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    Cooling System for Rackmounted Electronic Equipment Having Independent Evaporator and Condenser Airflows
    1.
    发明申请
    Cooling System for Rackmounted Electronic Equipment Having Independent Evaporator and Condenser Airflows 审中-公开

    公开(公告)号：US20190254198A1

    公开(公告)日：2019-08-15

    申请号：US16394729

    申请日：2019-04-25

    申请人： DENSO AIRCOOL CORPORATION

    发明人： James MAGALLANES ,  Yukio OZAWA

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20754 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20818

    摘要： A closed loop cooling system for electronic equipment. The system includes a cabinet having a top panel, walls, and a door defining an enclosure. A rack is within the enclosure, and the electronic equipment is mounted thereto. An evaporator is within the enclosure below the electronic equipment. Recirculated cabinet airflow warmed by the electronic equipment is directed to the evaporator, cooled by the evaporator, and directed back to the electronic equipment to cool the electronic equipment. A condenser is in fluid communication with the evaporator to circulate coolant therebetween. Ambient airflow from outside the cabinet flows across the condenser to cool coolant flowing therethrough. The recirculated cabinet airflow is maintained independent of the ambient airflow, thereby preventing introduction of added heat or contaminates into the recirculated cabinet airflow, and not affecting air pressure of the ambient airflow.

    MODULE FOR COOLING A HEAT GENERATING COMPONENT
    2.
    发明申请
    MODULE FOR COOLING A HEAT GENERATING COMPONENT 审中-公开

    公开(公告)号：US20180295745A1

    公开(公告)日：2018-10-11

    申请号：US15557838

    申请日：2016-03-16

    申请人： NERDALIZE B.V.

    发明人： Mathijs DE MEIJER ,  Remy VAN ROOIJEN ,  Marinus SCHOUTE ,  Thomas DE JONG ,  Boaz Samuel LEUPE ,  Florian Jacob SCHNEIDER

    IPC分类号： H05K7/20 ,  G06F1/20

    CPC分类号： H05K7/20336 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20818 ,  H05K7/20936

    摘要： The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber. The displaceable wall is at least partly in contact with the heat-transfer fluid in liquid phase.

    Cooling system, cooled computer system and computer facility
    5.
    发明授权
    Cooling system, cooled computer system and computer facility 有权

    公开(公告)号：US10015911B2

    公开(公告)日：2018-07-03

    申请号：US14291842

    申请日：2014-05-30

    申请人： Bull SAS

    发明人： Georges Lecourtier

    IPC分类号： H05K7/20 ,  F28D15/02

    CPC分类号： H05K7/20781 ,  F28D15/02 ,  H05K7/20736 ,  H05K7/20772 ,  H05K7/2079 ,  H05K7/20818 ,  H05K7/20836

    摘要： A cooling system for the electronic components of a computer rack, including a primary circuit of primary liquid; a primary exchanger intended to transfer heat from first electronic components to the primary liquid; a secondary circuit of refrigerant fluid; a primary-secondary exchanger; a tertiary circuit of tertiary liquid; a secondary-tertiary exchanger; and a tertiary-thermal source exchanger. The cooling system also includes a tertiary-secondary exchanger; and an air-tertiary exchanger intended to transfer, to the tertiary liquid, heat from the air of the computer rack heated by second electronic components, the air-tertiary exchanger being arranged, in the tertiary circuit, downstream of the tertiary-secondary exchanger and upstream of the secondary-tertiary exchanger.

    Stand alone immersion tank data center with contained cooling
    6.
    发明授权
    Stand alone immersion tank data center with contained cooling 有权

    公开(公告)号：US09921622B2

    公开(公告)日：2018-03-20

    申请号：US13757727

    申请日：2013-02-01

    申请人： Dell Products L.P.

    发明人： Austin Michael Shelnutt ,  James D. Curlee ,  Jimmy Pike

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/206 ,  H05K7/203 ,  H05K7/20809 ,  H05K7/20818 ,  H05K7/20827

    摘要： A stand-alone immersion tank datacenter (SITDC) includes: a multi-phase heat transfer immersion cooling tank having external walls surrounding a tank volume within which a dielectric liquid is maintained and heated to a boiling point temperature; a plurality of servers having one or more processing and memory components submerged within the dielectric liquid for cooling of the one or more components via heat dissipation from the one or more components into the dielectric liquid when the one or more components are connected to an electric power supply; and a condenser located vertically above the plurality of servers and in a direct path of rising dielectric vapor created when the dielectric liquid absorbs sufficient heat from the one or more components to reach a boiling point temperature of the liquid. The condenser can be a passive heat exchanger, created by providing a heat conductive material as a top lid of the tank.

    Fuel vaporization using data center waste heat
    10.
    发明授权
    Fuel vaporization using data center waste heat 有权
    燃料蒸发利用数据中心废热

    公开(公告)号：US09546576B2

    公开(公告)日：2017-01-17

    申请号：US14829869

    申请日：2015-08-19

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F01K25/08 ,  H02P9/04

    CPC分类号： F01K25/08 ,  F01K5/00 ,  F25B15/00 ,  F25B19/00 ,  F25B27/02 ,  F25B49/00 ,  H02P9/04 ,  H05K7/20709 ,  H05K7/20818 ,  H05K7/20836

    摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

    摘要翻译： 通过使用数据中心废热汽化燃料，为数据中心冷却提供了系统和方法。 该系统包括例如发电组件，液体燃料储存器和传热系统。 发电组件从燃料蒸汽发电，供给数据中心。 液体燃料储存器连接以供应燃料蒸汽，并且传热系统与数据中心和液体燃料储存器相关联。 在操作模式中，传热系统将数据中心废热转移到液体燃料储存器，以便于液化燃料的蒸发，以产生供给发电组件的燃料蒸气。 该系统可以以液体燃料储存和传热系统为主要燃料蒸气源或备用燃料蒸气源来实施。