公开(公告)号：US09793826B2

公开(公告)日：2017-10-17

申请号：US15003958

申请日：2016-01-22

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Shigeaki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H05K3/30 ,  H02M7/537 ,  H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L25/07 ,  H01L21/48 ,  H01L23/29 ,  H01L25/18 ,  H01L25/00 ,  H05K1/02 ,  H05K1/18 ,  H01L23/00

CPC分类号： H02M7/537 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20753 ,  H05K1/0203 ,  H05K1/181 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin.

公开(公告)号：US09722509B2

公开(公告)日：2017-08-01

申请号：US15054233

申请日：2016-02-26

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Shigeaki Mashimo ,  Fumio Horiuchi ,  Kiyoaki Kudo ,  Akira Sakurai ,  Yuhki Inagaki

IPC分类号： H05K7/00 ,  H02M7/537 ,  H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L25/07 ,  H01L21/48 ,  H01L23/29 ,  H01L25/18 ,  H01L25/00 ,  H05K1/02 ,  H05K1/18 ,  H01L23/00

CPC分类号： H02M7/537 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20753 ,  H05K1/0203 ,  H05K1/181 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012

摘要： A circuit device comprises a circuit board and a plurality of leads each comprising an island portion, a bonding portion elevated from the island portion, and an oblique slope portion connecting the island portion and the bonding portion, and a plurality of circuit elements mounted on the island portions so as to be connected to corresponding bonding portions through wirings. Two leads are adapted to be connected to positive and negative electrodes of a direct-current power source, and yet another lead is an output lead adapted to output alternating-current power. One electrode provided on a transistor mounted on an island portion of the second input lead is connected to a bonding portion of the output lead through a wiring, and another electrode provided on a transistor mounted on an island portion of the output lead is connected to a bonding portion of the first input lead through a wiring.

公开(公告)号：US09551524B2

公开(公告)日：2017-01-24

申请号：US14251740

申请日：2014-04-14

申请人： Whirlpool Corporation

发明人： Martin Shawn Egan ,  Michael E. Stagg

IPC分类号： H05K7/00 ,  F25D23/06 ,  F25D29/00

CPC分类号： F25D23/065 ,  F25D23/061 ,  F25D23/066 ,  F25D29/005 ,  F25D2400/40 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49359 ,  Y10T428/24802

摘要： A liner for an appliance is formed by a plastic sheet formed into a three dimensional shape corresponding to at least a portion of a compartment of the appliance. A plurality of electrically conductive ink pathways are applied on a surface of the plastic sheet, and a sealer material is applied to the plastic sheet to cover said pathways.

摘要翻译： 用于器具的衬垫由形成为对应于器具的隔室的至少一部分的三维形状的塑料片形成。 多个导电油墨路​​径被施加在塑料片的表面上，并且将密封剂材料施加到塑料片以覆盖所述路径。

公开(公告)号：US20150181690A1

公开(公告)日：2015-06-25

申请号：US14516487

申请日：2014-10-16

申请人： HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION ,  YURA CORPORATION CO., LTD.

发明人： Mun Jong KIM ,  Kwan Bum LEE ,  Jin Su YEOM

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/44 ,  H05K3/46 ,  H05K3/00 ,  H05K3/06

CPC分类号： H05K1/0201 ,  H05K1/0206 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/067 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0338 ,  H05K2201/09045 ,  H05K2203/0278 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

摘要： A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.

摘要翻译： 散热印刷电路板包括金属芯，下绝缘层和上绝缘层，第一下电极图案和第一上电路图案以及第二下电路图案和第二上电路图案。 下绝缘层和上绝缘层分别设置在金属芯的下侧和上侧。 第一下电极和第一上电路图案分别设置在下绝缘层的下侧和上绝缘层的上侧。 第二下电路图案和第二上电路图案分别设置在第一下电路图案的下侧和第一上电路图案的上侧。 第一下部电路图案中的蚀刻部分填充有下部绝缘层，并且第一上部电路图案中的蚀刻部分填充有上部绝缘层。

公开(公告)号：US08399779B2

公开(公告)日：2013-03-19

申请号：US12557847

申请日：2009-09-11

申请人： Michiro Ogawa ,  Kazuhiro Kobayashi ,  Kentaro Kaneko

发明人： Michiro Ogawa ,  Kazuhiro Kobayashi ,  Kentaro Kaneko

IPC分类号： H05K1/11

CPC分类号： H05K3/188 ,  H01L21/563 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81385 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/113 ,  H05K3/205 ,  H05K3/244 ,  H05K3/282 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2203/0361 ,  Y10T29/4916 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/0401

摘要： A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.

摘要翻译： 布线板包括从最外绝缘层的开口部分露出的焊盘。 焊盘包括：第一金属层，其表面从布线板露出; 第二金属层，设置在第一金属层上，由有效防止基板内的通孔内的金属扩散入第一金属层的材料形成; 以及设置在第二金属层和通孔之间的第三金属层，并且由比第二金属层更难被氧化的材料形成。 第三金属层的厚度相对较厚，优选选择为第二金属层的厚度的三倍以上。 第三金属层的侧表面和要连接通孔的第三金属层的表面被粗糙化。

公开(公告)号：US20130039065A1

公开(公告)日：2013-02-14

申请号：US13554073

申请日：2012-07-20

申请人： YOSHIFUMI OKABE ,  HIROMITSU KURIMOTO ,  TORU WAGATSUMA

发明人： YOSHIFUMI OKABE ,  HIROMITSU KURIMOTO ,  TORU WAGATSUMA

IPC分类号： F21V21/00 ,  H05K13/04 ,  H05K13/00 ,  F21V7/00 ,  H05K3/10

CPC分类号： H05K3/202 ,  H01L2933/0066 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4916

摘要： A semiconductor light-emitting element mounting module includes a metal conductor plate including at least one connection surface formed on one side thereof, wherein a semiconductor light-emitting element is connectable to the connection surface; a pair of terminals provided away from the connection surface and which are connectable to the connection surface to be electrically conductive therewith; a surface-insulation portion formed from a resin material, wherein the surface-insulation portion covers the entire surface of the metal conductor plate except for the connection surface. The pair of terminals are connectable with a corresponding pair of terminals that are provided on another semiconductor light-emitting element mounting module.

摘要翻译： 一种半导体发光元件安装模块，包括：金属导体板，包括在其一侧形成的至少一个连接表面，其中半导体发光元件可连接到所述连接表面; 一对端子，其远离连接表面设置并且可连接到连接表面以与其导电; 由树脂材料形成的表面绝缘部分，其中表面绝缘部分覆盖除了连接表面之外的金属导体板的整个表面。 一对端子可与设置在另一个半导体发光元件安装模块上的相应的一对端子连接。

公开(公告)号：US08171628B2

公开(公告)日：2012-05-08

申请号：US13060114

申请日：2009-07-23

申请人： Hiroshi Yamazaki

发明人： Hiroshi Yamazaki

IPC分类号： H05K3/02

CPC分类号： H05K1/0366 ,  G02F1/13439 ,  G02F2202/023 ,  G02F2202/36 ,  H05K1/092 ,  H05K1/097 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/4916

摘要： A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive layer 2.

摘要翻译： 根据本发明的感光导电膜10包括支撑膜1，在支撑膜1上形成的含有导电纤维的导电层2和形成在导电层2上的感光性树脂层3。

公开(公告)号：US08048510B2

公开(公告)日：2011-11-01

申请号：US11231570

申请日：2005-09-21

申请人： Martin Shawn Egan ,  Michael E. Stagg, Jr.

发明人： Martin Shawn Egan ,  Michael E. Stagg, Jr.

IPC分类号： A47B96/04

CPC分类号： F25D23/065 ,  F25D23/061 ,  F25D23/066 ,  F25D29/005 ,  F25D2400/40 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49359 ,  Y10T428/24802

摘要： A liner for an appliance is formed by a plastic sheet formed into a three dimensional shape corresponding to at least a portion of a compartment of the appliance. A plurality of electrically conductive ink pathways are applied on a surface of the plastic sheet, and a sealer material is applied to the plastic sheet to cover said pathways.

摘要翻译： 用于器具的衬垫由形成为对应于器具的隔室的至少一部分的三维形状的塑料片形成。 多个导电油墨路​​径被施加在塑料片的表面上，并且将密封剂材料施加到塑料片以覆盖所述路径。

公开(公告)号：US20110207266A1

公开(公告)日：2011-08-25

申请号：US12938534

申请日：2010-11-03

申请人： Yong-kwan LEE ,  Tae-sung Park ,  Won-keun Kim

发明人： Yong-kwan LEE ,  Tae-sung Park ,  Won-keun Kim

IPC分类号： H01L21/56 ,  H05K3/00

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012

摘要： A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.

摘要翻译： 印刷电路板（PCB）包括通过简化PCB的结构而具有低处理成本和高产量的导线图案，并且当进行倒装芯片接合处理时可以增加微小凸块的接合特性和可靠性。 PCB包括具有下表面和上表面的主体树脂层，在主体树脂层的上表面和下表面之一上或之一上的线图形，至少一个从线图形延伸通过主体树脂层的通孔接触， 以及在主体树脂层的上表面和下表面上的阻焊剂，焊料防护层的开口对应于焊球焊盘和凸块焊盘中的至少一个，焊球焊盘和焊盘焊盘被配置为将PCB 到半导体芯片。 如果焊锡球焊盘位于单层导线图案上，则凸起焊盘在通孔接触处，如果焊盘焊盘位于焊丝图案上，则焊球焊盘位于通孔接触处。

公开(公告)号：US20110174527A1

公开(公告)日：2011-07-21

申请号：US13002189

申请日：2009-06-30

申请人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Kiyoshi Shibata

发明人： Masayuki Nagamatsu ,  Ryosuke Usui ,  Kiyoshi Shibata

IPC分类号： H05K1/11 ,  H01L23/488 ,  H05K3/34 ,  H01L21/58 ,  H05K3/10

CPC分类号： H05K1/112 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L27/14618 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1058 ,  H01L2924/014 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09436 ,  H05K2201/09563 ,  H05K2201/10734 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device is of a PoP structure such that first electrode portions provided in a first semiconductor module and second electrode portions provided in a second semiconductor module are joined together by solder balls. The first electrode has a first conductor having the same thickness as that of a wiring layer provided in an insulating layer, a second conductor formed on the first conductor, a gold plating layer provided on the second conductor.

摘要翻译： 半导体器件具有PoP结构，使得设置在第一半导体模块中的第一电极部分和设置在第二半导体模块中的第二电极部分通过焊球接合在一起。 第一电极具有与设置在绝缘层中的布线层相同厚度的第一导体，形成在第一导体上的第二导体，设置在第二导体上的镀金层。