Raney copper catalyst as well as preparation method and use thereof

    公开(公告)号:US12226758B2

    公开(公告)日:2025-02-18

    申请号:US17596425

    申请日:2020-11-11

    Abstract: A Raney copper catalyst, a preparation method and use thereof are provided. The Raney copper catalyst includes aluminum, copper and a metal promoter, wherein the metal promoter comprises a combination of one or more of Ni, Fe, Mo, Co, Ag, Pd, Pt, Au and other elements. The preparation method includes performing high-temperature melting on a mixture containing a copper/aluminum alloy and the metal promoter to obtain a mixed metal cured compound, then smashing the mixed metal cured compound to obtain a catalyst precursor, and subsequently activating to obtain the Raney copper catalyst. The Raney copper catalyst exhibits a capability on hydrogenation reaction based on synergistic effects between metal copper and different promoter metals. Compared with the Raney copper catalyst without metal promoters, when used for preparing 1,3-propanediol through hydrogenation of 3-hydroxypropionaldehyde aqueous solution, the Raney copper catalyst is higher in activity and better in stability.

    RING TRAY FOR HONEYCOMB SUBSTRATE FIRING

    公开(公告)号:US20250052500A1

    公开(公告)日:2025-02-13

    申请号:US18718912

    申请日:2022-12-01

    Abstract: A ring tray for honeycomb substrate firing, the ring tray supporting a honeycomb substrate having cell flow channels partitioned by cell walls, so that the flow channel direction is vertical during substrate firing, the ring tray including a ring-shaped frame part, a support part further inside than the frame part, and a connecting part connecting the frame part and support part, and the ring tray being configured so that when the honeycomb substrate is mounted on the ring tray, the support part does not contact an outer peripheral edge of a lower end surface of the honeycomb substrate, and contacts a portion of an internal region of the lower end surface of the honeycomb substrate, and is thus able to support the lower end of the honeycomb substrate, and the frame part and the connecting part do not contact the lower end surface of the honeycomb substrate.

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