日：2024-09-26
申请号：US18736577
申请日：2024-06-07
Applicant: Japan Tobacco Inc.
Inventor： Keiji MARUBASHI , Minoru KITAHARA
IPC: H05K1/11 , A24F40/10 , A24F40/30 , A24F40/42 , A24F40/51 , A24F40/95 , H02M3/00 , H05K1/03 , H05K1/14
CPC classification number: H05K1/115 , A24F40/51 , A24F40/95 , H02M3/003 , H05K1/0393 , H05K1/144 , A24F40/10 , A24F40/30 , A24F40/42 , H05K2201/041 , H05K2201/09518 , H05K2201/09627 , H05K2201/10053
Abstract: A power supply unit of an aerosol generating device, the power supply unit includes: a power supply; a first switch configured to adjust electric power to be supplied from the power supply to an atomizer that atomizes an aerosol source; and a circuit substrate on which the first switch is mounted. The circuit substrate includes: a first layer that is a front layer on which the first switch is mounted, a second layer that is different from the first layer, a first via that penetrates the first layer and is connected to the first switch, a second via that penetrates the first layer or the second layer and is spaced apart from the first via, and a first conductive pattern that is provided on the second layer and connects the first via and the second via.
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公开(公告)号：US12101882B2
公开(公告)日：2024-09-24
申请号：US17428332
申请日：2020-03-04
Applicant: GigaLane Co., Ltd.
Inventor： Sang Pil Kim , Ik Soo Kim , Byung Yeol Kim , Hee Seok Jung
CPC classification number: H05K1/147 , H05K1/028 , H05K1/0393 , H05K1/118
Abstract: A flexible circuit board according to an embodiment includes a first signal line extending on a first plane, a first dielectric extending in an extension direction of the first signal line while being in contact with the first signal line, a second signal line extending on a second plane parallel with the first plane, and a second dielectric extending in an extension direction of the second signal line while being in contact with the second signal line. The first signal line includes a first part overlapped with the second signal line and a second part not overlapped with the second signal line when viewed in a normal direction of the first plane, and the second signal line includes a first part overlapped with the first signal line and a second part not overlapped with the first signal line when viewed in the normal direction.
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公开(公告)号：US12101873B2
公开(公告)日：2024-09-24
申请号：US17660618
申请日：2022-04-25
Applicant: Microsoft Technology Licensing, LLC
Inventor： Jaejin Lee , Edward Charles Leacock , Charbel Khawand
CPC classification number: H05K1/0218 , G06F1/1681 , H05K1/0216 , H05K1/0393 , H05K1/18 , H05K1/189 , H05K2201/05 , H05K2201/08 , H05K2201/083
Abstract: An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signal line.
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公开(公告)号：US12016117B2
公开(公告)日：2024-06-18
申请号：US17464049
申请日：2021-09-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahito Tomoda
CPC classification number: H05K1/0296 , H05K1/0283 , H05K1/032 , H05K1/0393 , H05K1/181 , H05K1/189 , H05K3/284
Abstract: An extensible and contractible mounting board that includes an extensible and contractible substrate; an extensible and contractible wiring line on one main surface of the extensible and contractible substrate; an electronic component electrically connected to the extensible and contractible wiring line; and a resin portion in contact with the extensible and contractible wiring line and overlapping an end portion of a connection region between the extensible and contractible wiring line and the electronic component in a plan view of the extensible and contractible mounting board, the resin portion having a cutout portion that overlaps the extensible and contractible wiring line. A Young's modulus of the resin portion is higher than a Young's modulus of the extensible and contractible substrate.
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公开(公告)号：US20240179835A1
公开(公告)日：2024-05-30
申请号：US18435032
申请日：2024-02-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuyasu HORI
CPC classification number: H05K1/0283 , H05K1/118 , H05K1/144 , H05K1/145 , H05K1/189 , H05K1/0393
Abstract: A stretchable device that includes: a stretchable first substrate having a first main surface and a second main surface facing each other and extending in a first direction; a stretchable first wiring on the first main surface and extending along the first main surface; a second substrate that has a third main surface and a fourth main surface facing each other; and a second wiring on the third main surface and extending along the third main surface. The first substrate includes a connection region overlapping the second substrate and a non-connection region not overlapping the second substrate when viewed from a direction orthogonal to the first main surface, the stretchable first substrate and the second substrate are connected in the connection region, and the stretchable first substrate has a first hole portion in at least one of the first main surface and the second main surface in the non-connection region.
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公开(公告)号：US11985768B2
公开(公告)日：2024-05-14
申请号：US16450459
申请日：2019-06-24
Applicant: PI-CRYSTAL INCORPORATION
Inventor： Junichi Takeya , Seiichiro Yamaguchi , Masataka Itoh
IPC: H05K1/14 , H05K1/02 , H05K1/11 , H05K3/36 , H05K3/40 , H05K3/46 , H01L23/00 , H05K1/03 , H05K3/12
CPC classification number: H05K3/361 , H05K1/115 , H05K1/116 , H05K1/118 , H05K1/144 , H05K3/363 , H05K3/403 , H05K3/4038 , H05K3/4623 , H05K3/4635 , H05K3/4691 , H01L24/81 , H01L24/91 , H05K1/028 , H05K1/0393 , H05K3/1275 , H05K2201/041 , H05K2201/058 , H05K2201/09181 , H05K2201/09845 , H05K2201/10121 , H05K2201/10151 , Y10T29/49124 , Y10T29/49126
Abstract: Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.
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8.发明公开
公开(公告)号：US20240148329A1
公开(公告)日：2024-05-09
申请号：US18507676
申请日：2023-11-13
Applicant: The Trustees of Columbia University in The City of New York , Massachusetts Institute of Technology
Inventor： Kenneth L. SHEPARD , John William STANTON , Giovanni Talei FRANZESI , Ed BOYDEN
CPC classification number: A61B5/686 , A61B5/0031 , A61B5/076 , H05K1/0393
Abstract: An exemplary vascular neural interface device/configuration and method can be provided for at least one of stimulating or recording the nervous system. For example, a package can be provided which can be inserted within a blood vessel. The package can include at least one transducer, at least one electrode, and at least one integrated circuit. The at least one transducer can receive or transmit a wireless signal which is used to provide energy or communicate with the at least one integrated circuit to at least one of record or stimulate the nervous system using recording electronics or stimulating electronics.
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公开(公告)号：US20240138061A1
公开(公告)日：2024-04-25
申请号：US18489422
申请日：2023-10-18
Applicant: Saudi Arabian Oil Company , University of Massachusetts
Inventor： Sahil P. Wankhede , Xian Du , Ali Al Shehri , Keith William Brashler , Mohammad Al-Ba’adani , Doru Catalin Turcan
CPC classification number: H05K1/0393 , H05K3/125 , H05K2203/013 , H05K2203/097 , H05K2203/1305
Abstract: A method of forming a flexible electronic component includes treating a flexible fluoroelastomer substrate to increase the surface energy of the substrate to a specified surface energy. After the treatment, a layer of conductive material is printed with an inkjet printer onto the substrate. After the printing, an encapsulant layer comprising a fluoroelastomer is applied onto the substrate.
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公开(公告)号：US20240098893A1
公开(公告)日：2024-03-21
申请号：US17963188
申请日：2022-10-10
Applicant: National Taipei University of Technology
Inventor： Syang-Peng Rwei , Yuan-Fu Cheng , Lih Jen Kau
CPC classification number: H05K1/0393 , H05K1/028 , H05K1/038 , H05K1/05
Abstract: An embedded smart module including a twistable substrate, an electrode layer, a circuit layer, an insulating layer, an electronic component and a sensing component is provided. The electrode layer is disposed on the twistable substrate. The circuit layer is disposed in the electrode layer and exposed at the surface of the electrode layer. The insulating layer is disposed between the electrode layer and the circuit layer. The electronic component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer. The sensing component is disposed on the electrode layer and the circuit layer and electrically connected with the electrode layer and the circuit layer.
