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公开(公告)号：US09922862B2
公开(公告)日：2018-03-20
申请号：US15108027
申请日：2014-01-28
Applicant: EV GROUP E. THALLNER GMBH
Inventor： Andreas Fehkuhrer
IPC: H01L21/687 , B32B43/00 , H01L21/67
CPC classification number: H01L21/68728 , H01L21/67092 , H01L2221/68386 , Y10S156/93 , Y10S156/941 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1978
Abstract: A device for detaching a first substrate from a second substrate in a detaching direction (L) with: at least two elements guided crosswise to the detaching direction (L) and in a radial direction (R) to the first substrate for clamping the first substrate crosswise to the detaching direction (L), a substrate holding device for holding the second substrate, and detaching means for detaching the first substrate from the second substrate by moving the first substrate, attached by the clamping elements, in the detaching direction (L) and/or by moving the substrate holding device opposite to the detaching direction (L). In addition, this invention relates to a corresponding method.
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公开(公告)号：US20170210115A1
公开(公告)日：2017-07-27
申请号：US15413696
申请日：2017-01-24
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Masakatsu OHNO , Koichi TAKESHIMA
IPC: B32B43/00 , H01L27/12 , H01L51/00 , H01L21/683
CPC classification number: B32B43/006 , B32B37/02 , B32B37/025 , B32B37/1284 , B32B37/18 , B32B38/10 , B32B2310/0843 , H01L21/6835 , H01L27/1266 , H01L27/3244 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2227/326 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1967
Abstract: A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.
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公开(公告)号：US09682544B2
公开(公告)日：2017-06-20
申请号：US15147020
申请日：2016-05-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Kayo Kumakura , Tomoya Aoyama , Akihiro Chida , Kohei Yokoyama , Masakatsu Ohno , Satoru Idojiri , Hisao Ikeda , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi , Yasuhiro Jinbo
IPC: B32B38/10 , B32B43/00 , G02B6/00 , H01L21/67 , B26D1/04 , H01L51/56 , B26D1/00 , H01L27/12 , H01L27/32
CPC classification number: B32B43/006 , B26D1/04 , B26D2001/006 , B32B38/10 , B32B2457/00 , G02B6/00 , H01L21/67092 , H01L27/1248 , H01L27/3258 , H01L27/3262 , H01L51/56 , H01L2221/68327 , H01L2227/323 , H01L2251/5338 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1933 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
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4.发明申请
公开(公告)号：US20170133259A1
公开(公告)日：2017-05-11
申请号：US15319259
申请日：2015-05-13
Applicant: Manufacturing Integration Technology Ltd
Inventor： Kim Mone KWONG , Kok Yeow LIM , Zhiqiang MAO
IPC: H01L21/683
CPC classification number: H01L21/6836 , H01L21/67132 , H01L21/6838 , H01L2221/68322 , H01L2221/68327 , H01L2221/68336 , H01L2221/68354 , H01L2221/68386 , Y10S156/932 , Y10S156/943 , Y10T156/1132 , Y10T156/1179 , Y10T156/1944 , Y10T156/1983
Abstract: A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip.
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公开(公告)号：US20170120570A1
公开(公告)日：2017-05-04
申请号：US15037112
申请日：2015-11-03
Inventor： Nan MA , Hongqian CAI , Jianjun PANG
CPC classification number: B32B43/006 , B32B38/10 , B32B2457/20 , Y10T156/1132 , Y10T156/1174 , Y10T156/1944 , Y10T156/195 , Y10T156/1978
Abstract: The present disclosure discloses a film stripping device including: a fixing mechanism for fixing a substrate on which a film to be stripped is disposed; and a stripping mechanism comprising a striping member for stripping at least a part of an edge of the film and a gripping member for gripping the stripped part of the film and movable in a direction towards the film to be stripped relative to the fixing mechanism. Correspondingly, a film stripping method using the film stripping device is also disclosed. The present disclosure increases the efficiency of film stripping and reduces an amount of used adhesive tapes.
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公开(公告)号：US20170113448A1
公开(公告)日：2017-04-27
申请号：US15285655
申请日：2016-10-05
Inventor： Chunyu YANG , Man YUAN , Ji ZHANG , Wei ZHANG , Yongzhi YIN , Yanhong LIU
IPC: B32B43/00
CPC classification number: B32B43/006 , B32B38/10 , B32B38/1833 , B32B38/1858 , B32B2457/20 , Y10T156/1132 , Y10T156/1158 , Y10T156/1911 , Y10T156/1944
Abstract: A separation device for a backlight source is provided. The separation device includes a machine table, at least one separation platform, where each separation platform is located above the machine table and secured at a fixed position relative to the machine table and is configured to support a display module and secure a backlight source of the display module thereon; a plurality of guide columns arranged perpendicular to the machine table, at least one adsorption mechanism arranged in a one-to-one correspondence with the at least one separation platform, where each adsorption mechanism is arranged at a side of the corresponding separation platform away from the machine table and configured to adsorb a display screen of the display module on the corresponding separation platform, and a driving unit configured to drive each adsorption mechanism to move in the lengthwise direction of the plurality of guide columns.
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公开(公告)号：US09553009B2
公开(公告)日：2017-01-24
申请号：US14522937
申请日：2014-10-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae In Sim , Gyeong Seon Park , Kyung Ja Lim , Seung Woo Choi , O Hak Kwon
IPC: B32B38/10 , H01L21/683 , B32B43/00 , H01L21/67 , H01L21/687
CPC classification number: H01L21/6838 , B32B43/006 , H01L21/67092 , H01L21/68735 , H01L2221/68381 , H01L2221/68386 , Y10T156/1132 , Y10T156/1153 , Y10T156/1168 , Y10T156/1911 , Y10T156/1944 , Y10T156/1978
Abstract: There is provided a substrate separation device and method for separating a growth substrate from a laminate structure which includes a support substrate, a semiconductor layer, and the growth substrate. The device includes: a first base which is configured to hold the laminate structure thereon, and includes a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure and a heating unit configured to heat the laminate structure; and a second base including a second holding unit disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure.
Abstract translation: 提供了一种用于从包括支撑衬底，半导体层和生长衬底的层压结构分离生长衬底的衬底分离装置和方法。 该装置包括：第一基座，其构造成在其上保持层压结构，并且包括第一保持单元，其构造成保持限定层压结构的底表面的支撑基板;以及加热单元，其构造成加热层叠结构; 以及第二基座，其包括设置在所述第一保持单元上方的第二保持单元，并且构造成保持限定所述层叠结构的上表面的所述生长基板。
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公开(公告)号：US20160195968A1
公开(公告)日：2016-07-07
申请号：US14797494
申请日：2015-07-13
Inventor： Yifei ZHAN
IPC: G06F3/041
CPC classification number: B26D1/547 , B26D7/018 , B26F3/12 , B32B38/10 , B32B43/006 , Y10T156/1132 , Y10T156/1153 , Y10T156/1184 , Y10T156/1911 , Y10T156/1944 , Y10T156/1967
Abstract: The present disclosure provides a method and a system for separating a touch panel from a display module of a touch display device. The system includes a carrying unit configured to secure a to-be-processed touch display device, and a disassembling unit configured to soften an adhesive between the touch panel and the display module so as to separate the touch panel from the display module, thereby to disassemble the touch display device secured on the carrying unit.
Abstract translation: 本公开提供了一种用于将触摸面板与触摸显示装置的显示模块分离的方法和系统。 该系统包括被配置为固定待处理的触摸显示装置的承载单元和被配置为软化触摸面板和显示模块之间的粘合剂以便将触摸面板与显示模块分离的拆卸单元，从而 拆卸固定在承载单元上的触摸显示装置。
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公开(公告)号：US20160176181A1
公开(公告)日：2016-06-23
申请号：US14731537
申请日：2015-06-05
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Tae-Hwan KIM , Man-Hong NA , Jong-Hwan LEE
CPC classification number: B32B43/006 , B32B38/10 , B32B2457/202 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1944 , Y10T156/1967 , Y10T156/1978 , Y10T156/1989
Abstract: A method of detaching a sub-substrate from a substrate includes providing a first sub-substrate attached to a first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction, inserting a separating member between the first sub-substrate and the first substrate to partially detach therebetween, attaching a plurality of pads arranged in a matrix pattern to the first sub-substrate, lifting first pads among the plurality of pads arranged in a third direction crossing the first and second directions, lifting second pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction, and lifting third pads arranged in the second direction.
Abstract translation: 从基板分离子基板的方法包括提供附接到具有矩形形状的第一基板的第一子基板，其中第一和第二边沿第一方向延伸，第三和第四侧沿与第一方向交叉的第二方向延伸 在所述第一子基板和所述第一基板之间插入分离构件以在其间部分地分离，将以矩阵图案排列的多个焊盘附接到所述第一子基板，提升布置在第三子基板中的所述多个焊盘中的第一焊盘 横向第一和第二方向的方向，提升第二焊盘，至少两个第二焊盘沿第二方向布置，并且至少两个第二焊盘沿第三方向布置，并且提升沿第二方向布置的第三焊盘 。
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10.发明申请LAMINATED SUBSTRATE SEPARATING DEVICE AND METHOD FOR SEPARATING LAMINATED SUBSTRATE 有权层压基板分离装置及分层层压基板的方法
公开(公告)号：US20160159069A1
公开(公告)日：2016-06-09
申请号：US14830745
申请日：2015-08-20
Applicant: Industrial Technology Research Institute
Inventor： Guo-Shing Huang , Chia-Sheng Huang , Hsin-Yun Hsu
CPC classification number: B32B43/006 , B32B37/0053 , B32B38/1858 , B32B2457/00 , B65H2301/51122 , Y10T156/1132 , Y10T156/1174 , Y10T156/1944 , Y10T156/195 , Y10T156/1967 , Y10T156/1978
Abstract: A laminated substrate separating device used for separating a first substrate from a second substrate of a laminated substrate is provided. The first and the second substrates are misaligned at an edge of the laminated substrate. The laminated substrate separating device includes a base where the laminated substrate is disposed thereon, and a separating tool movably disposed on the base along an axis. The separating tool presses a portion of the first substrate being exposed out of the second substrate at a misaligned edge such that a gap is formed between the first and the second substrates. The separating tool inserts into the gap at the misaligned edge to press the first substrate, such that the second substrate is separated from the first substrate. A method for separating laminated substrate is also provided.
Abstract translation: 提供了一种用于从层压基板的第二基板分离第一基板的层叠基板分离装置。 第一和第二基板在层叠基板的边缘处不对准。 层压基板分离装置包括其上设置有层压基板的基座和沿轴线可移动地设置在基座上的分离工具。 分离工具将第一衬底的一部分以不对齐的边缘压在第二衬底外露出，使得在第一和第二衬底之间形成间隙。 分离工具以不对准的边缘插入到间隙中以按压第一基板，使得第二基板与第一基板分离。 还提供了分离层叠基板的方法。
