DIELECTRIC COATINGS
    1.
    发明申请

    公开(公告)号:US20250058351A1

    公开(公告)日:2025-02-20

    申请号:US18450622

    申请日:2023-08-16

    Abstract: Disclosed herein are coated substrates comprising a coating layer and an adhesive formed on at least a portion of the coating layer. The coating layer may be deposited from a powder coating composition and comprises a dielectric strength of at least 50 kV/mm measured according to ASTM D149-09 (voltage limit 12.0 kV DC, Imax Limit 0.1 mA, 19 sec ramp, 20 sec dwell, 2 sec fall) and a thermal conductivity of at least 0.3 W/K·m measured according to ASTM D5470 (steady-state methods). The adhesive may be formed from an adhesive composition and comprises a thermal conductivity of at least 1.0 W/K·m measured according to ASTM D5470. Also disclosed herein are systems for coating substrates. Also disclosed are methods of coating a substrate.

    METHOD FOR FABRICATING A FILM
    6.
    发明公开

    公开(公告)号:US20230347379A1

    公开(公告)日:2023-11-02

    申请号:US17608275

    申请日:2020-04-22

    Abstract: A method for fabricating a film comprising at least one polymer layer, formed of polyazulene, or of a copolymer, wherein one of the monomers is azulene, or of any combination thereof, wherein the film is situated on at least one surface of a substrate, is disclosed. The method comprises the steps of: a) forming an oxidant layer on a deposition surface by applying a solution comprising an oxidant on the deposition surface; b) forming a polymer layer formed of polyazulene, or of a copolymer, wherein one of the monomers is azulene, or of any combination thereof, by exposing the deposition surface to at least azulene monomer vapour at a polymerization temperature of 20 - 95° C. under atmospheric pressure, wherein step a) precedes step b), and wherein, during step b), the temperature of the deposition surface differs from the polymerization temperature by 0 - 30° C.

    Printed circuit nanofiber web manufacturing method

    公开(公告)号:US11324123B2

    公开(公告)日:2022-05-03

    申请号:US16606192

    申请日:2018-04-20

    Inventor: In Yong Seo

    Abstract: Provided is a method of manufacturing a printed circuit nano-fiber web. A method of manufacturing a printed circuit nano-fiber web according to an embodiment of the present invention includes (1) a step of electrospinning a spinning solution including a fiber-forming ingredient to manufacture a nano-fiber web; and (2) a step of forming a circuit pattern to coat an outer surface of nano-fiber included in a predetermined region on the nano-fiber web using an electroless plating method. According to the present invention, a circuit pattern-printed nano-fiber web having flexibility and resilience suitable for future smart devices may be realized. In addition, a circuit pattern may be densely formed to a uniform thickness on a flexible nano-fiber web using an electroless plating method, and the flexible nano-fiber web may include a plurality of pores. Accordingly, since the printed circuit nano-fiber web may satisfy waterproofness and air permeability characteristics, it can be used in various future industrial fields including medical devices, such as biopatches, and an electronic device, such as smart devices.

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