Integration of metal nanowire network into conducting polymers

    公开(公告)号:US12157142B2

    公开(公告)日:2024-12-03

    申请号:US17754993

    申请日:2020-10-16

    Abstract: A metallic nanowire:conductive polymer composite is fabricated. A metallic nanowire layer is formed by a process that leaves an organic ligand residue on the metallic nanowire layer. A conductive polymer film is formed on a supporting substrate. The metallic nanowire layer is integrated with the conductive polymer film to form a metallic nanowire:conductive polymer composite. The metallic nanowire:conductive polymer composite is wet by a reaction solution including a source of metal ions, at least one acid, and a solvent for a period of time sufficient to remove the organic ligand residues from the metallic nanowire layer and sufficient to grow metal nanoparticles from the source of metal ions to create metal interconnections at junctions where the two or more nanowires in the metallic nanowire layer touch each other. Following growth of the nanoparticles, the nanowire:conductive polymer composite is removed from the reaction solution and dried.

    COMPOSITIONS AND METHODS FOR COATING A SUBSTRATE

    公开(公告)号:US20230347378A1

    公开(公告)日:2023-11-02

    申请号:US18192499

    申请日:2023-03-29

    Inventor: Alessandra GERLI

    Abstract: The disclosure provides methods and compositions for coating substrates. A method of coating a substrate may include applying a formulation having a metal cation to a surface of the substrate to form a treated substrate, adding a solution having a biopolymer to the treated substrate, and allowing the biopolymer and the metal cation to react to form a coated substrate. The formulation may be applied to the substrate before the solution is added. A composition may include a reaction product of a biopolymer and a metal cation. The reaction product may be disposed on a coated substrate and the coated substrate may comprise a fibrous material.

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