摘要:
A method of polishing ferroelectric materials and specifically perovskite materials and still more specifically barium strontium titanate (1) wherein the surface (5) to be polished is initially partially smoothened or planarized by mechanical abrading with final smoothening or planarization provided by a chemical polishing with a polishing wheel using an acidic solution containing essentially the acid, hydrogen peroxide and water. Preferred acids are perchloric acid, acetic acid, nitric acid and combinations thereof.
摘要:
A superconducting device includes first and second oxide superconducting regions of a relatively thick thickness, formed directly on a principal surface of a substrate to be separate from each other, and a third oxide superconducting region of an extremely thin thickness which is formed directly on the principal surface of the substrate so as to bridge the first and second oxide superconducting regions. A barrier layer and a diffusion source layer are formed on the third oxide superconducting region, and an isolation region is formed to cover an upper portion or both side surfaces of the diffusion source layer. The first, second and third oxide superconducting regions and the isolation region are formed of the same oxide superconductor material, and the isolation region is diffused with a material of the diffusion source layer, so that the isolation region does not show superconductivity. Therefore, a superconducting current can flow between the first and second oxide superconducting regions through only the third oxide superconducting region. For formation of the superconducting device, a first oxide superconductor thin film having a very thin thickness is formed on the principal surface of the substrate, and a barrier layer and a diffusion source layer are formed on a portion of the first oxide superconductor thin film. A second oxide superconductor thin film is grown on an exposed surface of the first oxide superconductor thin film until the two layers are embedded in the second oxide superconductor thin film, so that a material of the diffusion source layer is diffused into the second oxide superconductor thin film on an upper portion or both side surfaces of the diffusion source layer.
摘要:
A novel method for fabricating nanometer geometry electronic devices is described. Such Josephson junctions can be accurately and reproducibly manufactured employing photolithographic and direct write electron beam lithography techniques in combination with aqueous etchants. In particular, a method is described for manufacturing planar Josephson junctions from high temperature superconducting material.
摘要:
A process for etching with a scanning tunneling microscope on both a single crystal and a thin film of high temperature superconductor is disclosed.
摘要:
A superconducting electronic circuit device, useful when impedance matching is desired, especially suited to microwave frequencies, consisting of a thin dielectric layer with superconducting layers on both sides. A superconductor such as Yttrium Barium Copper Oxide (YBCO) is formed on a first substrate such as lanthanum aluminate. A protective layer like gold is deposited on the YBCO and a second carrier substrate is bonded to the protected YBCO. The first substrate is then thinned into a thin dielectric film and a second layer of superconductor is epitaxially grown thereon to create the desired circuits.
摘要:
A method is disclosed for fabricating grain boundary junction devices, which comprises preparing a crystalline substrate containing at least one grain boundary therein, epitaxially depositing a high Tc superconducting layer on the substrate, patterning the superconducting layer to leave at least two superconducting regions on either side of the grain boundary and making electrical contacts to the superconducting regions so that bias currents can be produced across the grain boundary.
摘要:
A superconducting Josephson junction is created in high T.sub.c superconducting film, with a bridge connecting two superconducting banks, by subjecting the bridge to a tunneling electron current from a sharp electrode close to the bridge. The tunneling current alters the structure over atomic dimensions to create a weak link of length comparable to high T.sub.c coherence lengths so as to permit phase coherent Cooper pair current flow across the weak link.
摘要:
A method of forming a patterned in-situ photoconductive film on a substrate including providing a patterned photoresist layer on upper and lower metallic layers formed on a substrate. The patterned photoresist layer is used to form an opening in the upper layer. The pattern in the upper layer thereby has an opening having a geometry substantially similar to a desired pattern of photoconductive material to be formed on the substrate. A portion of the lower layer is removed to form cantilevered regions of the upper layer adjacent to the opening. Superconductive material is then deposited on the substrate by directing the material through the opening at an angle generally perpendicular to the substrate. The superconductive film on the substrate within the lower layer is coated with a polymer. The upper and lower layers and all superconductive material on those layers are removed to leave the polymer-encapsulated superconductive material on the substrate. The polymer is removed by plasma etching that does not adversely affect the superconductive material. Thus, the superconductive material on the substrate is subjected only to post-deposition process steps of depositing the polymer and removing the polymer.
摘要:
A superconducting ceramic film is deposited on a substrate sputtering. In virtue of the low thermal conductivity of ceramic, a laser beam is radiated to the ceramic film in order to remove the irradiated portion by sublimation and produce a pattern on the ceramic film.
摘要:
A method of making a laminated superconductor wire includes providing an assembly, where the assembly includes a substrate; a superconductor layer overlaying a surface of the substrate, the superconductor layer having a defined pattern; and a cap layer; and slitting the assembly in accordance with the defined pattern of the superconductor layer to form a sealed wire. Slitting the assembly in accordance with the defined pattern may form multiple sealed wires, and the substrate may be substantially wider than the sealed wires.