公开(公告)号：US20170280578A1

公开(公告)日：2017-09-28

申请号：US15447930

申请日：2017-03-02

申请人： FUJITSU LIMITED

发明人： Ronny Hesse

IPC分类号： H05K7/14 ,  H05K5/02 ,  H01R12/72 ,  H05K5/00 ,  H01R12/70

CPC分类号： H05K7/1461 ,  G06F1/185 ,  H01R12/7005 ,  H01R12/721 ,  H05K5/0069 ,  H05K5/0269

摘要： The invention relates to a holding component with a riser card for receiving an expansion component for a computer system. The riser card comprises a first mating plug connector on a first side of a bottom plate of the holding component. Further, the riser card comprises a first plug connector on a second side of the bottom plate opposite the first side. The holding component is adapted to receive the expansion component by establishing a plug connection of a second plug connector of the expansion component and the first mating plug connector on the holding component, wherein the holding component comprises a slot bracket, which is adapted to receive a slot angle of the expansion component.Furthermore, the invention relates to a support component for receiving at least one holding component and to an assembly comprising a chassis of a server module and of a holding component as well as of a support component.

公开(公告)号：US20170179642A1

公开(公告)日：2017-06-22

申请号：US15222859

申请日：2016-07-28

申请人： Innodisk Corporation

发明人： Chen-Huan LIN ,  Hsiao-Yu WANG

IPC分类号： H01R13/627 ,  H01R13/633 ,  H01R12/73 ,  H01R13/631 ,  H01R27/00

CPC分类号： H01R13/631 ,  G06F1/18 ,  G06F13/42 ,  H01R12/7017 ,  H01R12/73 ,  H01R13/627 ,  H01R13/633 ,  H01R27/00 ,  H05K5/0269 ,  H05K5/0286

摘要： The invention provides a M.2 interface memory device and a M.2 interface connection seat insertedly provided thereof. The M.2 interface memory device comprises a M.2 interface card and a housing provided with at least one guide groove. The M.2 interface connection seat is disposed on a circuit board, and comprises two arms and a base comprising a M.2 interface slot. At least one arm is provided with a guide rail. An opening direction of the M.2 interface slot is horizontal to a surface of the circuit board. When the M.2 interface card is inserted into the M.2 interface slot in a horizontal direction, the M.2 interface memory device will be fixed within the M.2 interface connection seat by embedding between the guide groove and the guide rail. Thus, M.2 interface memory devices of a variety of specification lengths are able to be inserted into the M.2 interface connection seat.

公开(公告)号：US09626534B2

公开(公告)日：2017-04-18

申请号：US14574856

申请日：2014-12-18

申请人： Samsung Electronics Co., Ltd.

发明人： Piljun Kim

IPC分类号： G06K7/00 ,  H01R12/57 ,  H05K5/02 ,  H01R13/24 ,  H01R12/71 ,  H05K7/14 ,  H01R4/48

CPC分类号： G06K7/0021 ,  H01R4/4809 ,  H01R12/57 ,  H01R12/716 ,  H01R13/24 ,  H05K5/0269 ,  H05K5/0291 ,  H05K7/1418

摘要： An electronic device and a Subscriber Identity Module Card (SIM card) connector mounted in the same are disclosed. The SIM card connector includes a lower surface support having an open area adapted to receive a SIM card and a contact area adapted to be electrically coupled to the SIM card, an elastic support disposed near at least one side surface of the open area, the elastic support having a predetermined width and an elasticity expressed towards an upper surface support of the SIM card connector and having a shape surrounding the contact area, a side surface support having a predetermined height disposed circumferentially at distal edges of the lower surface support except for the open area, and the upper surface support coupled to the side surface support and having a top surface formed parallel to the lower surface support adapted to partially enclose an upper portion of the SIM card.

公开(公告)号：US20120155007A1

公开(公告)日：2012-06-21

申请号：US13037407

申请日：2011-03-01

申请人： GUANG-YI ZHANG ,  ZHE ZHANG

发明人： GUANG-YI ZHANG ,  ZHE ZHANG

IPC分类号： H05K7/00

CPC分类号： H05K5/0269

摘要： An electronic device includes a motherboard, a riser card, and a securing structure. The riser card connects to the motherboard, and includes a first surface with a second socket thereon for connecting with an expansion card. The securing structure is for securing the expansion card, and includes a first fixing plate, a second fixing plate, and a fixing member for fixing the expansion card. The first fixing plate is arranged on the first surface of the riser card, and includes a number of first latching portions corresponding to the second socket, the first latching portions are arranged on a line parallel to the second socket. The second fixing plate faces the first surface of the riser card, and includes a second latching portion corresponding to each first latching portion. The fixing member includes a first and second end portion latchable with each first and second latching portion respectively.

摘要翻译： 电子设备包括主板，转接卡和固定结构。 转接卡连接到母板，并且包括第一表面，其上具有用于与扩展卡连接的第二插座。 固定结构用于固定扩展卡，并且包括第一固定板，第二固定板和用于固定扩展卡的固定构件。 第一固定板布置在转接卡的第一表面上，并且包括与第二插座相对应的多个第一闩锁部分，第一闩锁部分布置在与第二插座平行的线上。 第二固定板面向转接卡的第一表面，并且包括对应于每个第一闩锁部分的第二闩锁部分。 固定构件包括分别与每个第一和第二闩锁部分可闩锁的第一和第二端部。

公开(公告)号：US20110051391A1

公开(公告)日：2011-03-03

申请号：US12781943

申请日：2010-05-18

申请人： XIAO-LIANG WEI ,  WEI-HUI FAN

发明人： XIAO-LIANG WEI ,  WEI-HUI FAN

IPC分类号： H05K9/00

CPC分类号： H05K5/0269 ,  A45C2011/188

摘要： A chip card holder for holding a chip card is disclosed including a base member, a mounting frame and a holding member. The mounting frame is made of metal materials and secured to the base member. The holding member is used to hold the chip card and is slidably mounted within the mounting frame. When the holding member is completely received in the mounting frame, the mounting frame and the base member cooperatively enclose and preventing the chip card from electromagnetic interference.

摘要翻译： 公开了一种用于保持芯片卡的芯片卡保持器，其包括基座构件，安装框架和保持构件。 安装框架由金属材料制成并固定在基座上。 保持构件用于保持芯片卡并且可滑动地安装在安装框架内。 当保持构件完全容纳在安装框架中时，安装框架和基座构件协同地包围并防止芯片卡受到电磁干扰。

公开(公告)号：US07885078B2

公开(公告)日：2011-02-08

申请号：US11796580

申请日：2007-04-27

申请人： Hao Gu ,  Qi-Sheng Zheng ,  Zhi-Quan Mou ,  Xiao-Hai Zhou

发明人： Hao Gu ,  Qi-Sheng Zheng ,  Zhi-Quan Mou ,  Xiao-Hai Zhou

IPC分类号： H05K1/14

CPC分类号： H05K5/0269 ,  H01R12/722

摘要： An electrical card (100) includes an insulative frame (1) having a pair of detachable side bars (112) spaced from each other and a transverse bar (116) assembled onto the side bars to interconnect the side bars; a detachable upper cover (12) attached to a rear end of the frame; an upper shell (2) and a lower shell (3) mounted to an upper side and a lower side of the side bars respectively; a detachable lower cover (4) attached to the lower shell and disposed beneath the upper cover; a circuit board (5) supported by the frame and located between the frame and the upper shell; and an electrical connector (6) attached to a front end of the frame and electrically connected to the circuit board.

摘要翻译： 电卡（100）包括具有彼此间隔开的一对可拆卸侧杆（112）的绝缘框架（1）和组装在所述侧杆上以互连所述侧杆的横杆（116） 附接到所述框架的后端的可拆卸的上盖（12） 分别安装在侧杆的上侧和下侧的上壳体（2）和下壳体（3）; 安装在下壳体上并设置在上盖下方的可拆卸下盖（4）; 由框架支撑并位于框架和上壳体之间的电路板（5）; 和连接到框架的前端并电连接到电路板的电连接器（6）。

公开(公告)号：US20100265675A1

公开(公告)日：2010-10-21

申请号：US12616971

申请日：2009-11-12

申请人： Syuzo Aoki ,  Meisou Chin

发明人： Syuzo Aoki ,  Meisou Chin

IPC分类号： H05K5/00

CPC分类号： H05K5/0269

摘要： A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion. The upper case portion is externally fitted to the lower case portion, and the engaging projections are engaged with the engaging holes, whereby the lower case portion and the upper case portion are fixed to each other.

摘要翻译： 一种容纳电子电路板的外壳，包括：内壳体，用于安装用于安装电子部件的电路板; 以及外壳部分，其外部安装到下壳体部分以形成盒状构件。 下壳体部分和上壳体部分中的每一个包括平面部分和从平面部分的周缘竖立的侧壁部分。 平面部分和侧壁部分通过使用由金属材料制成的板状构件形成。 向外突出的接合突起设置在下壳体部分的侧壁部分上。 穿过上壳体部分的侧壁部分的接合孔设置在与下壳体部分的接合突起相对应的位置的侧壁部分中。 上壳体部分外部装配到下壳体部分，并且接合突起与接合孔接合，由此下壳体部分和上壳体部分彼此固定。

公开(公告)号：US20100220453A1

公开(公告)日：2010-09-02

申请号：US12713073

申请日：2010-02-25

申请人： Michael Chy Chao

发明人： Michael Chy Chao

IPC分类号： H05K5/00 ,  B23P11/00

CPC分类号： H05K5/0269 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49826

摘要： An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.

摘要翻译： 提供一种电子外壳，其包括可与第二盖组件组合的第一盖组件，以便在其间容纳或封闭印刷电路板。 每个盖组件包括盖和框架，所述盖可通过在其周围弯曲盖的部分而附接到框架。 盖优选为冲压金属，并且框架优选为注射成型塑料。 每个盖可以包括凹部，使得当盖围绕框架弯曲时，盖在凹部处弯曲并且在多个配合表面上紧密地接合框架。 盖组件可以焊接在一起，例如通过超声波焊接，以形成完整的包装或壳体，并且可以包括间隔间隔的剪切焊接特征，以改善它们之间的粘合强度。 还提供了制造和/或组装电子外壳和盖组件的方法。

公开(公告)号：US07726842B2

公开(公告)日：2010-06-01

申请号：US11905802

申请日：2007-10-04

申请人： Yu-Lin Hsieh

发明人： Yu-Lin Hsieh

IPC分类号： F21V33/00 ,  H05K5/00

CPC分类号： H05K1/182 ,  H05K5/0269 ,  H05K2201/10106 ,  Y10T29/4913

摘要： The present invention discloses a structure of a single-sided PCB within an ExpressCard with SMD LEDs arrangement formed thereon. The SMD LEDs are act as status indicators for the electronic devices with small, thin and compact size. The structure is expected to form SMD LED illuminating light to the top surface of the PCB with SMD LEDs connecting to the bonding pads on the bottom surface of the PCB. The method comprises forming through-holes on the PCB, placing SMD LEDs over the through-holes with their illuminating heads facing toward the top surface of the PCB, soldering the SMD LEDs with the bonding pads on the bottom surface of the PCB.

摘要翻译： 本发明公开了在其中形成有SMD LED布置的ExpressCard中的单面PCB的结构。 SMD LED用作小型，薄型和紧凑尺寸的电子设备的状态指示器。 该结构预计将形成SMD LED照明光到PCB的顶表面，SMD LED连接到PCB底部的接合焊盘。 该方法包括在PCB上形成通孔，将SMD LED放置在通孔上方，其照明头面向PCB的顶面，用PCB的底面上的焊盘焊接SMD LED。

公开(公告)号：US07576990B2

公开(公告)日：2009-08-18

申请号：US11683292

申请日：2007-03-07

申请人： Jim Chin-Nan Ni ,  Charles C. Lee ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Jim Chin-Nan Ni ,  Charles C. Lee ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K1/14

CPC分类号： H05K5/0269 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G07C9/00087 ,  H05K5/026

摘要： A case-grounded flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips and a controller chip. The PCBA is encased inside an upper case and a lower case, with a Serial AT-Attachment (SATA) connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Dual-axis case-grounding pins draw any electro-static-discharges (ESD) current off the upper case along a primary axis and onto a PCBA ground through a secondary axis washer that is screwed into the PCBA. The primary axis body of the dual-axis case-grounding pins fits around a PCBA notch while the secondary axis passes through a metalized alignment hole for grounding. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the dual-axis case-grounding pins.

摘要翻译： 外壳接地闪存驱动器具有带闪存芯片的印刷电路板组件（PCBA）和控制器芯片。 PCBA被封装在上壳体和下壳体内，并具有穿过并在壳体之间打开的串行AT附件（SATA）连接器。 这些情况可以通过卡扣，超声波压力机，螺纹紧固件或热粘合粘合剂方法与PCBA组装。 双轴外壳接地引脚通过螺纹连接到PCBA中的次轴垫圈将初始轴上的任何静电放电（ESD）电流从主轴上吸入PCBA接地。 双轴壳体 - 接地销的主轴体装配在PCBA槽口周围，而副轴线穿过金属化的对准孔进行接地。 当SATA连接器插入主机时，主机接地将吸收由双轴外壳接地引脚收集的ESD电流。